LXP602NC datasheet, PDF - EEWORLD Datasheet

LXP602NC: DescriptionTelecom Circuit, 1-Func, CMOS, PDIP8, PLASTIC, DIP-8; CategoryWireless rf/communication Telecom circuit; File Size55KB，1 Pages; ManufacturerIntel; Websitehttp://www.intel.com/

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LXP602NC Overview

Telecom Circuit, 1-Func, CMOS, PDIP8, PLASTIC, DIP-8

Parameter Name	Attribute value
Parts packaging code	DIP
package instruction	DIP,
Contacts	8
Reach Compliance Code	unknown
JESD-30 code	R-PDIP-T8
length	9.59 mm
Number of functions	1
Number of terminals	8
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Certification status	Not Qualified
Maximum seat height	5.334 mm
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Telecom integrated circuit types	TELECOM CIRCUIT
Temperature level	COMMERCIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	7.62 mm
Base Number Matches	1

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