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TMX320C6727ZDH

Description
Floating-Point Digital Signal Processor 256-BGA
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size1MB,114 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
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TMX320C6727ZDH Overview

Floating-Point Digital Signal Processor 256-BGA

TMX320C6727ZDH Parametric

Parameter NameAttribute value
Brand NameTexas Instruments
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
Parts packaging codeBGA
package instructionBGA, BGA256,16X16,50
Contacts256
Reach Compliance Codenot_compliant
Other features32 BIT FLOATING POINT; ALSO REQUIRES 3.3V SUPPLY
Address bus width32
barrel shifterNO
bit size32
boundary scanYES
maximum clock frequency25 MHz
External data bus width32
FormatFLOATING POINT
Internal bus architectureMULTIPLE
JESD-30 codeS-PBGA-B256
length17 mm
low power modeNO
Number of terminals256
Maximum operating temperature90 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA256,16X16,50
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply1.2,3.3 V
Certification statusNot Qualified
RAM (number of words)262144
Maximum seat height2.02 mm
Maximum supply voltage1.32 V
Minimum supply voltage1.14 V
Nominal supply voltage1.2 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width17 mm
uPs/uCs/peripheral integrated circuit typeDIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches1

TMX320C6727ZDH Related Products

TMX320C6727ZDH TMX320C6727GDH TMX320C6726RFP
Description Floating-Point Digital Signal Processor 256-BGA Floating-Point Digital Signal Processor 256-BGA Floating-Point Digital Signal Processor 144-HTQFP
Brand Name Texas Instruments Texas Instruments Texas Instruments
Is it lead-free? Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible
Parts packaging code BGA BGA QFP
package instruction BGA, BGA256,16X16,50 BGA, BGA256,16X16,50 HTFQFP, QFP144,.87SQ,20
Contacts 256 256 144
Reach Compliance Code not_compliant not_compliant not_compliant
Other features 32 BIT FLOATING POINT; ALSO REQUIRES 3.3V SUPPLY 32 BIT FLOATING POINT; ALSO REQUIRES 3.3V SUPPLY 32 BIT FLOATING POINT; ALSO REQUIRES 3.3V SUPPLY
Address bus width 32 32 32
barrel shifter NO NO NO
bit size 32 32 32
boundary scan YES YES YES
maximum clock frequency 25 MHz 25 MHz 25 MHz
External data bus width 32 32 32
Format FLOATING POINT FLOATING POINT FLOATING POINT
Internal bus architecture MULTIPLE MULTIPLE MULTIPLE
JESD-30 code S-PBGA-B256 S-PBGA-B256 S-PQFP-G144
length 17 mm 17 mm 20 mm
low power mode NO NO NO
Number of terminals 256 256 144
Maximum operating temperature 90 °C 90 °C 90 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA HTFQFP
Encapsulate equivalent code BGA256,16X16,50 BGA256,16X16,50 QFP144,.87SQ,20
Package shape SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 1.2,3.3 V 1.2,3.3 V 1.2,3.3 V
Certification status Not Qualified Not Qualified Not Qualified
RAM (number of words) 262144 262144 262144
Maximum seat height 2.02 mm 2.02 mm 1.2 mm
Maximum supply voltage 1.32 V 1.32 V 1.32 V
Minimum supply voltage 1.14 V 1.14 V 1.14 V
Nominal supply voltage 1.2 V 1.2 V 1.2 V
surface mount YES YES YES
technology CMOS CMOS CMOS
Temperature level OTHER OTHER OTHER
Terminal form BALL BALL GULL WING
Terminal pitch 1 mm 1 mm 0.5 mm
Terminal location BOTTOM BOTTOM QUAD
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 17 mm 17 mm 20 mm
uPs/uCs/peripheral integrated circuit type DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER
Maker - Texas Instruments Texas Instruments

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