AMERICAN BRIGHT
OPTOELECTRONICS CORP.
Z-BEND DOMILED GaP 10mA BL-PDP-GRS-C10
•
Feature:
1. Surface mount LED.
2. 120° viewing angle.
3. Small package outline (LxWxH) of 3.2 x 2.8 x 1.8 mm.
4. Qualified according to JEDEC moisture sensitivity Level 2.
5. Compatible to both IR reflow soldering and TTW soldering.
•
Package Dimension:
Recommended Solder Pad
V.4 Page: 1 of 5
AMERICAN BRIGHT
OPTOELECTRONICS CORP.
•
Z-BEND DOMILED GaP 10mA BL-PDP-GRS-C10
Optical Characteristics:
Part Number
BL-PDP-GRS-C10
BIN G1
BIN G2
BIN H1
BIN H2
Chip Technology
Color
GaP /
Green, 560nm
Luminous Intensity @ IF = 10mA
Iv (mcd)
1.80 – 4.50
1.80 – 2.24
2.24 – 2.80
2.80 – 3.55
3.55 – 4.50
Forward voltage
@ If=10 mA.
2.05 V (typ.); 2.45 V (max)
Chip Type
GaP
Viewing Angle
at 50% Iv
120°
Reverse current, I
R
@ V
R
= 5V, (max)
100
µA
Note:
1. Other luminous intensity groups are also available upon request.
2. Luminous intensity is measured with an accuracy of
±11%.
3. Wavelength binning is carried for all units as per the wavelength-binning table. Only one
wavelength group is allowed for each reel.
4. An optional Vf binning is also available upon request. Binning scheme is as per following table.
•
Absolute Maximum Ratings:
Parameter
DC forward current.
Peak pulse current; (tp
≤
10
µs,
Duty cycle = 0.005)
Reverse voltage.
LED junction temperature.
Operating temperature.
Storage temperature.
Power dissipation ( at room temperature )
Maximum Value
30
500
5
100
-40 … +100
-40 … +100
75
Unit
mA
mA
V
°C
°C
°C
mW
•
Vf Binning:
Vf Bin @ 10mA
01
02
03
04
Forward voltage (V)
1.25 … 1.55
1.55 … 1.85
1.85 … 2.15
2.15 … 2.45
Forward voltage, Vf is measured with an accuracy of
±0.1
V.
V.4 Page: 2 of 5
AMERICAN BRIGHT
OPTOELECTRONICS CORP.
Z-BEND DOMILED GaP 10mA BL-PDP-GRS-C10
•
Wavelength Grouping:
Color
BL-PDP; Pure Green
Group
Full
W
X
Y
Z
Wavelength distribution (nm)
552.5 – 564.5
552.5 – 555.5
555.5 – 558.5
558.5 – 561.5
561.5 – 564.5
Wavelength is measured with an accuracy of
±1
nm.
•
Typical electro-optical characteristics curves:
Fig.1 Relative luminous intensity vs. forward current.
Intensity vs. DC Forw ard Current
Relative intensity. Normalized at 10 mA.
4.0
35
Fig.2 Forward current vs. forward voltage.
Forward Current vs. Forward Voltage
Forward Current (mA)
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0
5
10
15
20
25
30
35
FORW ARD CURRENT (m A)
30
25
20
15
10
5
0
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
2.6
Forward Voltage (V)
Fig.3 Radiation pattern.
30°
20°
10°
0°
1.0
35
Fig.4 Maximum forward current vs. temperature.
30
40°
0.8
25
Forward Current, If
20
50°
0.6
15
60°
70°
80°
90°
0.4
10
5
0.2
0
0
10
20
30
40
50
60
70
80
90
100
Ambient Temperature
0
V.4 Page: 3 of 5
AMERICAN BRIGHT
OPTOELECTRONICS CORP.
Z-BEND DOMILED GaP 10mA BL-PDP-GRS-C10
Fig.6 Recommended IR-reflow Soldering Profile (acc. to IPC 9501).
Classification Reflow Profile (JEDEC J-STD-020B)
275
250
225
Ramp-up
3
o
C/sec
60-150s
235-240
o
C
10 30s
Temperature (
o
C)
200
175
150
125
100
75
50
25
0
183
o
C
Ramp-
down
Preheat
60-
360s max
50
100
150
200
Time (sec)
Fig.7 Recommended TTW Soldering Profile (acc. to CECC 00802).
V.4 Page: 4 of 5
AMERICAN BRIGHT
OPTOELECTRONICS CORP.
Z-BEND DOMILED GaP 10mA BL-PDP-GRS-C10
•
Taping And Orientation:
Reels come in quantity of 2000 units.
Reel diameters is 180 mm
V.4 Page: 5 of 5
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