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K8D1716UBC-DC080

Description
Flash, 1MX16, 80ns, PBGA48, 6 X 8.50 MM, 0.80 MM PITCH, LEAD FREE, TBGA-48
Categorystorage    storage   
File Size561KB,41 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
Environmental Compliance
Download Datasheet Parametric View All

K8D1716UBC-DC080 Overview

Flash, 1MX16, 80ns, PBGA48, 6 X 8.50 MM, 0.80 MM PITCH, LEAD FREE, TBGA-48

K8D1716UBC-DC080 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Parts packaging codeBGA
package instructionVFBGA, BGA48,6X8,32
Contacts48
Reach Compliance Codecompliant
ECCN codeEAR99
Maximum access time80 ns
Spare memory width8
startup blockBOTTOM
command user interfaceYES
Universal Flash InterfaceYES
Data pollingYES
JESD-30 codeR-PBGA-B48
JESD-609 codee1
length8.5 mm
memory density16777216 bit
Memory IC TypeFLASH
memory width16
Humidity sensitivity level3
Number of functions1
Number of departments/size8,31
Number of terminals48
word count1048576 words
character code1000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize1MX16
Package body materialPLASTIC/EPOXY
encapsulated codeVFBGA
Encapsulate equivalent codeBGA48,6X8,32
Package shapeRECTANGULAR
Package formGRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
power supply3/3.3 V
Programming voltage2.7 V
Certification statusNot Qualified
ready/busyYES
Maximum seat height1 mm
Department size8K,64K
Maximum standby current0.000018 A
Maximum slew rate0.05 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTIN SILVER COPPER
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
switch bitYES
typeNOR TYPE
width6 mm
Base Number Matches1
K8D1716UTC / K8D1716UBC
FLASH MEMORY
Document Title
16M Bit (2M x8/1M x16) Dual Bank NOR Flash Memory
Revision History
Revision No. History
0.0
0.1
0.2
1.0
Initial Draft
Support 48TSOP1 Lead Free Package
Support 48FBGA Leaded/Lead Free Package
Specification finalized
Draft Date
July 25, 2004
Sep 16, 2004
Nov 29, 2004
Dec 16, 2004
Remark
Advance
Preliminary
Preliminary
1
Revision 1.0
December 2004
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