32KX8 UVPROM, 200ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Parts packaging code | DIP |
| Contacts | 28 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum access time | 200 ns |
| I/O type | COMMON |
| JESD-30 code | R-XDIP-T28 |
| JESD-609 code | e0 |
| memory density | 262144 bit |
| memory width | 8 |
| Number of terminals | 28 |
| word count | 32768 words |
| character code | 32000 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 32KX8 |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP28,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Programming voltage | 12.5 V |
| Certification status | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| UPD27C256AD-20 | UPD27C256AD-15 | |
|---|---|---|
| Description | 32KX8 UVPROM, 200ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | 32KX8 UVPROM, 150ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 |
| Is it lead-free? | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible |
| Parts packaging code | DIP | DIP |
| Contacts | 28 | 28 |
| Reach Compliance Code | unknown | unknown |
| ECCN code | EAR99 | EAR99 |
| Maximum access time | 200 ns | 150 ns |
| I/O type | COMMON | COMMON |
| JESD-30 code | R-XDIP-T28 | R-XDIP-T28 |
| JESD-609 code | e0 | e0 |
| memory density | 262144 bit | 262144 bit |
| memory width | 8 | 8 |
| Number of terminals | 28 | 28 |
| word count | 32768 words | 32768 words |
| character code | 32000 | 32000 |
| Maximum operating temperature | 70 °C | 70 °C |
| organize | 32KX8 | 32KX8 |
| Output characteristics | 3-STATE | 3-STATE |
| Package body material | CERAMIC | CERAMIC |
| encapsulated code | DIP | DIP |
| Encapsulate equivalent code | DIP28,.6 | DIP28,.6 |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE |
| power supply | 5 V | 5 V |
| Programming voltage | 12.5 V | 12.5 V |
| Certification status | Not Qualified | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V | 5 V |
| surface mount | NO | NO |
| technology | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL |
| Base Number Matches | 1 | 1 |