IC SERIAL INPUT LOADING, 1.8 us SETTLING TIME, 8-BIT DAC, CDIP20, CERAMIC, DIP-20, Digital to Analog Converter
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| package instruction | DIP, DIP20,.3 |
| Reach Compliance Code | unknown |
| ECCN code | 3A001.A.2.C |
| Converter type | D/A CONVERTER |
| Enter bit code | BINARY |
| Input format | SERIAL |
| JESD-30 code | R-GDIP-T20 |
| JESD-609 code | e0 |
| length | 24.51 mm |
| Maximum linear error (EL) | 0.4% |
| Number of digits | 8 |
| Number of functions | 1 |
| Number of terminals | 20 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP20,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 5.08 mm |
| Maximum stabilization time | 3 µs |
| Nominal settling time (tstl) | 1.8 µs |
| Maximum slew rate | 19 mA |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |
| Base Number Matches | 1 |
| DAC0854CMJ | |
|---|---|
| Description | IC SERIAL INPUT LOADING, 1.8 us SETTLING TIME, 8-BIT DAC, CDIP20, CERAMIC, DIP-20, Digital to Analog Converter |
| Is it Rohs certified? | incompatible |
| package instruction | DIP, DIP20,.3 |
| Reach Compliance Code | unknown |
| ECCN code | 3A001.A.2.C |
| Converter type | D/A CONVERTER |
| Enter bit code | BINARY |
| Input format | SERIAL |
| JESD-30 code | R-GDIP-T20 |
| JESD-609 code | e0 |
| length | 24.51 mm |
| Maximum linear error (EL) | 0.4% |
| Number of digits | 8 |
| Number of functions | 1 |
| Number of terminals | 20 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP20,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 5.08 mm |
| Maximum stabilization time | 3 µs |
| Nominal settling time (tstl) | 1.8 µs |
| Maximum slew rate | 19 mA |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |
| Base Number Matches | 1 |
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