MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
ULLGA8, 1.6x1.0, 0.4P
CASE 613AB-01
ISSUE A
1
SCALE 8:1
DATE 08 FEB 2008
D
A
B
PIN ONE
REFERENCE
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
DIM
A
A1
b
D
E
e
L
L1
SEATING
PLANE
MILLIMETERS
MIN
MAX
---
0.40
0.00
0.05
0.15
0.25
1.60 BSC
1.00 BSC
0.40 BSC
0.25
0.35
0.30
0.40
0.10 C
0.10 C
0.05 C
8X
0.05 C
L1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
©
Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
DESCRIPTION: ULLGA8, 1.6X1.0, 0.4P
October, 2002 - Rev. 0
PAGE 1 OF
XXX
2
1
DOCUMENT NUMBER:
ÏÏÏ
ÏÏÏ
ÏÏÏ
e/2
1
8
TOP VIEW
A
SIDE VIEW
A1
C
MOUNTING FOOTPRINT
SOLDERMASK DEFINED*
7X
0.49
e
4
7X
8X
0.26
L
NOTE 4
1.24
5
0.53
8X
1
PKG
OUTLINE
b
0.10 C A B
0.05 C
NOTE 3
0.40
PITCH
DIMENSIONS: MILLIMETERS
BOTTOM VIEW
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
98AON24010D
DOCUMENT NUMBER:
98AON24010D
PAGE 2 OF 2
ISSUE
O
A
REVISION
RELEASED FOR PRODUCTION. REQ. BY M. PETRUES.
CORRECTED SOLDERING FOOTPRINT. REQ. BY M. PETRUES.
DATE
21 FEB 2007
08 FEB 2008
ON Semiconductor
and
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©
Semiconductor Components Industries, LLC, 2008
February, 2008 - Rev. 01A
Case Outline Number:
613AB
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