32KX8 UVPROM, 150ns, CDIP28, 0.600 INCH, WINDOWED, CERAMIC, DIP-28
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Parts packaging code | DIP |
| package instruction | WDIP, DIP28,.6 |
| Contacts | 28 |
| Reach Compliance Code | not_compliant |
| ECCN code | EAR99 |
| Maximum access time | 150 ns |
| I/O type | COMMON |
| JESD-30 code | R-GDIP-T28 |
| memory density | 262144 bit |
| Memory IC Type | UVPROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 28 |
| word count | 32768 words |
| character code | 32000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 32KX8 |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | WDIP |
| Encapsulate equivalent code | DIP28,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE, WINDOW |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 4.907 mm |
| Maximum standby current | 0.00025 A |
| Maximum slew rate | 0.03 mA |
| Maximum supply voltage (Vsup) | 5.25 V |
| Minimum supply voltage (Vsup) | 4.75 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 15.24 mm |
| Base Number Matches | 1 |
| TMS87C257-150JE | TMS87C257-2JE | TMS87C257JL | TMS87C257-1JL | TMS87C257JE | TMS87C257-150JL | TMS87C257-2JL | TMS87C257-1JE | |
|---|---|---|---|---|---|---|---|---|
| Description | 32KX8 UVPROM, 150ns, CDIP28, 0.600 INCH, WINDOWED, CERAMIC, DIP-28 | 32KX8 UVPROM, 200ns, CDIP28, 0.600 INCH, WINDOWED, CERAMIC, DIP-28 | IC,EPROM,32KX8,CMOS,DIP,28PIN,CERAMIC | IC,EPROM,32KX8,CMOS,DIP,28PIN,CERAMIC | 32KX8 UVPROM, 250ns, CDIP28, 0.600 INCH, WINDOWED, CERAMIC, DIP-28 | IC,EPROM,32KX8,CMOS,DIP,28PIN,CERAMIC | IC,EPROM,32KX8,CMOS,DIP,28PIN,CERAMIC | 32KX8 UVPROM, 170ns, CDIP28, 0.600 INCH, WINDOWED, CERAMIC, DIP-28 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | WDIP, DIP28,.6 | WDIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | WDIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | WDIP, DIP28,.6 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| Maximum access time | 150 ns | 200 ns | 250 ns | 170 ns | 250 ns | 150 ns | 200 ns | 170 ns |
| I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 code | R-GDIP-T28 | R-GDIP-T28 | R-XDIP-T28 | R-XDIP-T28 | R-GDIP-T28 | R-XDIP-T28 | R-XDIP-T28 | R-GDIP-T28 |
| memory density | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit |
| Memory IC Type | UVPROM | UVPROM | UVPROM | UVPROM | UVPROM | UVPROM | UVPROM | UVPROM |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of terminals | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| word count | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words |
| character code | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 |
| Maximum operating temperature | 85 °C | 85 °C | 70 °C | 70 °C | 85 °C | 70 °C | 70 °C | 85 °C |
| organize | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC | CERAMIC | CERAMIC, GLASS-SEALED | CERAMIC | CERAMIC | CERAMIC, GLASS-SEALED |
| encapsulated code | WDIP | WDIP | DIP | DIP | WDIP | DIP | DIP | WDIP |
| Encapsulate equivalent code | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE, WINDOW | IN-LINE, WINDOW | IN-LINE | IN-LINE | IN-LINE, WINDOW | IN-LINE | IN-LINE | IN-LINE, WINDOW |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum standby current | 0.00025 A | 0.00025 A | 0.00025 A | 0.00025 A | 0.00025 A | 0.00025 A | 0.00025 A | 0.00025 A |
| Maximum slew rate | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |