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M58LT256JSB

Description
16M X 16 FLASH 1.8V PROM, PBGA64
Categorystorage   
File Size2MB,108 Pages
ManufacturerNumonyx ( Micron )
Websitehttps://www.micron.com
Download Datasheet Parametric Compare View All

M58LT256JSB Overview

16M X 16 FLASH 1.8V PROM, PBGA64

M58LT256JSB Parametric

Parameter NameAttribute value
Number of functions1
Number of terminals64
Maximum operating temperature85 Cel
Minimum operating temperature-40 Cel
Maximum supply/operating voltage2 V
Minimum supply/operating voltage1.7 V
Rated supply voltage1.8 V
Processing package description10 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, TBGA-64
Lead-freeYes
EU RoHS regulationsYes
stateACTIVE
packaging shapeRECTANGULAR
Package SizeGRID ARRAY, THIN PROFILE
surface mountYes
Terminal formBALL
Terminal spacing1 mm
terminal coatingTIN SILVER COPPER
Terminal locationBOTTOM
Packaging MaterialsPLASTIC/EPOXY
Temperature levelINDUSTRIAL
memory width16
organize16M X 16
storage density2.68E8 deg
operating modeASYNCHRONOUS
Number of digits1.68E7 words
Number of digits16M
Memory IC typeFLASH 1.8V PROM
serial parallelPARALLEL
M58LT256JST
M58LT256JSB
256 Mbit (16 Mb × 16, multiple bank, multilevel, burst)
1.8 V supply, secure Flash memories
Features
Supply voltage
– V
DD
= 1.7 V to 2.0 V for program, erase
and read
– V
DDQ
= 2.7 V to 3.6 V for I/O buffers
– V
PP
= 9 V for fast program
Synchronous/asynchronous read
– Synchronous burst read mode: 52 MHz
– Random access: 85 ns
– Asynchronous page read mode
Synchronous burst read suspend
Programming time
– 5 µs typical word program time using Buffer
Enhanced Factory Program command
Memory organization
– Multiple bank memory array: 16 Mbit banks
– Parameter blocks (top or bottom location)
Dual operations
– Program/erase in one bank while read in
others
– No delay between read and write
operations
Block protection
– All blocks protected at power-up
– Any combination of blocks can be protected
with zero latency
– Absolute write protection with V
PP
= V
SS
Security
– Software security features
– 64 bit unique device number
– 2112 bit user programmable OTP Cells
CFI (common Flash interface)
100 000 program/erase cycles per block
BGA
TBGA64 (ZA)
10 x 13 mm
Electronic signature
– Manufacturer code: 20h
– Top device codes:
M58LT256JST: 885Eh
– Bottom device codes
M58LT256JSB: 885Fh
TBGA64 package
– ECOPACK® compliant
December 2007
Rev 4
1/108
www.numonyx.com
1

