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DPZ8MX16NV3-15I

Description
Flash Module, 8MX16, 150ns, CPGA66
Categorystorage    storage   
File Size947KB,15 Pages
ManufacturerTwilight Technology Inc.
Download Datasheet Parametric Compare View All

DPZ8MX16NV3-15I Overview

Flash Module, 8MX16, 150ns, CPGA66

DPZ8MX16NV3-15I Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
package instructionPGA, PGA66,11X11
Reach Compliance Codeunknown
Maximum access time150 ns
command user interfaceYES
Data pollingNO
JESD-30 codeS-XPGA-P66
memory density134217728 bit
Memory IC TypeFLASH MODULE
memory width16
Number of departments/size128
Number of terminals66
word count8388608 words
character code8000000
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize8MX16
Package body materialCERAMIC
encapsulated codePGA
Encapsulate equivalent codePGA66,11X11
Package shapeSQUARE
Package formGRID ARRAY
Parallel/SerialPARALLEL
power supply5 V
Department size64K
Maximum standby current0.0024 A
Maximum slew rate0.13 mA
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formPIN/PEG
Terminal pitch2.54 mm
Terminal locationPERPENDICULAR
switch bitNO
typeNOR TYPE
write protectHARDWARE
Base Number Matches1
128 Megabit FLASH EEPROM
DPZ8MX16NV3
DESCRIPTION:
The DPZ8MX16NV3 ‘’VERSA-STACK’’ module is a
revolutionary new memory subsystem using Dense-Pac
Microsystems’ ceramic Stackable Leadless Chip Carriers
(SLCC) mounted on a co-fired ceramic substrate. It offers 128
Megabits of FLASH EEPROM in a single package envelope of
1.090" x 1.090" x .776".
The DPZ8MX16NV3 is built with two stacks of 8 SLCC
packages each containing a 1 Meg x 8 FLASH memory
devices. Each SLCC is hermetically sealed making the
module suitable for commercial, industrial and military
applications.
By using SLCCs, the ‘’Versa-Stack’’ family of modules offers
a higher board density of memory than available with
conventional through-hole, surface mount, module or hybrid
techniques.
FEATURES:
Organization: 8Meg x 16, 16 Meg x 8
Fast Access Times:
90, 100, 120, 150ns (max.)
High-Density Symmetrically
Blocked Architecture
- Sixteen 64 Kbyte Blocks
Per Device
Extended Cycling Capability
- 10K Block Erase Cycles
Automated Byte Write and
Block Erase
- Command User Interface
- Status Register
SRAM-Compatible Write Interface
Hardware Data Protection Feature
- Erase / Write Lockout during
Power Transitions
66 - Pin PGA
‘’VERSA-STACK’’ Package
FUNCTIONAL BLOCK DIAGRAM
PIN NAMES
A0 - A19
I/O0 - I/O15
CE0 - CE15
WE
OE
V
PP
V
DD
V
SS
N.C.
Address Inputs
Data Input/Output
Chip Enables
Write Enable
Output Enable
Programming
Voltage (+12.0V)
Power (+5V)
Ground
No Connect
PIN-OUT DIAGRAM
30A123-08
REV. D
This document contains information on a product that is currently released
to production at Dense-Pac Microsystems, Inc. Dense-Pac reserves the
right to change products or specifications herein without prior notice.
1

DPZ8MX16NV3-15I Related Products

DPZ8MX16NV3-15I DPZ8MX16NV3-12M DPZ8MX16NV3-10C DPZ8MX16NV3-10M DPZ8MX16NV3-90M
Description Flash Module, 8MX16, 150ns, CPGA66 Flash Module, 8MX16, 120ns, CPGA66 Flash Module, 8MX16, 100ns, CPGA66 Flash Module, 8MX16, 100ns, CPGA66 Flash Module, 8MX16, 90ns, CPGA66
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible
package instruction PGA, PGA66,11X11 PGA, PGA66,11X11 PGA, PGA66,11X11 PGA, PGA66,11X11 PGA, PGA66,11X11
Reach Compliance Code unknown unknown unknown unknown unknown
Maximum access time 150 ns 120 ns 100 ns 100 ns 90 ns
command user interface YES YES YES YES YES
Data polling NO NO NO NO NO
JESD-30 code S-XPGA-P66 S-XPGA-P66 S-XPGA-P66 S-XPGA-P66 S-XPGA-P66
memory density 134217728 bit 134217728 bit 134217728 bit 134217728 bit 134217728 bit
Memory IC Type FLASH MODULE FLASH MODULE FLASH MODULE FLASH MODULE FLASH MODULE
memory width 16 16 16 16 16
Number of departments/size 128 128 128 128 128
Number of terminals 66 66 66 66 66
word count 8388608 words 8388608 words 8388608 words 8388608 words 8388608 words
character code 8000000 8000000 8000000 8000000 8000000
Maximum operating temperature 85 °C 125 °C 70 °C 125 °C 125 °C
Minimum operating temperature -40 °C -55 °C - -55 °C -55 °C
organize 8MX16 8MX16 8MX16 8MX16 8MX16
Package body material CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC
encapsulated code PGA PGA PGA PGA PGA
Encapsulate equivalent code PGA66,11X11 PGA66,11X11 PGA66,11X11 PGA66,11X11 PGA66,11X11
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
power supply 5 V 5 V 5 V 5 V 5 V
Department size 64K 64K 64K 64K 64K
Maximum standby current 0.0024 A 0.0024 A 0.0024 A 0.0024 A 0.0024 A
Maximum slew rate 0.13 mA 0.13 mA 0.13 mA 0.13 mA 0.13 mA
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V
surface mount NO NO NO NO NO
technology CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL MILITARY COMMERCIAL MILITARY MILITARY
Terminal form PIN/PEG PIN/PEG PIN/PEG PIN/PEG PIN/PEG
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location PERPENDICULAR PERPENDICULAR PERPENDICULAR PERPENDICULAR PERPENDICULAR
switch bit NO NO NO NO NO
type NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE
write protect HARDWARE HARDWARE HARDWARE HARDWARE HARDWARE
Base Number Matches 1 1 1 - -
Maker - Twilight Technology Inc. Twilight Technology Inc. Twilight Technology Inc. Twilight Technology Inc.

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