NANDA9W3N1CZBC5E datasheet, PDF

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NANDA9W3N1CZBC5E: DescriptionMemory Circuit, Flash+SDRAM, PBGA137, 10.50 X 13 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-137; Categorystorage storage; File Size1MB，52 Pages; ManufacturerNumonyx ( Micron ); Websitehttps://www.micron.com; Environmental Compliance

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NANDA9W3N1CZBC5E Overview

Memory Circuit, Flash+SDRAM, PBGA137, 10.50 X 13 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-137

NANDA9W3N1CZBC5E Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Parts packaging code	BGA
package instruction	TFBGA, BGA137,10X15,32
Contacts	137
Reach Compliance Code	unknown
JESD-30 code	R-PBGA-B137
length	13 mm
memory density	1073741824 bit
Memory IC Type	MEMORY CIRCUIT
memory width	8
Mixed memory types	FLASH+SDRAM
Number of functions	1
Number of terminals	137
word count	134217728 words
character code	128000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-30 °C
organize	128MX8
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Encapsulate equivalent code	BGA137,10X15,32
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	2.5/3.6 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.5 V
Nominal supply voltage (Vsup)	2.6 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	10.5 mm
Base Number Matches	1

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NANDxxxxNx

Large page NAND flash memory and

low power SDRAM, 1.8/2.6 V MCP and PoP

Features

FBGA

MCP (multichip package) and PoP (package

on package)

– NAND flash memory

– 1-, 2-, 4-, 2x2-Gbit large page size NAND

flash memory

– 256-, 512-, 2x512-, 128+256/512-Mbit or

1-Gbit (x16/x32) SDR/DDR LPSDRAM

Temperature range: -30 up to 85 °C

Supply voltage

– NAND flash: V

DDF

= 1.7-1.95 V or 2.5-3.6 V

– LPSDRAM: V

DDD

= V

DDQD

= 1.7-1.95 V

Electronic signature

ECOPACK

packages

TFBGA107 10.5 × 13 × 1.2 mm

TFBGA137 10.5 x 13 x 1.2 mm

LFBGA137 10.5 x 13 x 1.4 mm

TFBGA149 10 × 13.5 × 1.2 mm

VFBGA160 15 x 15 x 1 mm

FBGA

VFBGA152 14 x 14 x 0.9 mm

TFBGA152 14×14 × 1.1 mm

TFBGA152 14 × 14 × 1.2 mm

TFBGA128 12 x 12 x 1.1 mm

Flash memory

Single or double data rate LPSDRAM

Nand interface

– x8 or x16 bus width

– Multiplexed address/data

Page size

– x8 device: (2048 + 64 spare) bytes

– x16 device: (1024 + 32 spare) words

Block size

– x8 device: (128K + 4K spare) bytes

– x16 device: (64K + 2K spare) words

Page read/program

– Random access: 25 µs (max)

– Sequential access: 25/30 ns (min)

– Page program time: 200 µs (typ)

Copy back program mode

Fast block erase: 1.5/2 ms (typ)

Chip Enable ‘don’t care’

Status register

Data integrity

– 100 000 program/erase cycles

– 10 years data retention

Interface: x16/32 bus width

Deep power-down mode

1.8 V LVCMOS interface

Quad internal banks controlled by BA0, BA1

Wrap sequence: sequential/interleaved

Automatic and controlled precharge

Auto refresh and self refresh

– 8192 or 4096 (for 128 Mbits) refresh

cycles/64 ms

– Programmable partial array self refresh

– Auto temperature compensated self refresh

Device summary

NANDxxxxNx

NANDA8R3N0

NANDA9WxN1

NANDBAR4Nx

NANDB9R4Nx

NANDCAW4N1

NANDD3R4N5

NANDA9R3Nx

NANDB0R3N0

NANDB1R3N0

NANDC9R4N0

NANDCBR4N3

NANDDBR3N5

Table 1.

