Flash Module, 1MX32, 120ns, CQFP68,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Reach Compliance Code | unknown |
| Maximum access time | 120 ns |
| startup block | BOTTOM |
| Data polling | NO |
| JESD-30 code | S-XQFP-G68 |
| JESD-609 code | e0 |
| memory density | 33554432 bit |
| Memory IC Type | FLASH MODULE |
| memory width | 32 |
| Number of departments/size | 1,2,1,7 |
| Number of terminals | 68 |
| word count | 1048576 words |
| character code | 1000000 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 1MX32 |
| Package body material | CERAMIC |
| encapsulated code | QFP |
| Encapsulate equivalent code | QFP68,.99SQ,50 |
| Package shape | SQUARE |
| Package form | FLATPACK |
| Parallel/Serial | PARALLEL |
| power supply | 5 V |
| Certification status | Not Qualified |
| Department size | 16K,8K,96K,128K |
| Maximum standby current | 0.0001 A |
| Maximum slew rate | 0.3 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | HYBRID |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| switch bit | NO |
| type | NOR TYPE |
| write protect | HARDWARE |
| Base Number Matches | 1 |
| WF1M32BP-120G2TC5 | WF1M32BP-120G2TM5 | WF1M32BP-120G2TI5 | WF1M32BP-100G2TM5 | WF1M32BP-100G2TC5 | WF1M32BP-100G2TI5 | |
|---|---|---|---|---|---|---|
| Description | Flash Module, 1MX32, 120ns, CQFP68, | Flash Module, 1MX32, 120ns, CQFP68, | Flash Module, 1MX32, 120ns, CQFP68, | Flash Module, 1MX32, 100ns, CQFP68, | Flash Module, 1MX32, 100ns, CQFP68, | Flash Module, 1MX32, 100ns, CQFP68, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| Maximum access time | 120 ns | 120 ns | 120 ns | 100 ns | 100 ns | 100 ns |
| startup block | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| Data polling | NO | NO | NO | NO | NO | NO |
| JESD-30 code | S-XQFP-G68 | S-XQFP-G68 | S-XQFP-G68 | S-XQFP-G68 | S-XQFP-G68 | S-XQFP-G68 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| memory density | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit |
| Memory IC Type | FLASH MODULE | FLASH MODULE | FLASH MODULE | FLASH MODULE | FLASH MODULE | FLASH MODULE |
| memory width | 32 | 32 | 32 | 32 | 32 | 32 |
| Number of departments/size | 1,2,1,7 | 1,2,1,7 | 1,2,1,7 | 1,2,1,7 | 1,2,1,7 | 1,2,1,7 |
| Number of terminals | 68 | 68 | 68 | 68 | 68 | 68 |
| word count | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
| character code | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
| Maximum operating temperature | 70 °C | 125 °C | 85 °C | 125 °C | 70 °C | 85 °C |
| Minimum operating temperature | - | -55 °C | -40 °C | -55 °C | - | -40 °C |
| organize | 1MX32 | 1MX32 | 1MX32 | 1MX32 | 1MX32 | 1MX32 |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | QFP | QFP | QFP | QFP | QFP | QFP |
| Encapsulate equivalent code | QFP68,.99SQ,50 | QFP68,.99SQ,50 | QFP68,.99SQ,50 | QFP68,.99SQ,50 | QFP68,.99SQ,50 | QFP68,.99SQ,50 |
| Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| Package form | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Department size | 16K,8K,96K,128K | 16K,8K,96K,128K | 16K,8K,96K,128K | 16K,8K,96K,128K | 16K,8K,96K,128K | 16K,8K,96K,128K |
| Maximum standby current | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A |
| Maximum slew rate | 0.3 mA | 0.3 mA | 0.3 mA | 0.3 mA | 0.3 mA | 0.3 mA |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | YES | YES | YES |
| technology | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID |
| Temperature level | COMMERCIAL | MILITARY | INDUSTRIAL | MILITARY | COMMERCIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| switch bit | NO | NO | NO | NO | NO | NO |
| type | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE |
| write protect | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
| Maker | - | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation | White Electronic Designs Corporation |