LXP602JC datasheet, PDF - EEWORLD Datasheet

LXP602JC: DescriptionTelecom IC, CMOS, CDIP8; CategoryWireless rf/communication Telecom circuit; File Size587KB，9 Pages; ManufacturerLevel One

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LXP602JC Overview

Telecom IC, CMOS, CDIP8

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	DIP, DIP8,.3
Reach Compliance Code	unknown
JESD-30 code	R-XDIP-T8
JESD-609 code	e0
Number of terminals	8
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP8,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Certification status	Not Qualified
Maximum slew rate	11 mA
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

	LXP602JC	LXP604JC
Description	Telecom IC, CMOS, CDIP8	Telecom IC, CMOS, CDIP8
Is it Rohs certified?	incompatible	incompatible
package instruction	DIP, DIP8,.3	DIP, DIP8,.3
Reach Compliance Code	unknown	unknown
JESD-30 code	R-XDIP-T8	R-XDIP-T8
JESD-609 code	e0	e0
Number of terminals	8	8
Maximum operating temperature	70 °C	70 °C
Package body material	CERAMIC	CERAMIC
encapsulated code	DIP	DIP
Encapsulate equivalent code	DIP8,.3	DIP8,.3
Package shape	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE
power supply	5 V	5 V
Certification status	Not Qualified	Not Qualified
Maximum slew rate	11 mA	11 mA
Nominal supply voltage	5 V	5 V
surface mount	NO	NO
technology	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL
Base Number Matches	1	1

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