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Datasheet> All Categories > storage> storage> IDT7MC4018S45CS
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IDT7MC4018S45CS

Description
SRAM Module, 64KX6, 45ns, CMOS
Categorystorage    storage   
File Size153KB，6 Pages
ManufacturerIDT (Integrated Device Technology)
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IDT7MC4018S45CS Overview

SRAM Module, 64KX6, 45ns, CMOS

IDT7MC4018S45CS Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Reach Compliance Codenot_compliant
ECCN codeEAR99
Maximum access time45 ns
I/O typeSEPARATE
JESD-30 codeR-XSMA-T40
JESD-609 codee0
memory density393216 bit
Memory IC TypeSRAM MODULE
memory width6
Number of functions1
Number of terminals40
word count65536 words
character code64000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize64KX6
Output characteristics3-STATE
Package body materialUNSPECIFIED
Encapsulate equivalent codeSIP40,.1
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum standby current0.09 A
Minimum standby current4.5 V
Maximum slew rate0.66 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationSINGLE
Maximum time at peak reflow temperatureNOT SPECIFIED
Base Number Matches1

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IDT7MC4018S45CS Related Products

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Description SRAM Module, 64KX6, 45ns, CMOS SRAM Module, 64KX6, 30ns, CMOS SRAM Module, 64KX6, 45ns, CMOS SRAM Module, 64KX6, 55ns, CMOS SRAM Module, 64KX6, 55ns, CMOS SRAM Module, 64KX6, 30ns, CMOS SRAM Module, 64KX6, 35ns, CMOS SRAM Module, 64KX6, 35ns, CMOS SRAM Module, 64KX6, 25ns, CMOS SRAM Module, 64KX6, 20ns, CMOS
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant
ECCN code EAR99 3A001.A.2.C 3A001.A.2.C EAR99 3A001.A.2.C EAR99 EAR99 3A001.A.2.C EAR99 3A991.B.2.B
Maximum access time 45 ns 30 ns 45 ns 55 ns 55 ns 30 ns 35 ns 35 ns 25 ns 20 ns
I/O type SEPARATE SEPARATE SEPARATE SEPARATE SEPARATE SEPARATE SEPARATE SEPARATE SEPARATE SEPARATE
JESD-30 code R-XSMA-T40 R-XSMA-T40 R-XSMA-T40 R-XSMA-T40 R-XSMA-T40 R-XSMA-T40 R-XSMA-T40 R-XSMA-T40 R-XSMA-T40 R-XSMA-T40
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0 e0 e0
memory density 393216 bit 393216 bit 393216 bit 393216 bit 393216 bit 393216 bit 393216 bit 393216 bit 393216 bit 393216 bit
Memory IC Type SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE
memory width 6 6 6 6 6 6 6 6 6 6
Number of functions 1 1 1 1 1 1 1 1 1 1
Number of terminals 40 40 40 40 40 40 40 40 40 40
word count 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words
character code 64000 64000 64000 64000 64000 64000 64000 64000 64000 64000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 125 °C 125 °C 70 °C 125 °C 70 °C 70 °C 125 °C 70 °C 70 °C
organize 64KX6 64KX6 64KX6 64KX6 64KX6 64KX6 64KX6 64KX6 64KX6 64KX6
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
Encapsulate equivalent code SIP40,.1 SIP40,.1 SIP40,.1 SIP40,.1 SIP40,.1 SIP40,.1 SIP40,.1 SIP40,.1 SIP40,.1 SIP40,.1
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum standby current 0.09 A 0.12 A 0.12 A 0.09 A 0.12 A 0.09 A 0.09 A 0.12 A 0.12 A 0.12 A
Minimum standby current 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Maximum slew rate 0.66 mA 0.72 mA 0.72 mA 0.66 mA 0.72 mA 0.66 mA 0.66 mA 0.72 mA 0.9 mA 0.9 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO NO NO NO NO NO NO NO NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL MILITARY MILITARY COMMERCIAL MILITARY COMMERCIAL COMMERCIAL MILITARY COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Maker - - - IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)

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