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PF824-AG11D28

Description
IC Socket, DIP24, 24 Contact(s), 2.54mm Term Pitch, 0.6inch Row Spacing, Press Fit
CategoryThe connector    socket   
File Size57KB,3 Pages
ManufacturerThomas & Betts Corporation
Websitehttp://www.tnb.com/
Download Datasheet Parametric View All

PF824-AG11D28 Overview

IC Socket, DIP24, 24 Contact(s), 2.54mm Term Pitch, 0.6inch Row Spacing, Press Fit

PF824-AG11D28 Parametric

Parameter NameAttribute value
Reach Compliance Codeunknown
ECCN codeEAR99
Other featuresCOMPLIANT FIT HOLE SIZE=.028"
body width0.7 inch
subject depth0.18 inch
body length1.2 inch
Contact to complete cooperationAU
Contact completed and terminatedTIN OVER NICKEL
Contact materialBE-CU
Contact styleRND PIN-SKT
current rating3 A
Device slot typeIC SOCKET
Type of equipment usedDIP24
Dielectric withstand voltage1000VAC V
Shell materialPOLYESTER
Insulation resistance5000000000 Ω
Manufacturer's serial numberPF800
Plug contact pitch0.1 inch
Installation methodSTRAIGHT
Number of contacts24
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
PCB contact patternRECTANGULAR
PCB contact row spacing0.6 mm
Terminal pitch2.54 mm
Termination typePRESS FIT
Base Number Matches1
PF510 & PF800 Series
Pressfit SIP & DIP Sockets
PF510-AG95D-14
PF828-AG95D-28
E
FEATURES:
• Press fit design does not require soldering
• Available in two sizes to fit .028” (0,71) or .040” (1,02) finished hole
• Available in 8 through 64 pin DIP or 1 to 20 pin SIP packages
• Precision four-finger inner contact provides concentric funnel entry for
easy lead insertion
PERFORMANCE SPECIFICATIONS:
MECHANICAL
Vibration ........................ Passed MIL-STD-1344, Method 2005,
Condition II
Shock .............................. Passed MIL-STD-1344, Method 2004,
Condition C, 100 G's
Durability ...................... Passed MIL-STD-1344, Method 2016
Normal Force ................ 200 Grams (7.1 oz.) average with .018" (0,46) dia.
polished steel pin (typ.)
Inner Contact
Retention .................... 7.5 Lbs. per line average
Sleeve Retention
in Plastic .................... 3.0 Lbs. per line minimum
Pin Retention in Board .. 5.0 Lbs. min. per MIL-STD 2166
Insertion Force .............. 179 Grams (6.3 oz.) average with a .018" (0,46)
dia. polished steel pin
Withdrawal Force .......... 63 Grams (2.2 oz.) average with a .018" (0,46)
dia. polished steel pin
ELECTRICAL
Contact Resistance ........ 10 Milliohms
Contact Rating .............. 3 Amps
Capacitance .................... 1.0 pF per MIL-STD 202, Method 305
(contact to contact)
Insulation Resistance .... 5,000 Megohms min. per MIL-STD-1344,
Method 3003.1
Dielectric Withstanding
Voltage ...................... 1,000 Volts RMS per MIL-STD-1344,
Method 3001.1
ENVIRONMENTAL
Humidity ........................ Passed MIL-STD-1344, Method 1002.2, Cond. II
Operation Temperature .. Gold inner contact -55° C to +125° C,
Tin/lead inner contact -55° C to +105° C
Thermal Shock .............. Passed MIL-STD-1344, Method 1003.1, Cond. A
Gas Tight ........................ Passed EIA-364-36
APPLICATION DIMENSIONS:
• PCB Thickness Range: Standard .093" (2,36) minimum
• IC Pin Dimension Range: .016"(0,41) thru .021" (0,53) dia.,
.105" (2,67) min. length
• PCB Hole Size Range: .028"
±
.002" (0,71
±
0,05) and .040
±
.003"
(1,02
±
0,13)
MATERIAL SPECIFICATIONS:
Insulator ........................ Thermoplastic polyester, UL 94V-0
Inner Contact .................. Beryllium copper, gold or tin/lead plated
Sleeve ............................ Brass, tin/lead plated
Quality & Innovation From The
Product Group
E4
Thomas & Betts
1555 Lynnfield Road
Memphis, TN 38119
(901) 682-8221 FAX (901) 537-8805
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