Its optically coupled outputs, which use the patented
OptoMOS architecture, are controlled by a highly
efficient GaAIAs infrared LED.
This dual single-pole OptoMOS relay provides a more
compact design solution than discrete single-pole
relays in a variety of applications, and saves board
space by incorporating both switches in a single 8-pin
package.
Features
•
3750V
rms
Input/Output Isolation
•
Low Drive Power Requirements (TTL/CMOS
Compatible)
•
High Reliability
•
Arc-Free With No Snubbing Circuits
•
FCC Compatible
•
VDE Compatible
•
No EMI/RFI Generation
•
Small 8-Pin Package
•
Machine Insertable, Wave Solderable
•
Surface Mount Tape & Reel Versions Available
Approvals
•
UL Recognized Component: File E76270
•
CSA Certified Component: Certificate 1175739
•
EN/IEC 60950-1 Certified Component:
TUV Certificate B 09 07 49410 004
Applications
•
Telecommunications
•
Telecom Switching
•
Tip/Ring Circuits
•
Modem Switching (Laptop, Notebook, Pocket Size)
•
Hook Switch
•
Dial Pulsing
•
Ground Start
•
Ringing Injection
•
Instrumentation
•
Multiplexers
•
Data Acquisition
•
Electronic Switching
•
I/O Subsystems
•
Meters (Watt-Hour, Water, Gas)
•
Medical Equipment-Patient/Equipment Isolation
•
Security
•
Aerospace
•
Industrial Controls
Ordering Information
Part #
LBB127
LBB127S
LBB127STR
LBB127P
LBB127PTR
Description
8-Pin DIP (50/Tube)
8-Pin Surface Mount (50/Tube)
8-Pin Surface Mount (1,000/Reel)
8-Pin Flatpack (50/Tube)
8-Pin Flatpack (1,000/Reel)
Pin Configuration
+ Control - Switch #1
– Control - Switch #1
+ Control - Switch #2
– Control - Switch #2
1
2
3
4
8
7
6
5
Load - Switch #1
Load - Switch #1
Load - Switch #2
Load - Switch #2
Switching Characteristics of
Normally Closed (Form B) Devices
Form-B
I
F
I
LOAD
90%
10%
t
off
t
on
Pb
DS-LBB127-R05
e
3
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Absolute Maximum Ratings @ 25°C
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation
1
Total Power Dissipation
2
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
2
LBB127
Ratings
250
5
50
1
150
800
3750
-40 to +85
-40 to +125
Units
V
P
V
mA
A
mW
mW
V
rms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Derate linearly 1.33 mW / °C
Derate linearly 6.67 mW / °C
Electrical Characteristics @ 25°C
Parameter
Output Characteristics
Load Current
Continuous
1
Peak
On-Resistance
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Input to Output Capacitance
1
Conditions
Symbol
Min
Typ
Max
Units
-
t =10ms
I
L
=200mA
V
L
=250V
P
I
L
I
LPK
R
ON
I
LEAK
t
on
t
off
C
OUT
I
F
I
F
V
F
I
R
C
I/O
-
-
-
-
-
-
-
-
0.4
0.9
-
-
-
-
8
-
-
-
50
-
0.7
1.2
-
3
200
±400
10
1
5
5
-
5
-
1.4
10
-
mA
rms
/ mA
DC
mA
P
A
I
F
=5mA, V
L
=10V
V
L
=50V, f=1MHz
I
L
=200mA
-
I
F
=5mA
V
R
=5V
-
ms
pF
mA
mA
V
A
pF
If both poles operate, then the load current must be derated so as not to exceed the package power dissipation value.
