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BAS19

Description
0.2 A, 100 V, SILICON, SIGNAL DIODE
Categorysemiconductor    Discrete semiconductor   
File Size149KB,3 Pages
ManufacturerBILIN
Websitehttp://www.galaxycn.com/
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BAS19 Overview

0.2 A, 100 V, SILICON, SIGNAL DIODE

BAS19 Parametric

Parameter NameAttribute value
Number of terminals3
Number of components1
Processing package descriptionPLASTIC PACKAGE-3
stateTRANSFERRED
packaging shapeRECTANGULAR
Package SizeSMALL OUTLINE
surface mountYes
Terminal formGULL WING
terminal coatingNOT SPECIFIED
Terminal locationDUAL
Packaging MaterialsPLASTIC/EPOXY
structureSINGLE
Diode component materialsSILICON
Maximum power consumption limit0.3500 W
Diode typeSIGNAL DIODE
Maximum reverse recovery time0.0500 us
Maximum repetitive peak reverse voltage100 V
Maximum average forward current0.2000 A
BL
Galaxy Electrical
Surface mount switching diode
FEATURES
Fast switching speed.
Surface mount package ideally suited for
Automatic insertion.
For general purpose switching applications.
High conductance.
Production specification
BAS19/20/21
Pb
Lead-free
APPLICATIONS
High speed switching application.
SOT-23
ORDERING INFORMATION
Type No.
BAS19
BAS20
BAS21
Marking
JP
JR
JS
Package Code
SOT-23
SOT-23
SOT-23
MAXIMUM RATING
@ Ta=25℃ unless otherwise specified
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Reverse Voltage
RMS Reverse Voltage
Forward Continuous Current
Average rectified output Current
Non-Repetitive Peak Forward Surge
Current
@t=1.0μs
@t=1.0s
Repetitive Peak Forward Surge Current
Power Dissipation
Thermal Resistance Junction to Ambient
Air
Operating Junction Temperature Range
Storage Temperature Range
Symbol
V
RRM
V
RWM
V
R
V
R(RMS)
I
FM
I
O
I
FSM
I
FRM
P
d
R
θJA
T
j
T
STG
BAS19
120
100
71
400
200
2.5
0.5
625
250
500
150
-65 to +150
mW
℃/W
BAS20
200
150
106
BAS21
250
200
141
Unit
V
V
V
mA
mA
A
Document number: BL/SSSDC027
Rev.A
www.galaxycn.com
1

BAS19 Related Products

BAS19 BAS20
Description 0.2 A, 100 V, SILICON, SIGNAL DIODE 0.2 A, 150 V, SILICON, SIGNAL DIODE
Number of terminals 3 3
Number of components 1 1
Processing package description PLASTIC PACKAGE-3 PLASTIC PACKAGE-3
state TRANSFERRED CONSULT MFR
packaging shape RECTANGULAR Rectangle
Package Size SMALL OUTLINE SMALL OUTLINE
surface mount Yes Yes
Terminal form GULL WING GULL WING
terminal coating NOT SPECIFIED NOT SPECIFIED
Terminal location DUAL pair
Packaging Materials PLASTIC/EPOXY Plastic/Epoxy
structure SINGLE single
Diode component materials SILICON silicon
Maximum power consumption limit 0.3500 W 0.3500 W
Diode type SIGNAL DIODE Signal diode
Maximum reverse recovery time 0.0500 us 0.0500 us
Maximum repetitive peak reverse voltage 100 V 150 V
Maximum average forward current 0.2000 A 0.2000 A

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