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MBL82288-8CZ

Description
Bus Controller, MOS, CDIP20,
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size572KB,20 Pages
ManufacturerFUJITSU
Websitehttp://edevice.fujitsu.com/fmd/en/index.html
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MBL82288-8CZ Overview

Bus Controller, MOS, CDIP20,

MBL82288-8CZ Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
package instructionDIP, DIP20,.3
Reach Compliance Codecompliant
JESD-30 codeR-XDIP-T20
JESD-609 codee0
Number of terminals20
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP20,.3
Package shapeRECTANGULAR
Package formIN-LINE
power supply5 V
Certification statusNot Qualified
Nominal supply voltage5 V
surface mountNO
technologyMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Base Number Matches1
This Material Copyrighted By Its Respective Manufacturer

MBL82288-8CZ Related Products

MBL82288-8CZ MBL82288-8P MBL82288-6CZ MBL82288-6P
Description Bus Controller, MOS, CDIP20, Bus Controller, MOS, PDIP20, Bus Controller, MOS, CDIP20, Bus Controller, MOS, PDIP20,
Is it Rohs certified? incompatible incompatible incompatible incompatible
package instruction DIP, DIP20,.3 DIP, DIP20,.3 DIP, DIP20,.3 DIP, DIP20,.3
Reach Compliance Code compliant compliant compliant compliant
JESD-30 code R-XDIP-T20 R-PDIP-T20 R-XDIP-T20 R-PDIP-T20
JESD-609 code e0 e0 e0 e0
Number of terminals 20 20 20 20
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C
Package body material CERAMIC PLASTIC/EPOXY CERAMIC PLASTIC/EPOXY
encapsulated code DIP DIP DIP DIP
Encapsulate equivalent code DIP20,.3 DIP20,.3 DIP20,.3 DIP20,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE IN-LINE
power supply 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Nominal supply voltage 5 V 5 V 5 V 5 V
surface mount NO NO NO NO
technology MOS MOS MOS MOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL
Base Number Matches 1 1 1 1
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