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HN58V256AFP-12

Description
256k EEPROM (32-kword 】 8-bit) Ready/Busy and RES function (HN58V257A)
Categorystorage    storage   
File Size233KB,25 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
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HN58V256AFP-12 Overview

256k EEPROM (32-kword 】 8-bit) Ready/Busy and RES function (HN58V257A)

HN58V256AFP-12 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerRenesas Electronics Corporation
Parts packaging codeSOIC
package instruction0.400 INCH, PLASTIC, SOP-28
Contacts28
Reach Compliance Codeunknow
ECCN codeEAR99
Maximum access time120 ns
command user interfaceNO
Data pollingYES
Durability100000 Write/Erase Cycles
JESD-30 codeR-PDSO-G28
length18.3 mm
memory density262144 bi
Memory IC TypeEEPROM
memory width8
Humidity sensitivity level1
Number of functions1
Number of terminals28
word count32768 words
character code32000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize32KX8
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP28,.45
Package shapeRECTANGULAR
Package formSMALL OUTLINE
page size64 words
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)225
power supply3/5 V
Programming voltage3 V
Certification statusNot Qualified
Maximum seat height2.5 mm
Maximum standby current0.00002 A
Maximum slew rate0.03 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
switch bitYES
width8.4 mm
Maximum write cycle time (tWC)10 ms
HN58V256A Series
HN58V257A Series
256k EEPROM (32-kword
×
8-bit)
Ready/Busy and
RES
function (HN58V257A)
REJ03C0147-0500Z
(Previous ADE-203-357D (Z) Rev.4.0)
Rev. 5.00
Nov. 17. 2003
Description
Renesas Technology
's
HN58V256A and HN58V257A are electrically erasable and programmable ROMs
organized as 32768-word
×
8-bit. They have realized high speed, low power consumption and high reliability
by employing advanced MNOS memory technology and CMOS process and circuitry technology. They also
have a 64-byte page programming function to make their write operations faster.
Features
Single 3 V supply: 2.7 to 5.5 V
Access time: 120 ns max
Power dissipation:
Active: 20 mW/MHz, (typ)
Standby: 110
µW
(max)
On-chip latches: address, data,
CE, OE, WE
Automatic byte write: 10 ms max
Automatic page write (64 bytes): 10 ms max
Ready/Busy (only the HN58V257A series)
Data
polling and Toggle bit
Data protection circuit on power on/off
Conforms to JEDEC byte-wide standard
Reliable CMOS with MNOS cell technology
10 erase/write cycles (in page mode)
5
10 years data retention
Software data protection
Write protection by
RES
pin (only the HN58V257A series)
Industrial versions (Temperature range:
−20
to 85°C and
−40
to 85°C) are also available.
There are free also lead free products.
Rev.5.00, Nov. 17.2003, page 1 of 22

HN58V256AFP-12 Related Products

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Is it lead-free? Contains lead - Contains lead - Lead free Lead free - Lead free
Is it Rohs certified? incompatible - incompatible - conform to conform to incompatible conform to
Maker Renesas Electronics Corporation - Renesas Electronics Corporation - Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation
Parts packaging code SOIC - TSOP - TSOP SOIC TSOP TSOP
package instruction 0.400 INCH, PLASTIC, SOP-28 - TSOP1, TSSOP28,.53,22 - TSSOP, TSSOP32,.56,20 SOP, SOP28,.45 TSOP1-R, TSSOP32,.56,20 TSOP1, TSSOP28,.53,22
Contacts 28 - 28 - 32 28 32 28
Reach Compliance Code unknow - unknow - unknown unknow unknown unknow
ECCN code EAR99 - EAR99 - EAR99 EAR99 EAR99 EAR99
Maximum access time 120 ns - 120 ns - 120 ns 120 ns 120 ns 120 ns
command user interface NO - NO - NO NO NO NO
Data polling YES - YES - YES YES YES YES
JESD-30 code R-PDSO-G28 - R-PDSO-G28 - R-PDSO-G32 R-PDSO-G28 R-PDSO-G32 R-PDSO-G28
length 18.3 mm - 11.8 mm - 12.4 mm 18.3 mm 12.4 mm 11.8 mm
memory density 262144 bi - 262144 bi - 262144 bit 262144 bi 262144 bit 262144 bi
Memory IC Type EEPROM - EEPROM - EEPROM EEPROM EEPROM EEPROM
memory width 8 - 8 - 8 8 8 8
Number of functions 1 - 1 - 1 1 1 1
Number of terminals 28 - 28 - 32 28 32 28
word count 32768 words - 32768 words - 32768 words 32768 words 32768 words 32768 words
character code 32000 - 32000 - 32000 32000 32000 32000
Operating mode ASYNCHRONOUS - ASYNCHRONOUS - ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C - 70 °C - 70 °C 70 °C 70 °C 70 °C
organize 32KX8 - 32KX8 - 32KX8 32KX8 32KX8 32KX8
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP - TSOP1 - TSSOP SOP TSOP1-R TSOP1
Encapsulate equivalent code SOP28,.45 - TSSOP28,.53,22 - TSSOP32,.56,20 SOP28,.45 TSSOP32,.56,20 TSSOP28,.53,22
Package shape RECTANGULAR - RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE - SMALL OUTLINE, THIN PROFILE - SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
page size 64 words - 64 words - 64 words 64 words 64 words 64 words
Parallel/Serial PARALLEL - PARALLEL - PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 225 - NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 3/5 V - 3/5 V - 3/5 V 3/5 V 3/5 V 3/5 V
Programming voltage 3 V - 3 V - 3 V 3 V 3 V 3 V
Certification status Not Qualified - Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 2.5 mm - 1.2 mm - 1.2 mm 2.5 mm 1.2 mm 1.2 mm
Maximum standby current 0.00002 A - 0.00002 A - 0.00002 A 0.00002 A 0.00002 A 0.00002 A
Maximum slew rate 0.03 mA - 0.03 mA - 0.03 mA 0.03 mA 0.03 mA 0.03 mA
Maximum supply voltage (Vsup) 5.5 V - 5.5 V - 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 2.7 V - 2.7 V - 2.7 V 2.7 V 2.7 V 2.7 V
Nominal supply voltage (Vsup) 3 V - 3 V - 3 V 3 V 3 V 3 V
surface mount YES - YES - YES YES YES YES
technology CMOS - CMOS - CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL - COMMERCIAL - COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form GULL WING - GULL WING - GULL WING GULL WING GULL WING GULL WING
Terminal pitch 1.27 mm - 0.55 mm - 0.5 mm 1.27 mm 0.5 mm 0.55 mm
Terminal location DUAL - DUAL - DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED - NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
switch bit YES - YES - YES YES YES YES
width 8.4 mm - 8 mm - 8 mm 8.4 mm 8 mm 8 mm
Maximum write cycle time (tWC) 10 ms - 10 ms - 10 ms 10 ms 10 ms 10 ms

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