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TSS901ESC/883

Description
Serial I/O Controller, 3 Channel(s), 25MBps, CMOS, DIE
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size602KB,28 Pages
ManufacturerAtmel (Microchip)
Download Datasheet Parametric View All

TSS901ESC/883 Overview

Serial I/O Controller, 3 Channel(s), 25MBps, CMOS, DIE

TSS901ESC/883 Parametric

Parameter NameAttribute value
Parts packaging codeDIE
package instructionDIE,
Reach Compliance Codeunknown
Address bus width8
boundary scanYES
maximum clock frequency25 MHz
Maximum data transfer rate25 MBps
External data bus width32
JESD-30 codeX-XUUC-N
low power modeYES
Number of serial I/Os3
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialUNSPECIFIED
encapsulated codeDIE
Package shapeUNSPECIFIED
Package formUNCASED CHIP
Certification statusNot Qualified
Filter levelMIL-STD-883 Class S
Maximum supply voltage5.5 V
Minimum supply voltage4.5 V
Nominal supply voltage5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal formNO LEAD
Terminal locationUPPER
uPs/uCs/peripheral integrated circuit typeSERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches1
TSS901E
Intelligent and Flexible IEEE 1355 communication
controller for space
Description and Applications
The TSS901E provides an interface between a Data-
Strobe link - according to the IEEE Std 1355-1995
specification carrying a simple interprocessor
communication protocol - and a data processing node
consisting of a CPU and a communication and data
memory.
The TSS901E offers hardware supported execution of
the major parts of the interprocessor communication
protocol: data transfer between two nodes of a multi-
processor system is performed with minimal host CPU
intervention. The TSS901E can execute simple
commands to provide basic features for system control
functions; a provision of fault tolerant features exists as
well.
Although the TSS901E initial exploitation is for use in
multi-processor systems where the high speed links
standardisation is an important issue and where reliability
is a requirement, it could be used in applications such
as heterogeneous systems or modules without any
communication feature like special image compression
chips, some signal processors, application specific
programmable logic or mass memory.
The TSS901E may also be used in single board systems
where standardised high speed interfaces are needed and
systems containing "non-intelligent" modules such as A/
D-converter or sensor interfaces which can be assembled
with the TSS901E thanks to the "control by link" feature.
Features
q
3 identical bidirectional link channels allowing full
duplex communication under selectable transmit rate
from 1.25 up to 200 Mbit/s in each direction
a COmmunication Memory Interface (COMI)
provides autonomous accesses to a communication
memory which are controlled by an arbitration unit,
allowing two TSS901E to share one Dual Port Ram
without external arbitration
the scalable databus width (8/16/32 bit) allows
flexible integration with any CPU type
little or big endian mode is configurable
a HOst Control Interface (HOCI) gives read/write
accesses to the TSS901E configuration registers and
to the DS-link channels for the controlling CPU
q
device control via one of the three links allows its
use in systems without a local controller
link disconnect detection and parity check at token
(data and control) level; possible checksum
generation for packet level check
power saving mode relying on automatic transmit
rate reduction
a user’s manual of the TSS901E (also called
SMCS332) is available at:
http://www.omimo.be/companies/dasa_000.htm
q
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q
q
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The information contained herein is subject to change without notice.
No responsibility is assumed by Atmel Wireless & Microcontrollers
for using this publication and/or circuits described herein : nor for
any possible infringements of patents or other rights of third parties
which may result from its use.
Rev. B - July 29, 1999
1
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