TMS320DM643GNZ600 datasheet, PDF

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Datasheet> All Categories > The embedded processor and controller> Microcontrollers and processors> TMS320DM643GNZ600

TMS320DM643GNZ600: Description64-BIT, 133MHz, OTHER DSP, PBGA548, 27 X 27 MM, 1 MM PITCH, PLASTIC, BGA-548; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，164 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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TMS320DM643GNZ600 Overview

64-BIT, 133MHz, OTHER DSP, PBGA548, 27 X 27 MM, 1 MM PITCH, PLASTIC, BGA-548

TMS320DM643GNZ600 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Parts packaging code	BGA
package instruction	BGA, BGA548,26X26,40
Contacts	548
Reach Compliance Code	compliant
ECCN code	3A001.A.3
Factory Lead Time	1 week
Other features	ALSO REQUIRES 3.3V SUPPLY
Address bus width	20
barrel shifter	NO
bit size	32
boundary scan	YES
maximum clock frequency	133 MHz
External data bus width	64
Format	FIXED POINT
Internal bus architecture	MULTIPLE
JESD-30 code	S-PBGA-B548
JESD-609 code	e0
length	27 mm
low power mode	YES
Humidity sensitivity level	4
Number of terminals	548
Maximum operating temperature	90 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA548,26X26,40
Package shape	SQUARE
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	220
power supply	1.4,3.3 V
Certification status	Not Qualified
RAM (number of words)	16384
Maximum seat height	2.8 mm
Maximum supply voltage	1.44 V
Minimum supply voltage	1.36 V
Nominal supply voltage	1.4 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal surface	TIN LEAD
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	27 mm
uPs/uCs/peripheral integrated circuit type	DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches	1

TMS320DM643GNZ600 Related Products

	TMS320DM643GNZ600	TMS320DM643ZNZ500	TMS320DM643GDK500	TMS320DM643GDK600	TMS320DM643GNZ500
Description	64-BIT, 133MHz, OTHER DSP, PBGA548, 27 X 27 MM, 1 MM PITCH, PLASTIC, BGA-548	Video/Imaging Fixed-Point Digital Signal Processor 548-FCBGA	64-BIT, 100MHz, OTHER DSP, PBGA548, 23 X 23 MM, 0.80 MM PITCH, PLASTIC, BGA-548	Video/Imaging Fixed-Point Digital Signal Processor 548-FC/CSP	IC 64-BIT, 100 MHz, OTHER DSP, PBGA548, 27 X 27 MM, 1 MM PITCH, PLASTIC, BGA-548, Digital Signal Processor
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	conform to	incompatible	incompatible	incompatible
Parts packaging code	BGA	BGA	BGA	BGA	BGA
package instruction	BGA, BGA548,26X26,40	BGA, BGA548,26X26,40	FBGA, BGA548,26X26,32	FBGA, BGA548,26X26,32	BGA, BGA548,26X26,40
Contacts	548	548	548	548	548
Reach Compliance Code	compliant	compliant	compliant	not_compliant	not_compliant
barrel shifter	NO	NO	NO	NO	NO
bit size	32	32	32	32	32
boundary scan	YES	YES	YES	YES	YES
maximum clock frequency	133 MHz	50 MHz	100 MHz	133 MHz	100 MHz
Format	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT
Internal bus architecture	MULTIPLE	SINGLE	MULTIPLE	MULTIPLE	MULTIPLE
JESD-30 code	S-PBGA-B548	S-PBGA-B548	S-PBGA-B548	S-PBGA-B548	S-PBGA-B548
length	27 mm	27 mm	23 mm	23 mm	27 mm
low power mode	YES	YES	YES	YES	YES
Number of terminals	548	548	548	548	548
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA	FBGA	FBGA	BGA
Encapsulate equivalent code	BGA548,26X26,40	BGA548,26X26,40	BGA548,26X26,32	BGA548,26X26,32	BGA548,26X26,40
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH	GRID ARRAY
Peak Reflow Temperature (Celsius)	220	NOT SPECIFIED	220	220	220
power supply	1.4,3.3 V	1.2,3.3 V	1.2,3.3 V	1.4,3.3 V	1.2,3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM (number of words)	16384	4096	16384	16384	16384
Maximum seat height	2.8 mm	2.8 mm	2.8 mm	2.8 mm	2.8 mm
Maximum supply voltage	1.44 V	1.26 V	1.26 V	1.44 V	1.26 V
Minimum supply voltage	1.36 V	1.14 V	1.14 V	1.36 V	1.14 V
Nominal supply voltage	1.4 V	1.2 V	1.2 V	1.4 V	1.2 V
surface mount	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Terminal form	BALL	BALL	BALL	BALL	BALL
Terminal pitch	1 mm	1 mm	0.8 mm	0.8 mm	1 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	27 mm	27 mm	23 mm	23 mm	27 mm
uPs/uCs/peripheral integrated circuit type	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER
ECCN code	3A001.A.3	-	3A001.A.3	3A001.A.3	3A001.A.3
Other features	ALSO REQUIRES 3.3V SUPPLY	-	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY	ALSO REQUIRES 3.3V SUPPLY
Address bus width	20	-	20	20	20
External data bus width	64	-	64	64	64
JESD-609 code	e0	-	e0	e0	e0
Humidity sensitivity level	4	-	4	4	4
Maximum operating temperature	90 °C	-	90 °C	90 °C	90 °C
Temperature level	OTHER	-	OTHER	OTHER	OTHER
Terminal surface	TIN LEAD	-	TIN LEAD	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Base Number Matches	1	1	1	-	-

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