LXP604SE datasheet, PDF - EEWORLD Datasheet

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LXP604SE: DescriptionTelecom Circuit, 1-Func, CMOS, PDSO16, SOIC-16; CategoryWireless rf/communication Telecom circuit; File Size155KB，16 Pages; ManufacturerIntel; Websitehttp://www.intel.com/

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LXP604SE Overview

Telecom Circuit, 1-Func, CMOS, PDSO16, SOIC-16

LXP604SE Parametric

Parameter Name	Attribute value
Parts packaging code	SOIC
package instruction	SOP,
Contacts	16
Reach Compliance Code	unknown
JESD-30 code	R-PDSO-G16
length	10.3 mm
Number of functions	1
Number of terminals	16
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Certification status	Not Qualified
Maximum seat height	2.65 mm
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Telecom integrated circuit types	TELECOM CIRCUIT
Temperature level	INDUSTRIAL
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
width	7.5 mm
Base Number Matches	1

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DATA SHEET

MARCH 1999

LXP600A, LXP602 and LXP604

Low Jitter Clock Adapters (CLADs)

General Description

The LXP600A, LXP602 and LXP604 Clock Adapters

(CLADs) incorporate Level One’s patented frequency

conversion circuitry. The LXP600A and LXP602 convert

a 1.544 MHz input clock to a 2.048 MHz output clock, or

vice versa. The LXP604 converts between 1.544 MHz and

4.096 MHz. Each CLAD produces two different high

frequency output (HFO) clocks for applications which

require a higher-than-baud rate backplane or system clock.

Level One’s patented locking method enables the CLAD to

perform frequency conversion with no external

components, while generating very little jitter on the output

clock. The conversion is digitally controlled so the output

clock (CLKO) is as accurate as the input clock (CLKI), and

the two clocks are frequency-locked together. When an

input frame sync pulse (FSI) is provided, the CLAD also

phase-locks CLKI and CLKO together, and locks the

output frame sync pulse (FSO) to FSI.

Revision 1.1

Features

• Generates a 1.544 MHz clock and its frame sync from

a 2.048 MHz or 4.096 MHz clock and its frame sync,

or vice versa

• Low output jitter meets AT&T Publication 62411 for

1.544 MHz, and ITU Recommendation G.823 for

2.048 MHz

• Digital control of frequency conversion process

• No external components

• Available in 8-pin plastic DIP and 16-pin SOIC

• Pin-selectable operation mode

• Advanced CMOS device requires only a single +5 V

power supply

Applications

• Internal timing system for Channel Banks, Digital

Loop Carriers, Multiplexers, Internal Timing

Generators, PBX, etc.

• Conversion between 2.048 MHz or 4.096 MHz

backplane rates and 1.544 MHz T1 clock rate

• Conversion between North American

International standards (T1/E1 Converter)

and

Frequency Conversion

CLAD

CLKI

CLKO

HFO

LXP600A

LXP602

LXP604

1.544

2.048

1.544

2.048

1.544

4.096

2.048

1.544

2.048

1.544

4.096

1.544

6.144

6.178

8.192

6.176

8.192

6.176

LXP600A, LXP602 and LXP604 Block Diagram

CLKI

Analog

Phase-Locked

Loop

HFO

Feedback

Divider

Frequency

Converter

Output Divider

CLKO

SEL

FSI

Frame Sync

Generator

FSO

Refer to www.level1.com for most current information.

LXP604SE Related Products

	LXP604SE	LXP600ANE	LXP600ASE
Description	Telecom Circuit, 1-Func, CMOS, PDSO16, SOIC-16	Telecom Circuit, 1-Func, CMOS, PDIP8, PLASTIC, DIP-8	Telecom Circuit, 1-Func, CMOS, PDSO16, SOIC-16
Parts packaging code	SOIC	DIP	SOIC
package instruction	SOP,	DIP, DIP8,.3	SOP,
Contacts	16	8	16
Reach Compliance Code	unknown	compliant	unknown
JESD-30 code	R-PDSO-G16	R-PDIP-T8	R-PDSO-G16
length	10.3 mm	9.5885 mm	10.3 mm
Number of functions	1	1	1
Number of terminals	16	8	16
Maximum operating temperature	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	DIP	SOP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	IN-LINE	SMALL OUTLINE
Certification status	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2.65 mm	5.334 mm	2.65 mm
Nominal supply voltage	5 V	5 V	5 V
surface mount	YES	NO	YES
technology	CMOS	CMOS	CMOS
Telecom integrated circuit types	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	GULL WING	THROUGH-HOLE	GULL WING
Terminal pitch	1.27 mm	2.54 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL
width	7.5 mm	7.62 mm	7.5 mm
Base Number Matches	1	1	1

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