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AMCB21

Description
MULTILAYER CHIP BALUN
File Size178KB,2 Pages
ManufacturerAbracon
Websitehttp://www.abracon.com/index.htm
Download Datasheet View All

AMCB21 Overview

MULTILAYER CHIP BALUN

MULTILAYER CHIP BALUN
AMCB21
FEATURES:
• Phase difference of 180±10 degrees
• Amplitude difference of 0.5 dB max
• Can simplify the complex tuning and circuit design
• Low insertion loss and high attenuation
• Small size SMD chip design
APPLICATIONS:
• WLAN, Bluetooth, GSM
• Wireless Communication
Pb
RoHS
Compliant
2.0 x 1.25 x 0.85mm
| | | | | | | | | | | | | |
STANDARD SPECIFICATIONS:
PARAMETERS
ABRACON P/N:
Operating temperature:
Storage temperature:
Part No.
Unbalance Port Impedance
Balance Port Impedance
Frequency Range
Insertion Loss
Center Frequency
V.S.W.R at Unbalance Port (in BW)
Amplitude Difference
Phase difference
AMCB21
-25°C to + 85°C
-55°C to + 125°C
AMCB21-2450-01
50Ω
100Ω(50Ω+50Ω)
2400~2500MHz
≤1.2dB
2450MHz
≤2.0
(2400½2500 MHz)
≤0.5dB
180±5 Deg.
OPTIONS AND PART IDENTIFICATION:
(Left blank if standard)
AMCB21 -
Center Frequency
eg. 2450 MHz
-
Packaging
Tape and
T
Reel
Balun Type
Please refer to the tables
above.
OUTLINE DRAWING:
ABRACON IS
ISO 9001 / QS 9000
CERTIFIED
Revised: 10.23.07
30332 Esperanza, Rancho Santa Margarita, California 92688
tel 949-546-8000
|
fax 949-546-8001
| www.abracon.com
Visit www.abracon.com for Terms & Conditions of Sale
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