2008-05
my-d™ proximity 2
S LE 6 6 RxxS
Intelligent EEPROM with Contactless
Interface compliant to
I S O⁄IEC 14443 Type A
Short Product Information
Chipcard & Security ICs
Important:
For further information please contact:
Infineon Technologies AG in Munich, Germany,
Chip Card & Security ICs,
Fax +49 (0)89 / 234-955 9372
E-Mail: security.chipcard.ics@infineon.com
Edition 2008-05-13
Published by
Infineon Technologies AG
81726 Munich, Germany
©
2008 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in
question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
my-d™ proximity 2
SLE 66RxxS
my-d™ proximity 2
Intelligent EEPROM with Contactless Interface compliant to ISO⁄IEC 14443 Type A
Revision History: 2008-05-13
Previous Version:
Page
Subjects (major changes since last revision)
initial version
Trademarks of Infineon Technologies AG
my-d™.
Short Product Information
3
2008-05-13
my-d™ proximity 2
SLE 66RxxS
Features
Intelligent EEPROM
with Contactless Interface compliant to ISO/IEC 14443 Type A
Contactless Interface
• Physical interface and Anticollision compliant to ISO⁄IEC 14443-3 Type A
• Contactless transmission of data and supply energy
• Carrier frequency: 13.56 MHz
• Data rate up to 848 kbit/s from PICC to PCD, 106 kbit/s from PCD to PICC
• Read / write distance up to 10 cm depending on reader antenna configuration
EEPROM
• Up to 5120 bytes in total (R32 version)
–
organized in up to 512 pages (page size 10 byte) located in up to 16 sectors (1 plain and
15 secure sectors)
–
configurable number of sectors (1 to 15) & sector size
–
configurable Key Area with up to 14 key pairs
–
up to 509 pages of user memory (user page size 8 byte)
• Unique IDentification number (UID)
• EEPROM programming time per page < 4 ms
• EEPROM endurance > 100.000 erase/write cycles
1)
• Data retention > 10 years
1)
• Access protection of EEPROM by transport key on chip delivery
• EEPROM Error Correction Unit
Security Features
• Challenge and response security algorithm
– 2-way mutual authentication with 64-bit key
– 2 keys per sector enable hierarchical key management
– multi-level security structure possible
– individual access rights for each key within a sector of each page
– only one sector can be accessed at a time
– 32 bit message authentication code (MAC) verifies data integrity
• Transport key on chip delivery
Value Counters: up to 65536 (value range from 0 to 2
16
-1)
• Each page in the User Area is configurable as a Value Counter
• Support of Anti-Tearing
Electrical characteristics
• ESD protection minimum 2 kV
• Ambient temperature -25°C ... +70°C (for the chip)
1) Values are temperature dependent
Short Product Information
4
2008-05-13
my-d™ proximity 2
SLE 66RxxS
Pin description
1
Ordering and packaging information
Table 1-1
Ordering information
Type
Package
SLE 66R04S C
Die (wafer)
SLE 66R04S NB
NiAu Bumped
SLE 66R04S MCC2 P-MCC2-2-1
SLE 66R04S MCC8 P-MCC8-2-3
SLE 66R16S C
Die (wafer)
SLE 66R16S NB
NiAu Bumped
SLE 66R16S MCC2 P-MCC2-2-1
SLE 66R16S MCC8 P-MCC8-2-3
SLE 66R32S C
Die (wafer)
SLE 66R32S NB
NiAu Bumped
SLE 66R32S MCC2 P-MCC2-2-1
SLE 66R32S MCC8 P-MCC8-2-3
Total Memory
512 bytes
2048 bytes
4096 bytes
Security Pages Ordering code
Yes
64
on request
on request
on request
on request
256
on request
on request
on request
on request
512
on request
on request
on request
on request
For more ordering information (wafer thickness and height of NiAu-Bump) please contact your
local Infineon sales office.
1.1
Pin description
Figure 1-1
Pin configuration Module Contactless Card - MCC2 (top / bottom view)
Figure 1-2
Pin configuration Module Contactless Card - MCC8 (top / bottom view)
Short Product Information
5
2008-05-13