White Electronic Designs
W7G1M32SVx-BN
W7G21M32SVx-BN
PRELIMINARY*
8MB/4MB (2x1Mx32 / 1Mx32) CMOS, Boot Sector Flash
Memory Module
DESCRIPTION
The W7G1M32SVx-BN and W7G21M32SVx-BN are
organized as one and two banks of 1Mx32 respectively.
The modules are based on AMDs AM29LV160DT - 1Mx16
or STs M29W160ET (optional) Flash device in TSOP
packages which are mounted on an FR4 substrate.
Both modules offer access times between 70 and 120ns
allowing for operation of high-speed microprocessors
without wait states.
Embedded Erase Algorithms
• Automatically preprograms and erases the chip
or any combination of sectors
Embedded Program Algorithms
• Automatically programs and verifies data at
specified address
Data Polling and Toggle Bit feature for detection of
program or erase cycle completion
Low Power Dissipation
• 30mA per Device Active Current
• 10μA per Device CMOS Standby Current
Single 3.3V ±10% Supply
CMOS and TTL Compatible Inputs and Outputs
Commercial and industrial operating temperature
range
• BNC = 0°C to 70°C Commercial
• BNI = -40°C to 85°C Industrial
Package
• 80 Pin SIMM (JEDEC) Standard
* This product is under development, is not qualified or characterized and is subject to
change without notice.
FEATURES
1Mx32 and 2x1Mx32 Densities
Based on AMD – AM29LV160DT Flash Device
STs M29W160ET (optional)
Fast Read Access Time – 70ns
3.3V Only Reprogramming
Flexible, Sector Architecture
• One 16Kbyte, two 8Kbyte, one 32Kbyte and
thirty-one 64Kbyte sectors.
• Any combination of sectors can be erased
• Also supports full chip erase
Top boot block configurations
• Bottom boot block optional. Contact WEDC.
FIG. 1 – BLOCK DIAGRAMS
W7G1M32SVx-BN: 1Mx32 80 PIN SIMM
WE2#
1Mx16
WE#
DQ0-15
CE#
CE#
Addr
0-19
W7G21M32SVx-BN: 2x1Mx32 80 PIN SIMM
WE2#
1Mx16
WE#
DQ0-15
CE#
CE#
Addr
0-19
1Mx16
WE#
DQ0-15
1Mx16
WE#
CE#
CE#
Addr
0-19
DQ16-31
DQ16-31
WE0#
1Mx16
WE#
DQ0-15
CE#
CE#
WE0#
DQ0-15
CE#
CE#
DQ0-15
Addr
0-19
1Mx16
WE#
DQ0-15
CE#
CE#
DQ0-15
Addr
0-19
CE0#
CE0#
CE1#
OE#
Addr
0-19
OE#
Addr 0-19
Addr 0-19
Feb. 2004
Rev. 2
1
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
White Electronic Designs
W7G1M32SVx-BN
W7G21M32SVx-BN
PRELIMINARY
FIGURE 2 – DECOUPLING CAPACITORS ARE PROVIDED FOR IMPROVED NOISE IMMUNITY.
V
CC
1
1
1
1
1
1
1
C1
.1 µF
2
C2
.1 µF
2
C3
.1 µF
2
C4
.1 µF
2
C5
.1 µF
2
C6
.1 µF
2
C7
.1 µF
2
C8
.1 µF
2
Notes:
Unless otherwise specified.
1. Population Configuration for 1M x 32 Version
Part Number
Configuration
W7G1M32SVxxxBNX
1M x 32
2. Population Configuration for 2 x 1M x 32 Version
Part Number
Configuration
W7G21M32SVxxxBNX 2 x 1M x 32
xx = Speed: 70, 90, 120ns
X = Temerature Range
Please refer to part number matrix pg. 8 or 9
Component
1M x 8
Component
1M x 8
Feb. 2004
Rev. 2
2
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
1
White Electronic Designs
W7G1M32SVx-BN
W7G21M32SVx-BN
PRELIMINARY
FIGURE 3 – W7G1M32SVxxxBNX & W7G21M32SVxxxBNX PIN CONFIGURATION
Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
Symbol
GND
V
CC
NC
OE#
WE0#
NC
NC*
DQ16
DQ17
DQ18
DQ19
DQ20
DQ21
DQ22
DQ23
DQ24
DQ25
DQ26
DQ27
DQ28
Pin
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
Symbol
CE3
CE2
CE1
CE0
GND
DQ29
DQ30
DQ31
WE2#
NC
NC
NC
A19
A18
A17
A16
A15
A14
A13
A12
Pin
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
Symbol
A11
A10
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
NC
GND
DQ15
DQ14
DQ13
DQ12
DQ11
DQ10
Pin
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
Symbol
DQ9
DQ8
DQ7
DQ6
DQ5
DQ4
DQ3
DQ2
DQ1
DQ0
NC
V
CC
PD1
PD2
PD3
PD4
PD5
PD6
PD7
GND
Notes:
Unless otherwise specified.
