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M36W432TGZA

Description
32 Mbit 2Mb x16, Boot Block Flash Memory and 4 Mbit 256Kb x16 SRAM, Multiple Memory Product
File Size314KB,66 Pages
ManufacturerSTMicroelectronics
Websitehttp://www.st.com/
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M36W432TGZA Overview

32 Mbit 2Mb x16, Boot Block Flash Memory and 4 Mbit 256Kb x16 SRAM, Multiple Memory Product

M36W432TG
M36W432BG
32 Mbit (2Mb x16, Boot Block) Flash Memory
and 4 Mbit (256Kb x16) SRAM, Multiple Memory Product
PRELIMINARY DATA
FEATURES SUMMARY
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MULTIPLE MEMORY PRODUCT
– 32 Mbit (2Mb x 16), Boot Block, Flash Memory
– 4 Mbit (256Kb x 16) SRAM Memory
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SUPPLY VOLTAGE
– V
DDF
= 2.7V to 3.3V
– V
DDS
= V
DDQF
= 2.7V to 3.3V
– V
PPF
= 12V for Fast Program (optional)
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s
s
SRAM
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4 Mbit (256Kb x 16)
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ACCESS TIME: 70ns
LOW V
DDS
DATA RETENTION: 1.5V
POWER DOWN FEATURES USING TWO
CHIP ENABLE INPUTS
ACCESS TIME: 70ns, 85ns
LOW POWER CONSUMPTION
ELECTRONIC SIGNATURE
– Manufacturer Code: 20h
– Top Device Code, M36W432TG: 88BAh
– Bottom Device Code, M36W432BG: 88BBh
Figure 1. Package
FBGA
FLASH MEMORY
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MEMORY BLOCKS
– Parameter Blocks (Top or Bottom Location)
– Main Blocks
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Stacked LFBGA66 (ZA)
12 x 8 mm
PROGRAMMING TIME
– 10µs typical
– Double Word Programming Option
– Quadruple Word Programming Option
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BLOCK LOCKING
– All blocks locked at Power up
– Any combination of blocks can be locked
– WP
F
for Block Lock-Down
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AUTOMATIC STANDBY MODE
PROGRAM and ERASE SUSPEND
100,000 PROGRAM/ERASE CYCLES per
BLOCK
COMMON FLASH INTERFACE
SECURITY
– 128 bit user programmable OTP cells
– 64 bit unique device identifier
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November 2002
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice.
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