BCW49-1030-07CB95L datasheet, PDF

Datasheet> All Categories > The connector> socket> BCW49-1030-07CB95L

BCW49-1030-07CB95L: DescriptionIC Socket, BGA49, 49 Contact(s), ROHS COMPLIANT; CategoryThe connector socket; File Size1MB，8 Pages; ManufacturerActel; Websitehttp://www.actel.com/; Environmental Compliance

Download Datasheet Parametric View All

BCW49-1030-07CB95L Overview

IC Socket, BGA49, 49 Contact(s), ROHS COMPLIANT

BCW49-1030-07CB95L Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
package instruction	ROHS COMPLIANT
Reach Compliance Code	compliant
Contact to complete cooperation	GOLD/TIN
Contact completed and terminated	GOLD/TIN
Contact material	BERYLLIUM COPPER
Device slot type	IC SOCKET
Type of equipment used	BGA49
Shell material	CERAMIC
JESD-609 code	e4/e3
Manufacturer's serial number	BCW
Number of contacts	49
Base Number Matches	1

Preview

Download Datasheet

View All

Socket Mounting Recommendations and Reflow Profile

Purpose

This document is meant to serve as a guide for mounting E-tec surface mount device (SMD)

sockets to the printed circuit board (PCB). The recommendations described here are guidelines

only, and modifications may be needed for your particular socket, PCB, and process.

Application

The sockets this document applies to are as follows: Clam Shell, Knob Lock, Screw Lock, Twist

Lock, Quick Lock and Lever Lock in SMD style. These sockets utilize the E-tec patented spring-

pin technology. This technology allows the pins to be soldered to the PCB while still providing

compliance to the device under test (DUT) via springs located at the other end of the pin. The

pins themselves do not have solder pre-forms as a BGA would with its solder balls. However, the

sockets are designed to mount to the same PCB footprint and pads as required by the BGA, or

any other IC package the socket was designed for (except if locating pegs are used; see ‘Locating

Pegs’ section of this document). When compared to mounting a BGA, an extra volume of solder

paste is required to mount the sockets to the PCB. To effect this, a properly dimensioned stencil

is required. Once the paste has been applied, a standard reflow process is then used to solder the

socket to the PCB. After the socket is verified to have proper electrical connection to the PCB,

the system is then ready to be used.

Locating Pegs

Although designed to mount to the same footprint as the IC, with just a small amount of

additional keep-out area, E-tec sockets can also be offered with locating pegs. The sockets are

typically mounted with two locating pegs, which require two thru-holes drilled into the PCB.

These pegs help to align the socket on the PCB, and hence align the socket’s pins to the PCB’s

pads, during the soldering process. Furthermore, plating the thru-holes allows the locating pegs

to be soldered to the PCB for better mechanical stability during everyday use and handling of the

socket. If the PCB design permits, E-tec recommends the use of these locating pegs. For fine-

pitch, low pin-count sockets without locating pegs, the mechanical strength of the solder joints

may be insufficient. In these cases, it is recommended to epoxy the socket body to the PCB. 3M

Scotch-Weld 2216 B/A is a suitable epoxy. In any case, the proper volume of solder paste is

required to ensure mechanical and electrical integrity. Recommended stencil dimensions are

given in the next section of this document.

E-tec Interconnect Ltd, Industrial Zone C, CH-1072 Forel (Lavaux), Switzerland

Phone +41-21-781 08 10 ·

www.e-tec.com

info@e-tec.com

E-tec Socket Mounting Recommendations

PRELIMINARY

Recommended Resources

Duplex communication circuit composed of MCl45030

3V-5V level conversion circuit diagram

Fluorescent lamp dimming circuit

temperature controller circuit

NOT circuit composed of transistors

RL78 LCD controller display principle help: Does anyone know how to display the following 4 time slices?...; wdliming Renesas Electronics MCUs

DSP hardware implements large-scale FIR or multiply-add algorithms: [size=4] In FPGA design, most multipliers use embedded DSP hard cores. If the system needs to run at a very high clock frequency, the synthesis and routing results will determine where to insert the p...; fish001 DSP and ARM Processors

Tilt detection using accelerometer: Is there anything you can learn about using accelerometers for tilt detection when making quadcopters?...; 蓝雨夜 ADI Reference Circuit

Will the application developed by Wince crash?: Why does an application developed by Wince crash? No matter what the reason is, the crash prompts the thread process ID and other information. Is there any way to determine the cause of the error? Exp...; hbbyq111 Embedded System

C compiler for 6502: Does anyone have a C compiler for 6502? Can you give me one? mka982@163.com cc65? (I have this one, but it doesn't work) adc-65? (Do you have this one?)...; s_smmo Embedded System

Is it really a good thing that products are updated so quickly?: Today, I went online and saw the news about the Golo 4.0 spy war. Golo 3 seemed to have just held a new product launch in March this year. Now in July, just four months later, another new product has ...; alicelovewfy Automotive Electronics

Shortcut: 00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W

Popular Components