1. Population Configuration for 1M x 32 Version
Part Number
Configuration
W7G1M32SVxxxBNX
1M x 32
2. Population Configuration for 2 x 1M x 32 Version
Part Number
Configuration
W7G21M32SVxxxBNX 2 x 1M x 32
xx = Speed: 70, 90, 120ns
X = Temerature Range
Please refer to part number matrix pg. 8 or 9
PIN NAMES
Component
1M x 8
Component
1M x 8
A0 - A19
DQ0 - DQ31
CE1#, CE2#
WE0#, WE2#
OE#
V
CC
NC
PD
GND
Address
Data Input/Output
Chip Enable
Write Enable
Output Enable
Power Supply
No Connection
Presence Detect
Ground
NC* = Pin 7 can offer custom module options. For optional "Reset" or
"Ready Busy." Contact WEDC.
Feb. 2004
Rev. 2
3
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
White Electronic Designs
W7G1M32SVx-BN
W7G21M32SVx-BN
PRELIMINARY
PRESENCE DETECT TRUTH TABLE
Module Organization
1M x 32
2 x 1M x 32
PD1
1
0
PD2
0
1
PD3
1
0
PD4
0
0
MODULE SPEED IDENTIFICATION PRESENCE DETECT PIN
Speed
70 ns
90 ns
120 ns
PD5
0
1
0
PD6
0
1
1
PD7
1
0
0
LEGEND: 0 = Connected to GND
1 = Open circuit (no connection)
CAPACITANCE
f = 1.0MH
Z
, V
IN
= V
CC
or V
SS
Parameter
Address Lines
Data lines
Chip & Write Enable Lines
Output Enable lines
Symbol
CA
CDQ
CC
CG
1Meg
Max
35
15
15
35
2x1Meg
Max
70
30
30
70
Unit
pF
pF
pF
pF
Feb. 2004
Rev. 2
4
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
White Electronic Designs
W7G1M32SVx-BN
W7G21M32SVx-BN
PRELIMINARY
ABSOLUTE MAXIMUM RATINGS
Storage Temperature
Plastic Packages ................................. –65°C to +150°C
Ambient Temperature
with Power Applied ............................... –65°C to +125°C
Voltage with Respect to Ground
V
CC
(Note 1) ...................................... –0.5 V to +4.0 V
A9, OE#, and RESET# (Note 2)....... –0.5 V to +12.5 V
All other pins (Note 1) .................. –0.5 V to V
CC
+0.5 V
Output Short Circuit Current (Note 3) ................. 200 mA
Notes:
1.
Minimum DC voltage on input or I/O pins is –0.5 V. During voltage transitions,
input or I/O pins may overshoot VSS to –2.0 V for periods of up to 20 ns. See
Figure 7. Maximum DC voltage on input or I/O pins is VCC +0.5 V. During voltage
transitions, input or I/O pins may overshoot to VCC +2.0 V for periods up to 20
ns. See Figure 8.
2.
Minimum DC input voltage on pins A9, OE#, and RESET# is -0.5 V. During
voltage transitions, A9, OE#, and RESET# may overshoot VSS to –2.0 V for
periods of up to 20 ns. See Figure 7. Maximum DC input voltage on pin A9 is
+12.5 V which may overshoot to 14.0 V for periods up to 20 ns.
3.
No more than one output may be shorted to ground at a time. Duration of the
short circuit should not be greater than one second.
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent
damage to the device. This is a stress rating only; functional operation of the device at
these or any other conditions above those indicated in the operational sections of this
data sheet is not implied. Exposure of the device to absolute maximum rating conditions
for extended periods may affect device reliability.
OPERATING RANGES
Commercial (C) Devices
Ambient Temperature (TA) ........................ 0°C to +70°C
Industrial (I) Devices
Ambient Temperature (TA) .................... –40°C to +85°C
V
CC
Supply Voltages
V
CC
for all devices .................................... 2.7 V to 3.6 V
Operating ranges define those limits between which the functionality of the device is
guaranteed.
Feb. 2004
Rev. 2
5
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
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