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BLF6G38LS-50

Description
S BAND, Si, N-CHANNEL, RF POWER, MOSFET
CategoryDiscrete semiconductor    The transistor   
File Size78KB,12 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
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BLF6G38LS-50 Overview

S BAND, Si, N-CHANNEL, RF POWER, MOSFET

BLF6G38LS-50 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerNXP
package instructionROHS COMPLIANT, CERAMIC PACKAGE-2
Contacts2
Reach Compliance Codeunknow
ECCN codeEAR99
Shell connectionSOURCE
ConfigurationSINGLE
Minimum drain-source breakdown voltage65 V
Maximum drain current (ID)16.5 A
FET technologyMETAL-OXIDE SEMICONDUCTOR
highest frequency bandS BAND
JESD-30 codeR-CDFP-F2
Number of components1
Number of terminals2
Operating modeENHANCEMENT MODE
Package body materialCERAMIC, METAL-SEALED COFIRED
Package shapeRECTANGULAR
Package formFLATPACK
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Polarity/channel typeN-CHANNEL
Certification statusNot Qualified
surface mountYES
Terminal formFLAT
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
transistor applicationsAMPLIFIER
Transistor component materialsSILICON
BLF6G38-50; BLF6G38LS-50
WiMAX power LDMOS transistor
Rev. 01 — 12 February 2008
Preliminary data sheet
1. Product profile
1.1 General description
50 W LDMOS power transistor for base station applications at frequencies from
3400 MHz to 3800 MHz.
Table 1.
Typical performance
Typical RF performance at T
case
= 25
°
C in a class-AB production test circuit.
Mode of operation
1-carrier N-CDMA
[2]
[1]
[2]
[3]
f
(MHz)
3400 to 3600
V
DS
P
L(AV)
(V)
28
(W)
9
P
L(M)[1]
G
p
(W)
70
14
η
D
23
ACPR
885k
ACPR
1980k
(dBc)
−64
[3]
−49
[3]
(dB) (%) (dBc)
P
L(M)
stands for peak output power.
Single carrier N-CDMA with pilot, paging, sync and 6 traffic channels (Walsh codes 8 - 13). PAR = 9.7 dB at
0.01 % probability on the CCDF. Channel bandwidth is 1.23 MHz.
Measured within 30 kHz bandwidth.
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken
during transport and handling.
1.2 Features
I
Typical 1-carrier N-CDMA performance (Single carrier N-CDMA with pilot, paging,
sync and 6 traffic channels [Walsh codes 8 - 13]. PAR = 9.7 dB at 0.01 % probability
on the CCDF. Channel bandwidth is 1.23 MHz) at a frequency of 3400 MHz, 3500 MHz
and 3600 MHz, a supply voltage of 28 V, an I
Dq
of 450 mA, a power gain of 14 dB, a
drain efficiency of 23 % and a peak output power of 70 W:
I
Qualified up to a maximum V
DS
operation of 32 V
I
Suitable for operation in the 3.4 GHz to 3.8 GHz frequency range
I
Integrated ESD protection
I
Excellent ruggedness
I
High efficiency
I
Excellent thermal stability
I
Designed for broadband operation
I
Internally matched for ease of use
I
Low gold plating thickness on leads

BLF6G38LS-50 Related Products

BLF6G38LS-50 BLF6G38-50
Description S BAND, Si, N-CHANNEL, RF POWER, MOSFET S BAND, Si, N-CHANNEL, RF POWER, MOSFET
Is it lead-free? Lead free Lead free
Is it Rohs certified? conform to conform to
Maker NXP NXP
package instruction ROHS COMPLIANT, CERAMIC PACKAGE-2 ROHS COMPLIANT, CERAMIC PACKAGE-2
Contacts 2 2
Reach Compliance Code unknow unknow
ECCN code EAR99 EAR99
Shell connection SOURCE SOURCE
Configuration SINGLE SINGLE
Minimum drain-source breakdown voltage 65 V 65 V
Maximum drain current (ID) 16.5 A 16.5 A
FET technology METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
highest frequency band S BAND S BAND
JESD-30 code R-CDFP-F2 R-CDFM-F2
Number of components 1 1
Number of terminals 2 2
Operating mode ENHANCEMENT MODE ENHANCEMENT MODE
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package shape RECTANGULAR RECTANGULAR
Package form FLATPACK FLANGE MOUNT
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED
Polarity/channel type N-CHANNEL N-CHANNEL
Certification status Not Qualified Not Qualified
surface mount YES YES
Terminal form FLAT FLAT
Terminal location DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED
transistor applications AMPLIFIER AMPLIFIER
Transistor component materials SILICON SILICON
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