2 Mbit 256Kb x8, Boot Block Single Supply Flash Memory
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Parts packaging code | QFJ |
| package instruction | QCCJ, LDCC32,.5X.6 |
| Contacts | 32 |
| Reach Compliance Code | _compli |
| ECCN code | EAR99 |
| Maximum access time | 120 ns |
| Other features | 20 YEARS DATA RETENTION; 100000 PROGRAM/ERASE CYCLES; BOTTOM BOOT BLOCK |
| startup block | BOTTOM |
| command user interface | YES |
| Data polling | YES |
| Data retention time - minimum | 20 |
| Durability | 100000 Write/Erase Cycles |
| JESD-30 code | R-PQCC-J32 |
| JESD-609 code | e0 |
| length | 13.995 mm |
| memory density | 2097152 bi |
| Memory IC Type | FLASH |
| memory width | 8 |
| Number of functions | 1 |
| Number of departments/size | 1,2,1,3 |
| Number of terminals | 32 |
| word count | 262144 words |
| character code | 256000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 256KX8 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QCCJ |
| Encapsulate equivalent code | LDCC32,.5X.6 |
| Package shape | RECTANGULAR |
| Package form | CHIP CARRIER |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Programming voltage | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 3.56 mm |
| Department size | 16K,8K,32K,64K |
| Maximum standby current | 0.0001 A |
| Maximum slew rate | 0.02 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| switch bit | YES |
| type | NOR TYPE |
| width | 11.455 mm |
| Base Number Matches | 1 |