REVISION M
DO NOT
SCALE FROM
THIS PRINT
ASO (USED FOR APPLICATION SPECIFIC ONLY)
(No OF POSITIONS x .01969[.5000])
+ .6368[16.175] REF
(No OF POSITIONS x .01969[.5000])
+ .2068[5.253] REF
(No OF POS -1) x .01969[.5000]
.1132 2.876 REF
02
BSH-XXX-01-X-D-EMX
EDGE MOUNT THICKNESS
-EM2: .064[1.63] +/-.004 PCB
(USE BSH-XXX-01-D-EM2 & C-162-01-X-2)
*-EM3: (USE BSH-XXX-01-D-EM3
& C-162-02-X-2)
ROW SPECIFICATION
-D: DOUBLE (USE BSH-XXX-01-D-EMX)
PLATING SPECIFICATION
-L: LIGHT SELECTIVE GOLD WITH MATTE TIN TAILS
(USE C-162-XX-L-2)
-F: FLASH SELECTIVE GOLD WITH MATTE TIN TAILS
(USE C-162-XX-F-2)
-H: HEAVY GOLD
(USE C-162-XX-H-2)
No OF POSITIONS (PER ROW)
-030, -060, -090,
**-120, **-150, **-180
LEAD STYLE
-01
* = SEE NOTE 10.
** = SEE NOTE 11.
.2664 6.767
01
.245 6.223
REF
.215 5.461 REF
.285 7.239 REF
.175 4.445 REF
.1180
- .0000
2.997
+.0040
+0.102
0.000
BSH-XXX-01-D-EM2
BSH-XXX-01-D-EM3
C-162-02-X
"A"
.120 3.048 REF
C-162-01-X
.238 6.05
REF
"A"
.120 3.05
REF
.0060 0.152 REF
.1883 4.782 REF
.0660±.0030 1.676±0.076
.0920±.0030 2.337±0.076
EDGE MOUNT THICKNESS
-EM3:
SEE NOTE 10
(DIFFERENT AS SHOWN, OTHERWISE
EDGE MOUNT THICKNESS
-EM2: .064[1.63] +/-.004 PCB
NOTES:
SECTION "A-A"
SECTION "A-A"
2 MAX SWAY
(TYP)
.100 2.54
REF
.040 1.02 REF
.140 3.556 REF
SAME AS -EM2 PCB THICKNESS)
1.
C
REPRESENTS A CRITICAL DIMENSION.
2. CONTACT RETENTION: 4 OZ MIN.
3. DELETED.
4. PARTS ARE "MOLD TO POSITION".
5. MAX VARIANCE OF .002.
6. -L PLATING CAN BE SUBSTITUTED FOR -F PLATING.
7. NOTE DELETED.
8. BOARD THICKNESS TO BE MEASURED FROM SOLDER
PAD TO SOLDER PAD.
9. SEE http://www.samtec.com/processing/edgemt_tectalk/index.htm
FOR INFORMATION ON PROCESSING EDGE MOUNT PARTS TO BOARDS.
10. -EM3 IS NOT A STANDARD OFFERING; AVAILABLE AS AN ASP ONLY.
PLEASE CONTACT SAMTEC INTERCONNECT PROCESSING GROUP WITH ORDER INQUIRIES.
11. FOR NEW APPLICATIONS REQUIRING THESE POSITIONS, PLEASE CONTACT SAMTEC
INTERCONNECT PROCESSING GROUP.
PACKAGING VIEW
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN INCHES.
TOLERANCES ARE:
DECIMALS
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
.XX: .01[.3]
.XXX: .005[.13]
.XXXX: .0020[.051]
ANGLES
2
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733
FAX: 812-948-5047
e-Mail: info@SAMTEC.com
code: 55322
DESCRIPTION:
DWG. NO.
MATERIAL:
DO NOT SCALE DRAWING
SHEET SCALE: 1.5:1
TUBE: PT-1-24-02-38
PLUG: TP-03
INSULATOR: VECTRA E130i, COLOR: BLACK
CONTACT: PHOS BRONZE, 510 SPRING TEMPER
THICKNESS: .0060
F:\DWG\MISC\MKTG\BSH-XXX-01-X-D-EMX-MKT.SLDDRW
.5mm EDGE MOUNT MI SOCKET ASSEMBLY
BSH-XXX-01-X-D-EMX
5/31/2000
SHEET
1
OF
1
BY:
DEAN P
Microcontroller MCU
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EEWORLD