2
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PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
35
30
Device Count (N)
25
20
15
10
5
0
1.17
1.19
1.21
1.23
1.25
LED Forward Voltage Drop (V)
Device Count (N)
LBB127
Typical LED Forward Voltage Drop
(N=50, I
F
=5mA)
25
20
15
10
5
0
0.03
Typical Turn-On Time
(N=50, I
F
=5mA, I
L
=200mA)
25
20
15
10
5
0
Typical Turn-Off Time
(N=50, I
F
=5mA, I
L
=200mA)
Device Count (N)
0.05
0.07
0.09
0.11
Turn-On Time (ms)
0.13
0.45
0.75
1.05
1.35
1.60
1.95
Turn-Off Time (ms)
25
20
15
10
5
0
Typical I
F
for Switch Operation
(N=50, I
L
=200mA)
25
20
15
10
5
0
Typical I
F
for Switch Dropout
(N=50, I
L
=200mA)
25
20
15
10
5
0
Typical On-Resistance Distribution
(N=50, I
F
=5mA, I
L
=200mA)
Device Count (N)
Device Count (N)
1.4
1.8
2.2
2.6
3.0
LED Current (mA)
3.4
1.0
1.4
1.8
2.2
2.6
LED Current (mA)
3.0
Device Count (N)
5.325
5.495 5.665 5.835 6.005
On-Resistance ( )
6.175
25
20
15
10
5
0
Typical Blocking Voltage Distribution
(N=50, I
F
=5mA)
Device Count (N)
310
314
318
322
326
Blocking Voltage (V
P
)
330
Typical LED Forward Voltage Drop
vs. Temperature
LED Forward Voltage Drop (V)
1.8
Turn-On Time (ms)
1.6
1.4
1.2
1.0
0.8
-40
-20
0
20
40
60
80
100
120
Temperature (ºC)
0.06
0.05
0.04
0.03
0.02
0.01
0
0
5
Typical Turn-On Time
vs. LED Forward Current
(I
L
=200mA)
1.6
1.4
Turn-Off Time (ms)
1.2
1.0
0.8
0.6
0.4
0.2
0
Typical Turn-Off Time
vs. LED Forward Current
(I
L
=200mA)
I
F
=50mA
I
F
=30mA
I
F
=20mA
I
F
=10mA
I
F
=5mA
10
15
20
25
30
35
40
45
50
0
5
10
15
20
25
30
35
40
45
50
LED Forward Current (mA)
LED Forward Current (mA)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
R05
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PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
Typical Turn-On Time
vs. Temperature
(I
F
=5mA, I
L
=200mA)
Typical Turn-Off Time
vs. Temperature
(I
L
=200mA)
Load Current (mA)
LBB127
Maximum Load Current
vs. Temperature
250
200
150
100
50
0
0.12
Turn-On Time (ms)
0.10
0.08
0.06
0.04
0.02
0
-40
-20
2.5
Turn-Off Time (ms)
2.0
I
F
=5mA
1.5
I
F
=10mA
1.0
I
F
=20mA
0.5
0
0
20
40
60
Temperature (ºC)
80
100
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
120
Temperature (ºC)
Temperature (ºC)
4.5
4.0
LED Current (mA)
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
-40
Typical I
F
for Switch Operation
vs. Temperature
(I
L
=200mA)
4.0
3.5
LED Current (mA)
Typical I
F
for Switch Dropout
vs. Temperature
(I
L
=200mA)
On-Resistance ( )
8
7
6
5
4
3
2
1
0
Typical On-Resistance
vs. Temperature
(I
F
=5mA, I
L
=200mA)
3.0
2.5
2.0
1.5
1.0
0.5
0
-20
0
20
40
60
Temperature (ºC)
80
100
-40
-20
0
20
40
60
Temperature (ºC)
80
100
-40
-20
0
20
40
60
80
100
Temperature (ºC)
Typical Load Current
vs. Load Voltage
200
Blocking Voltage (V
P
)
150
Load Current (mA)
100
50
0
-50
-100
-150
-200
-1.2
-0.8
-0.4
0
0.4
0.8
1.2
400
350
300
250
200
150
100
50
0
-40
Typical Blocking Voltage
vs. Temperature
(I
F
=5mA)
0.045
0.040
0.035
Leakage (A)
0.030
0.025
0.020
0.015
0.010
0.005
-20
0
20
40
60
80
100
0
-40
Typical Leakage vs. Temperature
Measured across Pins 5&6 or 7&8
-20
0
Load Voltage (V)
Temperature (ºC)
20
40
60
Temperature (ºC)
80
100
Energy Rating Curve
1.2
1.0
Load Current (A)
0.8
0.6
0.4
0.2
0
10 s 100 s 1ms 10ms 100ms
Time
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
1s
10s 100s
4
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R05
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Manufacturing Information
Moisture Sensitivity
LBB127
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard,
IPC/JEDEC J-STD-020,
in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a
Moisture Sensitivity Level (MSL) rating
as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard
IPC/JEDEC J-STD-033.
Device
LBB127 / LBB127S / LBB127P
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is
ESD Sensitive,
and should be handled according to the industry standard
JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020
must be observed.
Device
LBB127 / LBB127S
LBB127P
Maximum Temperature x Time
250ºC for 30 seconds
260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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