K50H-3CU-SE datasheet, PDF - EEWORLD Datasheet

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K50H-3CU-SE: DescriptionClock Crystal Oscillators Surface Mount Type; File Size197KB，7 Pages; ManufacturerKSS Kinseki; Websitehttp://www.kinseki.co.jp/eng/

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K50H-3CU-SE Overview

Clock Crystal Oscillators Surface Mount Type

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CMOS / 3.3V / 7.0×5.0A

Clock Crystal Oscillators

Surface Mount Type

K50H-3C

Series

Features

• Miniature ceramic package

• Highly reliable with seam welding

• CMOS output

• Supply voltage V

=3.3V

• Internal Bypass Capacitor

• Low Jitter

•

±25ppm

available

How to Order

K50H-3C 0 - S E 125.000

w er

qType(7×5

SMD, 3.3V)

wFrequency

Stability Code(See Table1)

eDuty

Ratio(S: 45% to 55% STD)

rEnable/Disable

Function(STD)

tOscillation

Frequency(Ex.: 125.000MHz)

Packaging(Tape & Reel 1,000pcs/reel)

Table 1

Stability

OPR

(°C)

Code (ppm)

−10

+70

(Standard)

±100 −40

+85

(Extend)

Note

Standard specifications

With only certain

frequencies

With only certain

frequencies

Pb Free

RoHS Conforming

Specifications

Item

Output Frequency Range

Frequency Stability

Storage Temperature Range

Operating Temperature Range

Max. Supply Voltage

Supply Voltage

Current Consumption

(Maximum Loaded)

Duty Ratio(Symmetry)

Rise/Fall Time

(10% V

to 90% V

Maximum Loaded)

Output Voltage-"L"

Output Voltage-"H"

Output Load

Input Voltage Range

Input Voltage-"L"

Input Voltage-"H"

Output Disable Time

Output Enable Time

Start-up Time

Deterministic Jitter pk-pk

1Sigma jitter

Symbol

OUT

SBY

STG

OPR

-----

Stability:

±50ppm, ±100ppm

(Ext Temp)

Stability:

±25ppm, ±30ppm, ±50ppm

(Ext Temp)

Conditions

Overall conditions:

initial tolerance, operating temperature range, rated

power supply voltage change, load change, aging(1year

@25°C), shock and vibration

Standard

Extend(option)

SYM

Tr/Tf

50≤F

OUT

≤

85MHz

85<F

OUT

≤100MHz

100<F

OUT

≤135MHz

135<F

OUT

≤160MHz

Standby Function

@50% V

50≤F

OUT

<100MHz

100≤F

OUT

≤160MHz

20% V

to 80% V

10% V

to 90% V

20% V

to 80% V

10% V

to 90% V

-----

1sigma

CMOS

@Minimum operating Voltage to be 0sec.

Measured with "Wavecrest DTS-2079",

VISI 6.3.1

Min.

−25

−30

−50

−55

−10

−40

−0.5

2.97

3.14

-----

90% V

-----

70% V

-----

Max.

170

+25

+30

+50

+125

+70

+85

7.0

3.63

3.46

3.5

5.0

1.5

2.0

10% V

-----

30% V

-----

150

Units

MHz

ppm

°C

Volt

µA

Volt

psec

Note: Please contact us for inquires about extended operating temperature range, available frequencies and other conditions.

All electrical characteristics are defined at the maximum load and operating temperature range.

Dimensions

7.0

1.4

0.6

(Unit : mm)

Recommended Land Pattern

5.08

2.0

(Unit : mm)

5.0

1.1

2.6

1.8

0.7

5.08

1.6

Pin Connections

Control

Case GND

Output

Enable/Disable Function

Pin1

Pin3(Output)

Open

Active

"H" Level

Active

"L" Level High Z(No-Oscillation)

Note: K50H Series has Bypass Capacitor of 0.01µF

between V

and GND.

4.2

Plating: Ni+Au

Tolerance:

±0.2

Handling Notes for Crystal Oscillators

1. Shock & Drop • Vibration

Do not inflict excessive shock and mechanical vibration that

exceeds the norm, such as hitting or mistakenly dropping, when

transporting and mounting on a board. There are cases when

pieces of crystal break, and pieces that are used become

damaged, and become inoperable. When a shock or vibration that

exceeds the norm has been inflicted, make sure to check the

characteristics.

2. Cleaning

Since a crystal piece can be broken by resonance when a crystal

device is cleaned by ultrasonic cleaning. Be careful when carrying

out ultrasonic cleaning.

3. Soldering conditions

To maintain the product reliability, please follow recommended conditions.

Standard soldering iron conditions

Crystal Oscillators

Soldering iron

Time

280˚C ~ 340˚C

3+1/−0sec. max

Reflow conditions (Example)

Peak:260

-10

˚C

10sec. max

Temperature(˚C)

180

-10

˚C

200˚C min

40sec. max

120sec. max

Time(sec.)

Crystal Oscillators/TCXOs

Recommended reflow Conditions vary depending upon products.

Please check with the respective specification for details.

4. Mounting Precautions

Leaded Devices

The special glass, located where the lead of the retainer base comes out, is aligned with the coefficient of thermal expansion of the lead, If the

glass is damaged and cracks appear, there may be cases in which performance deteriorates and it fails to operate.

Consequently, when making the device adhere closely and applying solder, align the gap of the hole of the board with the gap of the lead and

insert without excessive force.

When making the device adhere closely to a through hole board and applying solder, be careful that the solder does not get into the metal part

of the retainer base and cause a short. Putting in an insulation spacer is one more method of preventing a short circuit.

When the lead is mounted floating, fix it as far as possible so that contact with other parts and the breakage due to the fatigue, and the

mechanical resonance of the lead will not occur.

When the lead is bent and used, do not bend the lead directly from the base, separate it 0.5mm or more and then bend it. When bending,

before attaching to the board, fix the place where the lead comes out in advance and attach it after bending so that a crack does not occur in

the glass part.

Surface Mount Devices

The lead of the device and the pattern of the board is soldered on the surface. Since extreme deformation of the board tears off the pattern,

tears off the lead metal, cracks the solder and damages the sealed part of the device and there are cases in which performance deteriorates

and operation fails, use it within the stipulated bending conditions. Due to the small cracks in the board resulting from mounting, please pay

sufficient attention when attaching a device at the position where the warping of the board is great.

When using an automatic loading machine, as far as possible, select a type that has a small impact and use it while confirming that there is no

damage.

Surface mount devices are NOT flow soldering compatible.

5. Storage Condition

Since the long hour high temperature and low temperature storage, as well as the storage at high humidity are causes of deterioration in

frequency accuracy and solderability.

Parts should be stored in temperature range of -5 to +40C˚, humidity 40 to 60% RH, and avoid direct sunlight. Then use within 6 months.

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