Temperature Measurement
SMD NTC Thermistors with Nickel Barrier Termination, Size 0805
Applications
I
Temperature measurement and compensation in
B574**
V 4**
1,25±0,15
1,3 max.
*)
2,0±0,2
– mobile phone applications
(e.g. battery pack, TCXO, LCD)
– data systems
– automotive electronics
Features
I
Multilayer SMD NTC with inner electrodes
I
Ni barrier termination (AgNiSn)
I
High accuracy:
±
5 % in resistance,
Termination
0,5±0,25
TNT0421-1-E
B
value tolerance down to
±
1,5 % available
on request
I
Excellent long-term ageing stability in
high-temperature and high-humidity environment
I
Superior resistance stability during soldering
(change <1 %)
Options
* Slimline version 0,9 max.
*
available upon request
Dimensions in mm
Approx. weight 13 mg
Alternative resistance ratings, resistance tol.
<
5 % and
B
value tol. < 3 % available on request
Delivery mode
Blister tape, 180-mm reel, PU: 3000 pcs (standard); 330-mm reel, PU: 12000 pcs (on request)
Climatic category (IEC 60068-1)
Max. power at 25
°
C (on PCB)
Resistance tolerance
Rated temperature
B
value tolerance
Dissipation factor (on PCB)
Thermal cooling time constant (on PCB)
Heat capacity
R
25
No. of
R/T
characteristic
8501
8501
8501
8501
8501
B
25/50
K
3470
3470
3470
3470
3470
P
25
1)
∆
R
N
/R
N
T
N
∆
B/B
δ
th
1)
τ
c
1)
C
th
1)
B
25/85
K
3540
3540
3540
3540
3540
55/125/56
210
±
5 %,
±
10 %
25
±
3%
approx. 3,5
approx. 10,0
approx. 35,0
B
25/100
K
3550
3550
3550
3550
3550
B57411V2470+062
B57411V2101+062
B57411V2151+062
B57411V2221+062
B57411V2331+062
mW
°
C
mW/K
s
mJ/K
Ordering code
Ω
47
100
150
220
330
1) Depends on mounting situation
53
05/02
Temperature Measurement
SMD NTC Thermistors with Nickel Barrier Termination, Size 0805
Reliability data
B574**
V 4**
SMD NTC thermistors are tested in accordance with IEC 60068. The parts are mounted on a
standardized PCB in accordance with IEC 60539-1.
Test
Storage in
dry heat
Standard
IEC
60068-2-2
JIS C 0021
IEC
60068-2-3
JIS C 0022
IEC
60068-2-14
JIS C 0025
Test conditions
Storage at upper
category temperature
T:
(125
±
2)
°
C
t:
1000 h
Temperature of air: (40
±
2)
°
C
Relative humidity of air:
(93 +2/–3) %
Duration: 56 days
∆
R
25
/R
25
(typical)
<2%
Remarks
Storage in damp
heat, steady state
<2%
Rapid temperature
cycling
Endurance
Lower test temperature: – 55
°
C < 2 %
Upper test temperature: 125
°
C
Number of cycles: 100
P
max
: 210 mW
T:
(65
±
2)
°
C
t:
1000 h
<2%
Solderability
IEC
60068-2-58
JIS C 0054
Solderability:
(215
±
3)
°
C / (3
±
0,3) s
(235
±
5)
°
C / (2
±
0,2) s
Resistance to soldering heat:
(260
±
5)
°
C / (10
±
1) s
95 % of
terminations
wetted
Resistance drift
after soldering
Reflow soldering profile
Wave soldering profile
<1%
55
05/02
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++49 89 636 09, FAX (0 89) 636-2 26 89
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Published by EPCOS AG
Corporate Communications, P.O. Box 80 17 09, 81617 Munich, GERMANY
++49 89 636 09, FAX (0 89) 636-2 26 89
EPCOS AG 2002. Reproduction, publication and dissemination of this brochure and the information contained therein without
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