NANDA0R3N0

NANDA9R4Nx

NANDBAR3Nx

NANDB9R3N0

NANDBAW4N1

NANDC3R4N5

October 2008

Rev 12

1/52

www.numonyx.com

Contents

NANDxxxxNx

Contents

Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Signal descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

2.1

2.2

2.3

2.4

2.5

2.6

2.7

2.8

2.9

2.10

2.11

2.12

2.13

2.14

2.15

2.16

2.17

2.18

2.19

2.20

2.21

2.22

2.23

2.24

2.25

2.26

Flash memory inputs/outputs (I/O0-I/O7) . . . . . . . . . . . . . . . . . . . . . . . . . 25

Flash memory inputs/outputs (I/O8-I/O15) . . . . . . . . . . . . . . . . . . . . . . . . 25

Flash memory Address Latch Enable (AL) . . . . . . . . . . . . . . . . . . . . . . . . 25

Flash memory Command Latch Enable (CL) . . . . . . . . . . . . . . . . . . . . . . 25

Flash memory Chip Enable (E

) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Flash memory Read Enable (R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Flash memory Write Enable (W

) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Flash memory Write Protect (WP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Flash memory Ready/Busy (RB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Flash memory V

DDF

supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

LPSDRAM Address inputs (A0-Ax) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

LPSDRAM Bank Select Address inputs (BA0-BA1) . . . . . . . . . . . . . . . . . 26

LPSDRAM Data inputs/outputs (DQ0-DQ31) . . . . . . . . . . . . . . . . . . . . . . 27

LPSDRAM Chip Select (E

) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

LPSDRAM Column Address Strobe (CAS) . . . . . . . . . . . . . . . . . . . . . . . 27

LPSDRAM Row Address Strobe (RAS) . . . . . . . . . . . . . . . . . . . . . . . . . . 27

LPSDRAM Write Enable (W

) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

LPSDRAM Clock Input (K) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

LPSDRAM Clock Input (K) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

LPSDRAM Clock Enable (KE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

LPSDRAM lower/upper data input/output mask (DQM0 to DQM3) . . . . . 28

DQS0 to DQS3 input/outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Lower/Upper Data Read/Write Strobe input/output (LDQS, UDQS) . . . . 28

LPSDRAM V

DDD

supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

LPSDRAM V

DDQD

supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

2.26.1

2.26.2

NANDxxxxNx devices delivered in TFBGA107/137/149 packages . . . . 29

NANDxxxxNx delivered in TFBGA128/152 and VFBGA160 packages . 29

2/52

List of tables

NANDxxxxNx

List of tables

Table 1.

Table 2.

Table 3.

Table 4.

Table 5.

Table 6.

Table 7.

Table 8.

Table 9.

Table 10.

Table 11.

Table 12.

Table 13.

Table 14.

Table 15.

Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Product list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

TFBGA107 10.5 × 13 mm - 10 × 14 active ball array, 0.80 mm pitch,

mechanical data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

TFBGA128 - 2-row perimeter matrix 2R18 × 18, 12 × 12 mm, 0.65 mm pitch,

mechanical data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

TFBGA137 10.5 x 13 mm - 10 x 15-13 active ball array, 0.80 mm pitch,

mechanical data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

LFBGA137 10.5 x 13 x 1.4 mm - 10 x 15-13 active ball array, 0.80 mm pitch,

mechanical data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

TFBGA149 10 × 13.5 mm - 12 × 16 active ball array, 0.80 mm pitch, mechanical data. . . 43

TFBGA152, 2-row perimeter matrix 2R21 x 21, 14 x 14 x 1.1 mm, 0.65 mm pitch,

mechanical data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

TFBGA152, 2-row perimeter matrix 2R21 x 21, 14 x 14 x 0.9 mm, 0.65 mm pitch,

mechanical data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

TFBGA152, 2-row perimeter matrix 2R21 x 21, 14 × 14 x 1.2 mm, 0.65 mm pitch,

mechanical data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

VFBGA160 15 × 15 x 1 mm, 0.65 mm pitch, mechanical data . . . . . . . . . . . . . . . . . . . . . . 47

Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

4/52

NANDxxxxNx

List of figures

Figure 1.

