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SMAJ4743

Description
Zener Diode, 13V V(Z), 10%, 1W, Silicon, Unidirectional, DO-214AC, PLASTIC, SMAJ, 2 PIN
CategoryDiscrete semiconductor    diode   
File Size385KB,3 Pages
ManufacturerMicro Commercial Components (MCC)
Download Datasheet Parametric View All

SMAJ4743 Overview

Zener Diode, 13V V(Z), 10%, 1W, Silicon, Unidirectional, DO-214AC, PLASTIC, SMAJ, 2 PIN

SMAJ4743 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Parts packaging codeDO-214AC
package instructionR-PDSO-C2
Contacts2
Reach Compliance Codecompliant
ECCN codeEAR99
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
JEDEC-95 codeDO-214AC
JESD-30 codeR-PDSO-C2
JESD-609 codee0
Number of components1
Number of terminals2
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)240
polarityUNIDIRECTIONAL
Maximum power dissipation1 W
Certification statusNot Qualified
Nominal reference voltage13 V
surface mountYES
technologyZENER
Terminal surfaceTIN LEAD
Terminal formC BEND
Terminal locationDUAL
Maximum time at peak reflow temperature30
Maximum voltage tolerance10%
Working test current19 mA
Base Number Matches1
MCC
Features
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  omponents
21201 Itasca Street Chatsworth

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SMAJ4728
THRU
SMAJ4764
Silicon
1 Watt
Zener Diodes
DO-214AC
(SMAJ) (High Profile)
H
Cathode Band
For surface mount application (flat handing surface for
Accurate placement)
3.3 thru 100 Volt Voltage Range
High Surge Current Rating
Higher Voltages Available
Available on Tape and Reel
l
l
l
l
Mechanical Data
l
CASE: JEDEC DO-214AC molded plastic body over
passivated chip
l
l
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Terminals solderable per MIL-STD-750, Method 2026
Polarity is indicated by cathode band.
Maximum temperature for soldering: 260 C for 10 seconds.
For surface mount applications with flame retardent epoxy
Meeting UL94V-0
o
J
Maximum Ratings @ 25
o
C Unless Otherwise Specified
Peak Surge
I
S
See Table 1
Current
Maximum
V
F
1.2V
(Note: 1)
Forward
Voltage
Steady State
P
(AV)
1.0W
(Note: 2,3)
Power
Dissipation
Operation And
Storage
Temperature
*
NOTES:
1.
2.
3.
Forward Current @ 200mA.
Mounted on 4.0mm copper pads to each terminal.
Lead temperature at 100 C or less. Derate linearly
above 100 C to zero power at 150 C.
o
o
o
2
A
C
E
F
G
D
B
DIMENSIONS
INCHES
MIN
.078
.067
.002
---
.035
.065
.205
.160
.100
MM
MIN
1.98
1.70
.05
---
.89
1.65
5.21
4.06
2.57
T
J
, T
STG
-55
o
C to
+150
o
C
DIM
A
B
C
D
E
F
G
H
J
MAX
.116
.089
.008
.02
.055
.096
.224
.180
.112
MAX
2.95
2.25
.20
.51
1.40
2.45
5.69
4.57
2.84
NOTE
SUGGESTED SOLDER
PAD LAYOUT
0.090”
0.085”
0.070”
www.mccsemi.com

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