WS128K32-15G4TCA datasheet, PDF

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WS128K32-15G4TCA: DescriptionSRAM Module, 128KX32, 15ns, CMOS, CQFP68, 40 MM, 3.56 MM HEIGHT, CERAMIC, QFP-68; Categorystorage storage; File Size406KB，9 Pages; ManufacturerWhite Electronic Designs Corporation; Websitehttp://www.wedc.com/

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WS128K32-15G4TCA Overview

SRAM Module, 128KX32, 15ns, CMOS, CQFP68, 40 MM, 3.56 MM HEIGHT, CERAMIC, QFP-68

WS128K32-15G4TCA Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	40 MM, 3.56 MM HEIGHT, CERAMIC, QFP-68
Reach Compliance Code	unknown
Maximum access time	15 ns
Other features	USER CONFIGURABLE AS 512K X 8
Spare memory width	16
JESD-30 code	S-CQFP-F68
JESD-609 code	e0
length	39.6 mm
memory density	4194304 bit
Memory IC Type	SRAM MODULE
memory width	32
Number of functions	1
Number of terminals	68
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	128KX32
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QFF
Package shape	SQUARE
Package form	FLATPACK
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	3.56 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	TIN LEAD
Terminal form	FLAT
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	39.6 mm
Base Number Matches	1

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White Electronic Designs

WS128K32-XXX

128Kx32 SRAM MODULE, SMD 5962-93187 & 5962-95595

FEATURES

Access Times of 15, 17, 20, 25, 35, 45, 55ns

MIL-STD-883 Compliant Devices Available

Packaging

• 66 pin, PGA Type, 1.075" square, Hermetic

Ceramic HIP (Package 400)

• 68 lead, 40mm CQFP (G4T)

, 3.56mm (0.140")

(Package 502)

• 68 lead, 22.4mm CQFP (G2U), 3.56mm (0.140"),

(Package 510)

• 68 lead, 22.4mm (0.880") square, CQFP (G2L),

5.08mm (0.200") high, (Package 528)

Organized as 128Kx32; User Conﬁgurable as

256Kx16 or 512Kx8

Commercial, Industrial and Military Temperature

Ranges

5 Volt Power Supply

Low Power CMOS

TTL Compatible Inputs and Outputs

Built in Decoupling Caps and Multiple Ground Pins

for Low Noise Operation

Weight:

WS128K32-XG2UX - 8 grams typical

WS128K32-XG2LX - 8 grams typical

WS128K32-XH1X - 13 grams typical

WS128K32-XG4TX

- 20 grams typical

Devices are upgradeable to 512Kx32

This product is subject to change without notice.

FIGURE 1 – PIN CONFIGURATION FOR WS128K32N-XH1X

Top View

I/O

GND

I/O

OE#

I/O

GND

I/O

I/O 0-7

I/O 8-15

I/O 16-23

I/O 24-31

OE#

A0-16

WE#1 CS#1

Pin Description

I/O

0-31

0-16

1-4

OE#

GND

Data Inputs/Outputs

Address Inputs

Write Enables

Chip Selects

Output Enable

Power Supply

Ground

Not Connected

Block Diagram

WE#2 CS#2

WE#3 CS#3

WE#4 CS#4

128K x 8

May 2004

Rev. 15

White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

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