M58LT256JSB Related Products

M58LT256JSB M58LT256JST M58LT256JSB8ZA6E M58LT256JST8ZA6E M58LT256JSB8ZA6F M58LT256JSB8ZA6T M58LT256JSB8ZA6 M58LT256JST8ZA6F M58LT256JST8ZA6 M58LT256JST8ZA6T
Description 16M X 16 FLASH 1.8V PROM, PBGA64 16M X 16 FLASH 1.8V PROM, PBGA64 16M X 16 FLASH 1.8V PROM, PBGA64 16M X 16 FLASH 1.8V PROM, PBGA64 16M X 16 FLASH 1.8V PROM, PBGA64 16M X 16 FLASH 1.8V PROM, PBGA64 16M X 16 FLASH 1.8V PROM, PBGA64 16M X 16 FLASH 1.8V PROM, PBGA64 16M X 16 FLASH 1.8V PROM, PBGA64 16M X 16 FLASH 1.8V PROM, PBGA64
Number of functions 1 1 1 1 1 1 1 1 1 1
Number of terminals 64 64 64 64 64 64 64 64 64 64
Maximum operating temperature 85 Cel 85 Cel 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 Cel -40 Cel -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
surface mount Yes Yes YES YES YES YES YES YES YES YES
Terminal form BALL BALL BALL BALL BALL BALL BALL BALL BALL BALL
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
memory width 16 16 16 16 16 16 16 16 16 16
organize 16M X 16 16M X 16 16MX16 16MX16 16MX16 16MX16 16MX16 16MX16 16MX16 16MX16
Is it Rohs certified? - - conform to conform to conform to incompatible incompatible conform to incompatible incompatible
Maker - - Numonyx ( Micron ) Numonyx ( Micron ) Numonyx ( Micron ) Numonyx ( Micron ) Numonyx ( Micron ) Numonyx ( Micron ) Numonyx ( Micron ) Numonyx ( Micron )
Parts packaging code - - BGA BGA BGA BGA BGA BGA BGA BGA
package instruction - - TBGA, BGA64,8X8,40 10 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, TBGA-64 TBGA, BGA64,8X8,40 TBGA, BGA64,8X8,40 TBGA, BGA64,8X8,40 10 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, TBGA-64 10 X 13 MM, 1 MM PITCH, TBGA-64 10 X 13 MM, 1 MM PITCH, TBGA-64
Contacts - - 64 64 64 64 64 64 64 64
Reach Compliance Code - - compli unknow unknow unknow unknow unknow unknow unknow
ECCN code - - 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A
Other features - - SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
startup block - - BOTTOM TOP BOTTOM BOTTOM BOTTOM TOP TOP TOP
command user interface - - YES YES YES YES YES YES YES YES
Universal Flash Interface - - YES YES YES YES YES YES YES YES
Data polling - - NO NO NO NO NO NO NO NO
JESD-30 code - - R-PBGA-B64 R-PBGA-B64 R-PBGA-B64 R-PBGA-B64 R-PBGA-B64 R-PBGA-B64 R-PBGA-B64 R-PBGA-B64
length - - 13 mm 13 mm 13 mm 13 mm 13 mm 13 mm 13 mm 13 mm
memory density - - 268435456 bi 268435456 bi 268435456 bi 268435456 bi 268435456 bi 268435456 bi 268435456 bi 268435456 bi
Memory IC Type - - FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH
Number of departments/size - - 4,255 4,255 4,255 4,255 4,255 4,255 4,255 4,255
word count - - 16777216 words 16777216 words 16777216 words 16777216 words 16777216 words 16777216 words 16777216 words 16777216 words
character code - - 16000000 16000000 16000000 16000000 16000000 16000000 16000000 16000000
Operating mode - - ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Package body material - - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - - TBGA TBGA TBGA TBGA TBGA TBGA TBGA TBGA
Encapsulate equivalent code - - BGA64,8X8,40 BGA64,8X8,40 BGA64,8X8,40 BGA64,8X8,40 BGA64,8X8,40 BGA64,8X8,40 BGA64,8X8,40 BGA64,8X8,40
Package shape - - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form - - GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE
page size - - 8 words 8 words 8 words 8 words 8 words 8 words 8 words 8 words
Parallel/Serial - - PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
power supply - - 1.8,3/3.3 V 1.8,3/3.3 V 1.8,3/3.3 V 1.8,3/3.3 V 1.8,3/3.3 V 1.8,3/3.3 V 1.8,3/3.3 V 1.8,3/3.3 V
Programming voltage - - 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
Certification status - - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height - - 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm
Department size - - 16K,64K 16K,64K 16K,64K 16K,64K 16K,64K 16K,64K 16K,64K 16K,64K
Maximum slew rate - - 0.077 mA 0.077 mA 0.077 mA 0.077 mA 0.077 mA 0.077 mA 0.077 mA 0.077 mA
Maximum supply voltage (Vsup) - - 2 V 2 V 2 V 2 V 2 V 2 V 2 V 2 V
Minimum supply voltage (Vsup) - - 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V
Nominal supply voltage (Vsup) - - 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
technology - - CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Terminal pitch - - 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm
switch bit - - NO NO NO NO NO NO NO NO
type - - NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE
width - - 10 mm 10 mm 10 mm 10 mm 10 mm 10 mm 10 mm 10 mm
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