16-BIT, 10MHz, MICROPROCESSOR, CPGA68, CERAMIC, PGA-68
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Parts packaging code | PGA |
| package instruction | CERAMIC, PGA-68 |
| Contacts | 68 |
| Reach Compliance Code | compli |
| Address bus width | 20 |
| bit size | 16 |
| boundary scan | NO |
| maximum clock frequency | 10 MHz |
| External data bus width | 16 |
| Format | FIXED POINT |
| Integrated cache | NO |
| JESD-30 code | S-CPGA-P68 |
| JESD-609 code | e0 |
| length | 29.46 mm |
| low power mode | NO |
| Number of terminals | 68 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | PGA |
| Encapsulate equivalent code | PGA68,11X11 |
| Package shape | SQUARE |
| Package form | GRID ARRAY |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 4.57 mm |
| speed | 10 MHz |
| Maximum slew rate | 600 mA |
| Maximum supply voltage | 5.5 V |
| Minimum supply voltage | 4.5 V |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | MOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | PIN/PEG |
| Terminal pitch | 2.54 mm |
| Terminal location | PERPENDICULAR |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 29.46 mm |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR |
| Base Number Matches | 1 |
| TA80186-10 | R80186-10 | QR80186-10 | N80186-10 | QA80186-10 | |
|---|---|---|---|---|---|
| Description | 16-BIT, 10MHz, MICROPROCESSOR, CPGA68, CERAMIC, PGA-68 | 16-BIT, 10MHz, MICROPROCESSOR, CQCC68, CERAMIC, LCC-68 | 16-BIT, 10MHz, MICROPROCESSOR, CQCC68, CERAMIC, LCC-68 | 16-BIT, 10MHz, MICROPROCESSOR, PQCC68, PLASTIC, LCC-68 | 16-BIT, 10MHz, MICROPROCESSOR, CPGA68, CERAMIC, PGA-68 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
| Parts packaging code | PGA | LCC | LCC | LCC | PGA |
| package instruction | CERAMIC, PGA-68 | CERAMIC, LCC-68 | CERAMIC, LCC-68 | QCCJ, LDCC68,1.0SQ | PGA, PGA68,11X11 |
| Contacts | 68 | 68 | 68 | 68 | 68 |
| Reach Compliance Code | compli | compli | compliant | unknown | compliant |
| Address bus width | 20 | 20 | 20 | 20 | 20 |
| bit size | 16 | 16 | 16 | 16 | 16 |
| boundary scan | NO | NO | NO | NO | NO |
| maximum clock frequency | 10 MHz | 10 MHz | 10 MHz | 10 MHz | 10 MHz |
| External data bus width | 16 | 16 | 16 | 16 | 16 |
| Format | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
| Integrated cache | NO | NO | NO | NO | NO |
| JESD-30 code | S-CPGA-P68 | S-CQCC-N68 | S-CQCC-N68 | S-PQCC-J68 | S-CPGA-P68 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 |
| length | 29.46 mm | 24.13 mm | 24.13 mm | 24.2 mm | 29.46 mm |
| low power mode | NO | NO | NO | NO | NO |
| Number of terminals | 68 | 68 | 68 | 68 | 68 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | PGA | QCCN | QCCN | QCCJ | PGA |
| Encapsulate equivalent code | PGA68,11X11 | LCC68A,.95SQ | LCC68A,.95SQ | LDCC68,1.0SQ | PGA68,11X11 |
| Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| Package form | GRID ARRAY | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | GRID ARRAY |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 4.57 mm | 3.68 mm | 3.68 mm | 4.83 mm | 4.57 mm |
| speed | 10 MHz | 10 MHz | 10 MHz | 10 MHz | 10 MHz |
| Maximum slew rate | 600 mA | 550 mA | 550 mA | 550 mA | 550 mA |
| Maximum supply voltage | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | YES | YES | NO |
| technology | MOS | MOS | MOS | MOS | MOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | PIN/PEG | NO LEAD | NO LEAD | J BEND | PIN/PEG |
| Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| Terminal location | PERPENDICULAR | QUAD | QUAD | QUAD | PERPENDICULAR |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 29.46 mm | 24.13 mm | 24.13 mm | 24.2 mm | 29.46 mm |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR |
| Maker | - | - | Intel | Intel | Intel |
京公网安备 11010802033920号
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