Figure 2.

Figure 3.

Figure 4.

Figure 5.

Figure 6.

Figure 7.

Figure 8.

Figure 9.

Figure 10.

Figure 11.

Figure 12.

Figure 13.

Figure 14.

Figure 15.

Figure 16.

Block diagram for TFBGA107, TFBGA137, and TFBGA149 packages . . . . . . . . . . . . . . . 11

Block diagram for LFBGA137 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Block diagram for TFBGA128, TFBGA152 (NANDA8R3N0, NANDA9R3N0,

NANDBAR3N, NANDB9R3N0), VFBGA152, and VFBGA160 packages . . . . . . . . . . . . . 13

Block diagram for TFBGA152 package (NANDBAR3N0, NANDB0R3N0,

NANDB1R3N0, NANDA0R3N0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

TFBGA107 connections (top view through package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

TFBGA128 connections (top view through package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

TFBGA137 connections (top view through package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

LFBGA137 connections (top view through package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

TFBGA149 connections (top view through package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

TFBGA152 connections - NANDA8R3N0, NANDA9R3N0, NANDB9R3N0

(top view through package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

TFBGA152 connections - NANDBAR3N0, NANDB0R3N0, NANDB1R3N0,

NANDA0R3N0 (top view through package). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

TFBGA152 (NANDBAR3N1) and VFBGA152 (NANDBAR4N5) connections -

(top view through package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

VFBGA160 connections - NANDBAR4N2 (top view through package) . . . . . . . . . . . . . . . 24

Functional block diagram for TFBGA107, TFBGA137, TFBGA149

packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Functional block diagram for LFBGA137 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

Functional block diagram for TFBGA128 (NANDA9R3N0, NANDB9R3N0),

TFBGA152 (NANDA8R3N0, NANDA9R3N0, NANDBAR3N1,

NANDB9R3N0), VFBGA152 (NANDBAR4N5), and VFBGA160 packages. . . . . . . . . . . . 33

Functional block diagram for TFBGA152 (NANDBAR3N0, NANDB0R3N0,

NANDB1R3N0, NANDA0R3N0) package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

Functional block diagram for TFBGA128 (NANDBAR3N6) package . . . . . . . . . . . . . . . . . 35

TFBGA107 10.5 × 13 mm - 10 × 14 active ball array, 0.80 mm pitch, package outline . . . 37

TFBGA128 - 2-row perimeter matrix 2R18 × 18, 12 × 12 mm, 0.65 mm pitch,

package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

TFBGA137 10.5 x 13 x 1.2 mm - 10 x 15-13 active ball array, 0.80 mm pitch,

package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

LFBGA137 10.5 x 13 x 1.4 mm - 10 x 15-13 active ball array, 0.80 mm pitch,

package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

TFBGA149 10 × 13.5 mm - 12 × 16 active ball array, 0.80 mm pitch,

package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

TFBGA152, 2-row perimeter matrix 2R21 x 21, 14 x 14 x 1.1 mm, 0.65 mm pitch,

package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

VFBGA152, 2-row perimeter matrix 2R21 x 21, 14 x 14 x 0.9 mm, 0.65 mm pitch,

package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

TFBGA152, 2-row perimeter matrix 2R21 x 21, 14 × 14 x 1.2 mm, 0.65 mm pitch,

package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

VFBGA160 15 × 15 x 1 mm, 0.65 mm pitch, package outline . . . . . . . . . . . . . . . . . . . . . . 47

Figure 17.

Figure 18.

Figure 19.

Figure 20.

Figure 21.

Figure 22.

Figure 23.

Figure 24.

Figure 25.

Figure 26.

Figure 27.

5/52

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