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AS235RAA23NGSZ

Description
General Purpose Inductor, 0.023uH, 5%, 1 Element, Ceramic-Core, SMD, 0502, CHIP, 0402
CategoryPassive components    inductor   
File Size78KB,2 Pages
ManufacturerCOILCRAFT
Websitehttp://www.coilcraft.com/
Download Datasheet Parametric View All

AS235RAA23NGSZ Overview

General Purpose Inductor, 0.023uH, 5%, 1 Element, Ceramic-Core, SMD, 0502, CHIP, 0402

AS235RAA23NGSZ Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
package instruction0502
Reach Compliance Codecompliant
ECCN codeEAR99
uppercase and lowercase codes0502
structureChip
core materialCERAMIC
DC Resistance0.3 Ω
Nominal inductance(L)0.023 µH
Inductor ApplicationsRF INDUCTOR
Inductor typeGENERAL PURPOSE INDUCTOR
JESD-609 codee0
Manufacturer's serial numberAS235RAA
Number of functions1
Number of terminals2
Maximum operating temperature155 °C
Minimum operating temperature-55 °C
Package height0.66 mm
Package length1.19 mm
Package formSMT
Package width0.64 mm
method of packingTR, 7 Inch
Minimum quality factor (at nominal inductance)24
Maximum rated current0.4 A
self resonant frequency2720 MHz
seriesAS235RAA
Shape/Size DescriptionRECTANGULAR PACKAGE
shieldNO
surface mountYES
Terminal surfaceTin/Lead (Sn/Pb)
Terminal locationDUAL ENDED
Terminal shapeWRAPAROUND
Test frequency250 MHz
Tolerance5%
Base Number Matches1
0402 CHIP INDUCTORS
OutgassingCompliantChipInductors
AS235RAA
Exceptionally high Q factors
Outstanding self-resonant frequency
Tight inductance tolerance
High temperature materials allow operation in ambient
temperatures up to 155°C.
Passes NASA low outgassing specifications
Leach-resistant base metalization with tin-lead (Sn-Pb)
terminations ensures the best possible board adhesion
Current Derating
120
110
100
Percent of rated
I
rms
90
80
70
60
50
25°C
Typical L vs Frequency
60
56 nH
50
40
30
20
10
Inductance (nH)
40
0
-55 -40
-20
0
20
40
60
80
100
120
140 160
Ambient temperature (°C)
30
27 nH
20
B
overall
19 nH
12 nH
C
D
I
H
F
A
10
5.6 nH
1 nH
1
10
100
1000
10000
G
F
J
I
0
Frequency (MHz)
Typical Q vs Frequency
120
110
100
90
80
12 nH
5.6 nH
19 nH
27 nH
E
terminal
Terminal wraparound:
approx 0.007/0,18 both ends
Suggested
Land Pattern
A
max
0.047
1,19
B
max
0.025
0,64
C
max
0,66
D
ref
0,25
E
0,51
F
0,23
G
0,56
H
0,66
I
J
0,46
0.026 0.010 0.020 0.009 0.022 0.026 0.014 0.018
0,36
Note: Dimensions are before solder application. For maximum overall
dimensions including solder, add 0.0025 in / 0,064 mm to
B
and
0.006 in / 0,15 mm to
A
and
C.
Q Factor
70
60
50
40
30
20
10
0
1
10
100
1000
56 nH
Core material
Ceramic
Terminations
Tin-lead (63/37) over silver-platinum-glass frit
Ambient temperature
–55°C to +125°C with
Imax
current, +125°C
to +155°C with derated current
Storage temperature
Component: –55°C to +155°C.
Packaging: –55°C to +80°C
Resistance to soldering heat
Max three 40 second reflows at
+260°C, parts cooled to room temperature between cycles
10000
1 nH
Temperature Coefficient of Inductance (TCL)
+25 to +155 ppm/°C
Moisture Sensitivity Level (MSL)
1 (unlimited floor life at <30°C /
85% relative humidity)
Enhanced crush-resistant packaging
2000 per 7″ reel
Paper tape: 8 mm wide, 0.68 mm thick, 2 mm pocket spacing
Frequency (MHz)
®
Specifications subject to change without notice.
Please check our website for latest information.
Document AS198-1 Revised 02/25/11
1102 Silver Lake Road
Cary IL 60013
© Coilcraft, Inc. 2011
Phone 800-981-0363
Fax 847-639-1508
E-mail cps@coilcraft.com
Web www.coilcraft-cps.com
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