Product Guide
1101W Series Standard Type Flat Lens SMT LED
s
Features
• Flat lens type with a wide viewing angle of 150°
• Excellent for backlighting LCDs and indicators
s
Applications
• Computer / Telecommunications
• Industrial / Medical
• Audio visual equipment
s
Outline Dimensions
Unit: mm
Tolerances + 0.2
s
Electro-Optical Characteristics
Type No.
Material Emitted
Color
GaAIAs
GaAsP
GaAsP
GaP
GaP
GaP
Red
Orange
Yellow
Yellow Green
Green
Pure Green
(Ta=25°C)
Wavelength
I
F
Peak
λ
p
TYP.
Spectral Line
Dominant Half Width
λ
d
λ
∆λ
TYP.
TYP.
I
F
Lens
Color
Luminous
Intensity
IV
MIN.
TYP.
Forward
Voltage
V
TYP
MAX.
F
Reverse Viewing
Current
IR
Angle
MAX.
V
R
I
F
(2
θ
1/2)
BR1101W
AA1101W
AY1101W
PY1101W
PG1101W
BG1101W
4.4
2.8
Water
Clear
12.8 20 660
5.6
4.0
8.0
4.8
2.0
20 605
20 580
20 570
20 560
20 555
mA
647
606
590
572
567
558
nm
30
30
30
30
30
30
20
20
20
20
20
20
mA
1.7 2.0
2.2 2.5
2.2 2.5
2.1 2.5
2.1 2.5
2.1 2.5
V
20
20
20
20
20
20
mA
100
100
100
100
100
100
µA
4
4
4
4
4
4
V
Deg.
150°
2.0
4.0
2.4
0.7
Units
mcd
s
Absolute Maximum Ratings
Red
Orange
AA
75
30
70
4
Yellow
AY
75
30
70
4
-30 to +85
-40 to +100
0.42 (DC) 0.93 (Pulse)
(Ta=25°C)
Yellow
Green
PY
75
30
70
4
Green
PG
75
30
70
4
Pure
Green
BG
75
30
70
4
mW
mA
mA
V
°C
°C
mA/°C
Item
Symbol
Power Dissipation
Forward Current
Peak Forward Current
Reverse Voltage
Operating Temperature
Storage Temperature
Derating*
Pd
I
F
I
FM
V
R
Topr
Tstg
∆I
F
BR
60
30
70
4
Units
* Ta=25°C,
I
FM
applies for the pulse width
≤
1msec. and duty cycle
≤1/20.
s
Taping Specifications
4+0.1
φ
1.5
+0.1
0
(1.8)
1.75 + 0.1
s
Operation Current Derating Chart (DC)
(0.2)
Quantity on tape:
2,500 pieces
per reel
(1.7)
2+0.5
φ
21+0.8
8+0.2
(
φ
1.1)
2+0.05
4+0.1
BR, AA, AY, PY, PG, BG
Center
Hole
3.5+ 0.05
Direction to pull
φ
13+0.2
+1
φ
60 -0
φ
13+0.2
(3.35)
9+0.3
11.4+1
+0
φ
180 3
s
Precautions
Please follow these handling precautions to prevent damage to the chip and
ensure its reliability.
1. Soldering conditions:
• Soldering iron: Temperature at tip of iron: 280°C max. (30W max.)
Soldering time: 3 sec. max.
• Dip soldering: Preheating: 120 ~ 150°C max. (resin surface temp.)
60 ~ 120 sec. max. Bath temperature: 260°C max. Dipping Time: 5 sec. max.
• Reflow Soldering:
LED Surface Temperature
°C
Operation Heating
240
Temperature
rise: 5°C/sec.
Cooling:
—5°C/sec.
s
Spatial Distribution
150
120
Pre-heating
2. Cleaning:
• If cleaning is required, use the following solutions for less than 1 minute,
at less than 40°C.
• Appropriate chemicals: Ethyl alcohol and isopropyl alcohol.
• Effect of ultrasonic cleaning on the LED resin body differs depending on such
factors as the oscillator output, size of PCB and LED mounting method. The
use of ultrasonic cleaning should be enforced at proper output after confirming
there is no problem.
Product specifications subject to change without notice. PG1101W-0301
~
0
60 to 120 sec.
5 sec. max
Stanley Electric Sales of America, Inc.
2660 Barranca Parkway, Irvine, CA 92606 • Tel: 800-LED-LCD1 (533-5231) • Fax: 949-222-0555
Website: www.stanley-electric.com
FPGA/CPLD
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