HYBRID IC
PRELIMINARY
Notice: This is not a final specification
Some parametric limits are subject to change
YS243DS-15
HYBRID IC FOR ON-BOARD POWER SUPPLY
DESCRIPTION
The
YS243DS-15
is
a
thin-profile
and
lightweight
single-output DC-DC converter. Its output power is 3W and
the input is insulated from the output. With an over-current
protection circuit built-in, the YS243DS-15 is an optimum
solution for onboard power supplies in FA, OA, and control
equipment.
1
2
+Vin
OUTLINE DRAWING
Pin name
243S15
+Vo
Dimensions: mm
7.62
4
15.24
22.0
3
7.62
φ1.0
8.5
-Vo
-Vin
34.0
FEATURES
•Input voltage range: 18 to 36V DC
•Output: +15V, 200½A (output power: 3W)
•Thin-profile and lightweight design
•Insulation between input and output: 500V DC, 1min
•Built-in over-current protection circuit
APPLICATIONS
Best suited to onboard power supplies in FA, OA, and
control equipment.
29.21
BLOCK DIAGRAM
LC FILTER
LC FILTER
+V
IN
1
4
+Vo
CONSTANT-
VOLTAGE
CIRCUIT
BASE
DRIVER
OVER-CURRENT
PROTECTION
CIRCUIT
3
-Vo
-V
IN
2
OPTOCOUPLER
HYBRID IC
PRELIMINARY
Notice: This is not a final specification
Some parametric limits are subject to change
YS243DS-15
HYBRID IC FOR ON-BOARD POWER SUPLY
MAXIMUM RATINGS
(unless otherwise noted, Ta=25°C)
Symbol
V
IN
I
O
P
O
Topr
Tstg
Viso
Parameter
Input voltage
Output current
Output power
Operating temperature
Storage temperature
Input-output isolation
voltage
Conditions
Between: pins 2 and 1
Between pins 4 and 3
Ratings
36
200
3
-10 ~ +70
-20 ~ +85
500
Unit
V
mA
W
°C
°C
V
—
No condensation (*1)
No condensation
DC, 1min
(*1) Please refer to derating curve.
ELECTRICAL CHARACTERISTICS
(unless otherwise noted, V
IN
=24V, Ta=25
°C)
Symbol
V
IN
V
O
Reg-I
Reg-
L
V
P-P
η
Parameter
Input voltage
Output voltage
Input regulation
Load regulation
Ripple voltage
Efficiency
Test conditions
Recommended range
I
O
=0 ~ 200mA
I
O
=200mA, V
IN
=18 ~ 36V
I
O
=0 ~ 200mA
I
O
=200mA
I
O
=200mA
Limits
MIN.
18.0
14.25
TYP.
24.0
15.0
MAX.
36.0
15.75
60
120
120
Unit
V
V
mV
mV
mV
%
—
—
—
—
—
—
—
75
—
TEST CIRCUIT DIAGRAM
+V
IN
1
+V
OUT
4
V
IN
YS243DS-15
I
O
V
V
O
2
-V
IN
3
-V
OUT
2
HYBRID IC
PRELIMINARY
Notice: This is not a final specification
Some parametric limits are subject to change
YS243DS-15
HYBRID IC FOR ON-BOARD POWER SUPLY
TYPICAL CHARACTERISTICS
OUTPUT VOLTAGE - LOAD CURRENT
CHARACTERISTICS
DERATING CHARACTERISTICS
0.25
OUTPUT VOLTAGE V
O
(V)
0.20
0.15
0.10
0.05
0.00
-10
10
30
50
70
90
110
OPERATING TEMPERATURE Topr (°C)
EFFICIENCY - LOAD CURRENT
CHARACTERISTICS
16.0
14.0
LOAD CURRENT I
O
(mA)
12.0
10.0
8.0
6.0
4.0
2.0
0.0
0
V
IN
=24V
Ta=25°C
50
100 150
200 250 300
350 400
LOAD CURRENT I
O
(mA)
EFFICIENCY - INPUT VOLTAGE
CHARACTERISTICS
100
100
80
EFFICIENCY
η
(%)
EFFICIENCY
η
(%)
80
60
40
V
IN
=24V
Ta=25°C
60
40
I
O
=200mA
Ta=25°C
20
20
0
0
50
100 150
200 250 300 350 400
LOAD CURRENT I
O
(mA)
OUTPUT VOLTAGE - INPUT VOLTAGE
CHARACTERISTICS
0
12.0
16.0
20.0
24.0
28.0
32.0
36.0
40.0
INPUT VOLTAGE V
IN
(V)
INPUT CURRENT - INPUT VOLTAGE
CHARACTERISTICS
16.0
14.0
12.0
10.0
8.0
6.0
4.0
2.0
0.0
0.0
600
500
400
300
200
100
0
INPUT CURRENT I
IN
(mA)
OUTPUT VOLTAGE V
O
(V)
I
O
=200mA
Ta=25°C
I
O
=200mA
Ta=25°C
5.0 10.0 15.0 20.0 25.0 30.0 35.0 40.0
INPUT VOLTAGE V
IN
(V)
0.0
5.0
10.0 15.0 20.0 25.0 30.0 35.0 40.0
INPUT VOLTAGE V
IN
(V)
3
HYBRID IC
PRELIMINARY
Notice: This is not a final specification
Some parametric limits are subject to change
YS243DS-15
HYBRID IC FOR ON-BOARD POWER SUPLY
FOR SAFETY USING
Great detail and careful attention are given to the production activity of Hics, such as the development, the quality of production,
and in it’s reliability. However the reliability of Hics depends not only on their own factors but also in their condition of usage.
