9
8
7
6
5
4
3
2
1
½
3.0
½
E
E
0.96
1.07
4.0
1.75
1.7
0.98
SECTION
Z-Z
SECTION
Y-Y
D
0.78
0.65
0.55
NOTES:
1.25
D
Y
Z
1. めっき仕様：表参照
PLATING:SEE TABLE
2. 本½品の適応相手及び各種仕様書は次ページを御参照ください。
REFER TO THE NEXT PAGE FOR APPLICABLE PRODUCTS AND VARIOUS
SPECIFICATION DOCUMENT.
3. 本½品は金めっき品である。
錫めっき品は5013340000-SD/PSD/000を御参照下さい。
THIS PRODUCT IS A GOLD PLATING.
PLEASE REFER TO 5013340000-SD/PSD/000 FOR TIN PLATING.
1.3
C
0.28
(
0.12
)
C
Z
½
7.8
½
Y
A
B
TRADE MARK
501193 9000
Φ0.4-0.8mm
AWG#28-32
リール REEL
連鎖状 CHAIN
0.76 μm MIN.
B
0.38 μm MIN.
0.1 μm MIN.
接点部 金めっき厚
GOLD PLATING
THICKNESS OF
CONTACT
501193 8000
501193 7000
VIEW A
絶縁被覆外径範囲 適用電線範囲
INS. RANGE
WIRE RANGE
梱包½態
PACKAGING
SCALE
端子½状
FORM
発注番号
ORDER No.
部品
PART
A
材質
MATERIAL
母材
MATERIAL
りん青銅
PHOSPHOR BRONZE
金めっき：めっき厚は表参照のこと
GOLD PLATING：SEE TABLE FOR PLATING THICKNESS
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
DIMENSION UNITS
mm
ANGULAR TOL
±
±
±
±
±
±
20:1
3.0 °
CURRENT REV DESC: REDRAWN AND
REVISED
GENERAL TOLERANCES
(UNLESS SPECIFIED)
EC NO:
621720
ターミナル 接点部
TERMINAL CONTACT
4 PLACES
3 PLACES
2 PLACES
1 PLACE
0 PLACES
0.2
0.2
0.2
0.2
0.2
下地めっき
ニッケルめっき:1.0 μm MIN.
UNDER PLATING
NICKEL
DOCUMENT STATUS
FORMAT: master-tb-prod-A3
REVISION: H
DATE: 2018/01/18
DRWN:
AISHIKAWA
CHK'D:
AIDA
APPR:
SAKIYAMA
INITIAL REVISION:
DRWN:
AISHIKAWA
APPR:
SAKIYAMA
THIRD ANGLE PROJECTION
DRAWING
2019/06/14
2019/08/20
2019/08/20
2018/12/19
2019/01/28
SERIES
PICO-CLASP 1.0 W/B
CRIMP TERMINAL GOLD PLATING
A
PRODUCT CUSTOMER DRAWING
DOCUMENT NUMBER
DOC TYPE
DOC PART
REVISION
5011930000-SD
MATERIAL NUMBER
CUSTOMER
PSD
000
B
P1
RELEASE DATE
2019/08/20
10:24:07
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
SHEET NUMBER
A3-SIZE
501193
SEE TABLE
1 OF 2
9
8
7
6
5
4
3
2
1
9
8
7
6
5
4
3
2
1
適応½品及び各種仕様書
APPLICABLE PRODUCTS AND VARIOUS SPECIFICATIONS
E
列
ROW
適応ハウジング
APPLY HOUSING
シリーズ番号 SERIES No.
SINGLE
E
INNER LOCK
OUTER LOCK
501330
SMT
501939
SMT
適応嵌合相手
MATE WITH
VERTICAL
GOLD PLATING (THICKNESS)
0.1μm MIN. 0.38μm MIN. 0.76μm MIN.
RIGHT ANGLE
GOLD PLATING (THICKNESS)
0.1μm MIN. 0.38μm MIN. 0.76μm MIN.
VERTICAL
GOLD PLATING (THICKNESS)
0.1μm MIN. 0.38μm MIN. 0.76μm MIN.
RIGHT ANGLE
GOLD PLATING (THICKNESS)
0.1μm MIN. 0.38μm MIN. 0.76μm MIN.
D
シリーズ番号 SERIES No.
½品仕様書
PRODUCT SPECIFICATION
取扱説明書
APPLICATION SPECIFICATION
504449
203556
203557
202396
203558
203559
501940
203560
203561
501953
203562
203563
D
5013300000-PS 002
5013300000-AS 000
5019390000-PS 001
列
ROW
DUAL
C
INNER LOCK
C
適応ハウジング
APPLY HOUSING
シリーズ番号 SERIES No.
501189
SMT
適応嵌合相手
MATE WITH
VERTICAL
GOLD PLATING (THICKNESS)
0.1μm MIN. 0.38μm MIN. 0.76μm MIN.
RIGHT ANGLE
GOLD PLATING (THICKNESS)
0.1μm MIN. 0.38μm MIN. 0.76μm MIN.
B
シリーズ番号 SERIES No.
½品仕様書
PRODUCT SPECIFICATION
取扱説明書
APPLICATION SPECIFICATION
B
501190
203564
203565
501571
203566
203567
5011890000-PS 001
5011890000-AS 000
½品篏合図は各"適応篏合相手"図面参照のこと
MATING VIEW：REFER TO EACH "MATE WITH" PART DRAWING
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
DIMENSION UNITS
SCALE
A
圧着端子 梱包仕様書
PACKING SPECIFICATION OF
CRIMP TERMINAL
PART NUMBER
SPECIFICATION NUMBER
mm
ANGULAR TOL
±
±
±
±
±
±
1:1
3.0 °
CURRENT REV DESC: REDRAWN AND
REVISED
GENERAL TOLERANCES
(UNLESS SPECIFIED)
EC NO:
621720
4 PLACES
0.2
0.2
0.2
0.2
0.2
501193 7000 / 8000 / 9000
SPK-501193-001
3 PLACES
2 PLACES
1 PLACE
0 PLACES
DRWN:
AISHIKAWA
CHK'D:
AIDA
APPR:
SAKIYAMA
INITIAL REVISION:
DRWN:
AISHIKAWA
APPR:
SAKIYAMA
THIRD ANGLE PROJECTION
DRAWING
2019/06/14
2019/08/20
2019/08/20
2018/12/19
2019/01/28
SERIES
PICO-CLASP 1.0 W/B
CRIMP TERMINAL GOLD PLATING
A
PRODUCT CUSTOMER DRAWING
DOCUMENT NUMBER
DOC TYPE
DOC PART
REVISION
5011930000-SD
MATERIAL NUMBER
CUSTOMER
PSD
000
B
DOCUMENT STATUS
FORMAT: master-tb-prod-A3
REVISION: H
DATE: 2018/01/18
P1
RELEASE DATE
2019/08/20
10:24:07
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
SHEET NUMBER
A3-SIZE
501193
2 OF 2
9
8
7
6
5
4
3
2
1
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