IC,SRAM,1KX4,CMOS,LLCC,18PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Reach Compliance Code | not_compliant |
| Maximum access time | 320 ns |
| I/O type | COMMON |
| JESD-30 code | R-XQCC-N18 |
| JESD-609 code | e0 |
| memory density | 4096 bit |
| Memory IC Type | STANDARD SRAM |
| memory width | 4 |
| Number of terminals | 18 |
| word count | 1024 words |
| character code | 1000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 1KX4 |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC |
| encapsulated code | QCCN |
| Encapsulate equivalent code | LCC18,.3X.35 |
| Package shape | RECTANGULAR |
| Package form | CHIP CARRIER |
| Parallel/Serial | PARALLEL |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum standby current | 0.000015 A |
| Minimum standby current | 2 V |
| Maximum slew rate | 0.014 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Base Number Matches | 1 |
| HM4-6514-9 | HM4-6514B-9 | HM4-6514B-8 | |
|---|---|---|---|
| Description | IC,SRAM,1KX4,CMOS,LLCC,18PIN,CERAMIC | IC,SRAM,1KX4,CMOS,LLCC,18PIN,CERAMIC | IC,SRAM,1KX4,CMOS,LLCC,18PIN,CERAMIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant |
| Maximum access time | 320 ns | 220 ns | 220 ns |
| I/O type | COMMON | COMMON | COMMON |
| JESD-30 code | R-XQCC-N18 | R-XQCC-N18 | R-XQCC-N18 |
| JESD-609 code | e0 | e0 | e0 |
| memory density | 4096 bit | 4096 bit | 4096 bit |
| Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| memory width | 4 | 4 | 4 |
| Number of terminals | 18 | 18 | 18 |
| word count | 1024 words | 1024 words | 1024 words |
| character code | 1000 | 1000 | 1000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C | 85 °C | 125 °C |
| Minimum operating temperature | -40 °C | -40 °C | -55 °C |
| organize | 1KX4 | 1KX4 | 1KX4 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE |
| Package body material | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | QCCN | QCCN | QCCN |
| Encapsulate equivalent code | LCC18,.3X.35 | LCC18,.3X.35 | LCC18,.3X.35 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL |
| power supply | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| Maximum standby current | 0.000015 A | 0.000015 A | 0.000025 A |
| Minimum standby current | 2 V | 2 V | 2 V |
| Maximum slew rate | 0.014 mA | 0.019 mA | 0.019 mA |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES |
| technology | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD | NO LEAD | NO LEAD |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | QUAD | QUAD | QUAD |
| Base Number Matches | 1 | 1 | - |
| Maker | - | Renesas Electronics Corporation | Renesas Electronics Corporation |
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