When handling Hics, please note the following cautions.
CAUTIONS
Packing
The materials used in packing Hics can only withstand normal external conditions.
When exposed to outside shocks, rain and certain environmental contaminators, the packing
materials will deteriorates. Please take care in handling.
1)
2)
3)
4)
5)
Don’t stack boxes too high. Avoid placing heavy materials on boxes.
Boxes must be positioned correctly during transportation to avoid breakage.
Don't throw or drop boxes.
Keep boxes dry. Avoid rain or snow.
Minimal vibration and shock during transportation is desirable.
Carrying
Storage
When storing Hics, please observe the following notices or possible deterioration of their electrical
characteristics, risk of solderability, and external damage may occur.
1) Devices must be stored where fluctuation of temperature and humidity is minimal, and must
not be exposed to direct sunlight. Store at the normal temperature of 5 to 30 degrees Celsius
with humidity at 40 to 60%.
2) Avoid locations where corrosive gasses are generated or where much dust accumulates.
3) Storage cases must be static proof.
4) Avoid putting weight on boxes.
When extended storage is necessary, Hics must be kept non-processed. When using Hics which
have been stored for more than one year or under severe conditions, be sure to check that the
exterior is free from flaw and other damages.
To prevent any electrical damages, use Hics within the maximum ratings.
current, voltage, etc. must not exceed these conditions.
The temperaqture,
Extended storage
Maximum ratings
Polarity
To protect Hics from destruction and deterioration due to wrong insertion, make sure of polarity in
inserting leads into the board holes, conforming to the external view for the terminal arrangement.
4
HYBRID IC
PRELIMINARY
Notice: This is not a final specification
Some parametric limits are subject to change
YS243DS-15
HYBRID IC FOR ON-BOARD POWER SUPLY
Marketing division, Marketing plannning department
6-41 Tsukuba, Isahaya, Nagasaki, 854-0065 Japan
Keep safety first in your circuit designs!
・ISAHAYA
Electronics Corporation puts the maximum effort into making semiconductor products better and more reliable,
but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal
injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with
appropreate measures such as (1)placement of substitutive, auxiliary circuits, (2)use of non-flammable material or
(3)prevention against any malfunction or mishap.
Notes regarding these materials
・These
materials are intended as a reference to our customers in the selection of the ISAHAYA products best suited to the
customer's application; they don't convey any license under any intellectual property rights, or any other rights, belonging
to ISAHAYA Electronics Corporation or a third party.
・ISAHAYA
Electronics Corporation assumes no responsibility for any damage, or infringement of any third party's rights,
originating in the use of any product data, diagrams, charts or circuit application examples contained in these materials.
・All
information contained in these materials, including product data, diagrams and charts, represent information on products
at the time of publication of these materials, and are subject to change by ISAHAYA Electronics Coporation without notice
due to product improvements or other reasons. It is therefore recommended that customers contact ISAHAYA Electronics
Corporation or an authorized ISAHAYA products distributor for the latest product infomation before purchasing a product
listed herein.
・ISAHAYA
Electronics Corporation products are not designed or manufactured for use in a device or system that is used
under circumstances in which human life is potentially at stake. Please contact ISAHAYA Electronics Corporation or an
authorized ISAHAYA products distributor when considering the use of a product contained herein for any specific perposes,
such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.
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prior written approval of ISAHAYA Electronics Corporation is necessary to reprint or reproduce in whole or in part these
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・If
these products or technologies are subject to the Japanese export control restrictions, they must be exported under a
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・Please
contact ISAHAYA Electronics Corporation or an authorized ISAHAYA products distributor for further details on these
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5
Nov.2002