F-209
TSSH–110–01–S–DH
TSSH–105–01–L–DV
TSSH–120–01–T–D
.025" SHROUDED HEADER
SQ
Mates with:
SSW, SSQ, SSM
Important Note:
This Series will only mate
with SSW, SSQ &
SSM Series
TSSH
SERIES
OTHER
OPTION
TSSH
1
NO. PINS
PER ROW
01
PLATING
OPTION
ROW
OPTION
SPECIFICATIONS
For complete specifications
and recommended PCB layouts
see www.samtec.com?TSSH
Insulator Material:
Black Liquid Crystal
Polymer
Terminal Material:
Phosphor Bronze
Plating:
Au or Sn over
50µ" (1,27µm) Ni
Operating Temp Range:
-55°C to +105°C with Tin;
-55°C to +125°C with Gold
RoHS Compliant:
Yes
05, 10, 15, 20,
25, 30, 34
(–D–RA, –DH)
–S
= 30µ" (0,76µm) Gold on post, Matte Tin on tail
–A
= Alignment Pin
–L
= 10µ" (0,25µm) Gold on post, Matte Tin on tail
05, 10, 15, 20,
25, 30, 35, 36
(–D, –DV)
–T
= Matte Tin
(1,58)
.062
(3,17)
.125
–LC
= Locking Clip
(–DV only)
–D–RA
= Double Row Right Angle Pin
Through-hole
–DH
= Double Row Horizontal Pin
Surface Mount
(No. of positions + 2) x (2,54) .100
(2,54) .100
(2,54)
.100
(1,42)
.056
x
(0,25)
.010
Processing:
Max Processing Temp:
230°C for 60 seconds, or
260°C for 20 seconds 3x
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0,20mm) .008" max (–DH)
(0,20mm) .008" max (–DV)
APPLICATIONS
02
SSM TSSH
(3,43)
.135
01
HORIZONTAL
(No. of positions x
(2,54) .100) + (1,02).040
(0,64) .025 SQ
(5,84)
.230
–M
= Metal Pick &
Place Pad
(–DV only)
(9,65)
.380
(5,71)
.225
x
(4,16)
.164
(2,29)
.090
(1,52)
.060
(2,54)
.100
(3,94)
.155
(1,27)
.050
(7,62)
.300
–D–RA
(2,54)
.100
–DH
–D
= Double Row Vertical Pin
Through-hole
02
–DV
= Double Row Vertical Pin
Surface Mount
No. of positions x
(2,54) .100 + (1,27) .050
72
(2,54) (6,35)
.100 .250
–P
= Plastic Pick &
Place Pad
(–DH only)
5 pos. min
(8,89)
.350
(6,10)
.240
01
(2,54) .100
71
(0,64) .025 SQ
(6,10)
.240
(2,54)
.100
(8,89)
.350
(8,89)
.350
(6,86)
.270
x
(8,26)
.325
(8,89)
.350
(2,69)
.106
–TR
(10,03)
.395
(1,91)
.075
Note:
Some lengths,
styles and options are
non-standard, non-returnable.
–D
–DV
= Tape & Reel
5 to 25 positions
(–DH & –DV only)
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