LM4995TMX datasheet, PDF - EEWORLD Datasheet

LM4995TMX: Description1.3W, 1 CHANNEL, AUDIO AMPLIFIER, BGA9, 0.4 MM PICTH, MICRO, BGA-9; CategoryAnalog mixed-signal IC Consumption circuit; File Size1MB，24 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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LM4995TMX Overview

1.3W, 1 CHANNEL, AUDIO AMPLIFIER, BGA9, 0.4 MM PICTH, MICRO, BGA-9

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Parts packaging code	BGA
package instruction	FBGA,
Contacts	9
Reach Compliance Code	compliant
ECCN code	EAR99
Nominal bandwidth	20 kHz
Commercial integrated circuit types	AUDIO AMPLIFIER
JESD-30 code	S-XBGA-B9
JESD-609 code	e1
Humidity sensitivity level	1
Number of channels	1
Number of functions	1
Number of terminals	9
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Nominal output power	1.3 W
Package body material	UNSPECIFIED
encapsulated code	FBGA
Package shape	SQUARE
Package form	GRID ARRAY, FINE PITCH
Certification status	Not Qualified
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	2.4 V
surface mount	YES
Temperature level	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL
Terminal pitch	0.4 mm
Terminal location	BOTTOM
Base Number Matches	1

	LM4995TMX	LM4995SD	LM4995TM
Description	1.3W, 1 CHANNEL, AUDIO AMPLIFIER, BGA9, 0.4 MM PICTH, MICRO, BGA-9	1.25W, 1 CHANNEL, AUDIO AMPLIFIER, DSO8, 3 X 3 MM, 0.5 PICTH, LLP-8	1.3W, 1 CHANNEL, AUDIO AMPLIFIER, BGA9, 0.4 MM PICTH, MICRO, BGA-9
Parts packaging code	BGA	SOIC	BGA
package instruction	FBGA,	HVSON,	FBGA,
Contacts	9	8	9
Reach Compliance Code	compliant	unknown	compliant
ECCN code	EAR99	EAR99	EAR99
Nominal bandwidth	20 kHz	20 kHz	20 kHz
Commercial integrated circuit types	AUDIO AMPLIFIER	AUDIO AMPLIFIER	AUDIO AMPLIFIER
JESD-30 code	S-XBGA-B9	S-XDSO-N8	S-XBGA-B9
Number of channels	1	1	1
Number of functions	1	1	1
Number of terminals	9	8	9
Maximum operating temperature	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C
Nominal output power	1.3 W	1.25 W	1.3 W
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
encapsulated code	FBGA	HVSON	FBGA
Package shape	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY, FINE PITCH	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	GRID ARRAY, FINE PITCH
Certification status	Not Qualified	Not Qualified	Not Qualified
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	2.4 V	2.4 V	2.4 V
surface mount	YES	YES	YES
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	BALL	NO LEAD	BALL
Terminal pitch	0.4 mm	0.5 mm	0.4 mm
Terminal location	BOTTOM	DUAL	BOTTOM
Base Number Matches	1	1	1
Is it Rohs certified?	conform to	-	conform to
JESD-609 code	e1	-	e1
Humidity sensitivity level	1	-	1
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)	-	Tin/Silver/Copper (Sn/Ag/Cu)

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