Standard SRAM, 256KX4, 10ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, SOJ-32
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Parts packaging code | SOJ |
| package instruction | SOJ, SOJ32,.44 |
| Contacts | 32 |
| Reach Compliance Code | unknown |
| ECCN code | 3A991.B.2.B |
| Maximum access time | 10 ns |
| I/O type | COMMON |
| JESD-30 code | R-PDSO-J32 |
| JESD-609 code | e0 |
| length | 20.96 mm |
| memory density | 1048576 bit |
| Memory IC Type | STANDARD SRAM |
| memory width | 4 |
| Number of functions | 1 |
| Number of terminals | 32 |
| word count | 262144 words |
| character code | 256000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 256KX4 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOJ |
| Encapsulate equivalent code | SOJ32,.44 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 3.3 V |
| Certification status | Not Qualified |
| Maximum seat height | 3.76 mm |
| Maximum standby current | 0.005 A |
| Minimum standby current | 3 V |
| Maximum slew rate | 0.14 mA |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 3 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 10.16 mm |
| Base Number Matches | 1 |
| KM64V1003BJ-10 | KM64V1003BJ-12 | KM64V1003BJ-8 | |
|---|---|---|---|
| Description | Standard SRAM, 256KX4, 10ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, SOJ-32 | Standard SRAM, 256KX4, 12ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, SOJ-32 | Standard SRAM, 256KX4, 8ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, SOJ-32 |
| Is it Rohs certified? | incompatible | incompatible | incompatible |
| Parts packaging code | SOJ | SOJ | SOJ |
| package instruction | SOJ, SOJ32,.44 | SOJ, SOJ32,.44 | SOJ, SOJ32,.44 |
| Contacts | 32 | 32 | 32 |
| Reach Compliance Code | unknown | unknown | unknown |
| ECCN code | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B |
| Maximum access time | 10 ns | 12 ns | 8 ns |
| I/O type | COMMON | COMMON | COMMON |
| JESD-30 code | R-PDSO-J32 | R-PDSO-J32 | R-PDSO-J32 |
| JESD-609 code | e0 | e0 | e0 |
| length | 20.96 mm | 20.96 mm | 20.96 mm |
| memory density | 1048576 bit | 1048576 bit | 1048576 bit |
| Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| memory width | 4 | 4 | 4 |
| Number of functions | 1 | 1 | 1 |
| Number of terminals | 32 | 32 | 32 |
| word count | 262144 words | 262144 words | 262144 words |
| character code | 256000 | 256000 | 256000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C |
| organize | 256KX4 | 256KX4 | 256KX4 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | SOJ | SOJ | SOJ |
| Encapsulate equivalent code | SOJ32,.44 | SOJ32,.44 | SOJ32,.44 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 3.3 V | 3.3 V | 3.3 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 3.76 mm | 3.76 mm | 3.76 mm |
| Maximum standby current | 0.005 A | 0.005 A | 0.005 A |
| Minimum standby current | 3 V | 3 V | 3 V |
| Maximum slew rate | 0.14 mA | 0.13 mA | 0.15 mA |
| Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V |
| Minimum supply voltage (Vsup) | 3 V | 3 V | 3 V |
| Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V |
| surface mount | YES | YES | YES |
| technology | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND | J BEND | J BEND |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 10.16 mm | 10.16 mm | 10.16 mm |
| Base Number Matches | 1 | 1 | - |
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