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R8C/15: Description16-BIT SINGLE-CHIP MICROCOMPUTER M16C FAMILY / R8C/Tiny SERIES; File Size2MB，277 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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R8C/15 Overview

16-BIT SINGLE-CHIP MICROCOMPUTER M16C FAMILY / R8C/Tiny SERIES

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REJ09B0164-0210

R8C/14 Group, R8C/15 Group

Hardware Manual

RENESAS 16-BIT SINGLE-CHIP MICROCOMPUTER

M16C FAMILY / R8C/Tiny SERIES

All information contained in these materials, including products and product specifications,

represents information on the product at the time of publication and is subject to change by

Renesas Technology Corp. without notice. Please review the latest information published

by Renesas Technology Corp. through various means, including the Renesas Technology

Corp. website (http://www.renesas.com).

Rev.2.10

Revision Date:Jan 19, 2006

www.renesas.com

Keep safety first in your circuit designs!

Renesas Technology Corp. puts the maximum effort into making semiconductor products

better and more reliable, but there is always the possibility that trouble may occur with

them. Trouble with semiconductors may lead to personal injury, fire or property damage.

Remember to give due consideration to safety when making your circuit designs, with ap-

propriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of non-

flammable material or (iii) prevention against any malfunction or mishap.

Notes regarding these materials

These materials are intended as a reference to assist our customers in the selection of the

Renesas Technology Corp. product best suited to the customer's application; they do not

convey any license under any intellectual property rights, or any other rights, belonging to

Renesas Technology Corp. or a third party.

Renesas Technology Corp. assumes no responsibility for any damage, or infringement of

any third-party's rights, originating in the use of any product data, diagrams, charts, pro-

grams, algorithms, or circuit application examples contained in these materials.

All information contained in these materials, including product data, diagrams, charts, pro-

grams and algorithms represents information on products at the time of publication of these

materials, and are subject to change by Renesas Technology Corp. without notice due to

product improvements or other reasons. It is therefore recommended that customers con-

tact Renesas Technology Corp. or an authorized Renesas Technology Corp. product dis-

tributor for the latest product information before purchasing a product listed herein.

The information described here may contain technical inaccuracies or typographical errors.

Renesas Technology Corp. assumes no responsibility for any damage, liability, or other

loss rising from these inaccuracies or errors.

Please also pay attention to information published by Renesas Technology Corp. by vari-

ous means, including the Renesas Technology Corp. Semiconductor home page (http://

www.renesas.com).

When using any or all of the information contained in these materials, including product

data, diagrams, charts, programs, and algorithms, please be sure to evaluate all informa-

tion as a total system before making a final decision on the applicability of the information

and products. Renesas Technology Corp. assumes no responsibility for any damage, liabil-

ity or other loss resulting from the information contained herein.

Renesas Technology Corp. semiconductors are not designed or manufactured for use in a

device or system that is used under circumstances in which human life is potentially at

stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology

Corp. product distributor when considering the use of a product contained herein for any

specific purposes, such as apparatus or systems for transportation, vehicular, medical,

aerospace, nuclear, or undersea repeater use.

The prior written approval of Renesas Technology Corp. is necessary to reprint or repro-

duce in whole or in part these materials.

If these products or technologies are subject to the Japanese export control restrictions,

they must be exported under a license from the Japanese government and cannot be im-

ported into a country other than the approved destination.

Any diversion or reexport contrary to the export control laws and regulations of Japan and/

or the country of destination is prohibited.

Please contact Renesas Technology Corp. for further details on these materials or the

products contained therein.

Table of Contents

SFR Page Reference

Overview

1.1

1.2

1.3

1.4

1.5

1.6

B-1

Applications .................................................................................................1

Performance Overview................................................................................2

Block Diagram .............................................................................................4

Product Information .....................................................................................5

Pin Assignments..........................................................................................7

Pin Description ............................................................................................8

Central Processing Unit (CPU)

2.1

2.2

2.3

2.4

2.5

2.6

2.7

2.8

Data Registers (R0, R1, R2 and R3).........................................................11

Address Registers (A0 and A1).................................................................11

Frame Base Register (FB) ........................................................................11

Interrupt Table Register (INTB) .................................................................11

Program Counter (PC) ..............................................................................11

User Stack Pointer (USP) and Interrupt Stack Pointer (ISP).....................11

Static Base Register (SB)..........................................................................11

Flag Register (FLG)...................................................................................11

Carry Flag (C).....................................................................................11

Debug Flag (D) ...................................................................................11

Zero Flag (Z).......................................................................................11

Sign Flag (S).......................................................................................11

Overflow Flag (O) ...............................................................................11

Interrupt Enable Flag (I Flag)..............................................................12

Stack Pointer Select Flag (U Flag) .....................................................12

Processor Interrupt Priority Level (IPL) ..............................................12

Reserved Bit .......................................................................................12

2.8.1

2.8.2

2.8.3

2.8.4

2.8.5

2.8.6

2.8.7

2.8.8

2.8.9

2.8.10

Memory

3.1

3.2

R8C/14 Group ...........................................................................................13

R8C/15 Group ...........................................................................................14

A-1

R8C/15 Related Products

	R8C/15	R5F21142DSP	R8C/14	R8C14	R5F21142SP	R5F21143SP	R5F21144SP	R5F21144DSP	R5F21143DSP	R8C15
Description	16-BIT SINGLE-CHIP MICROCOMPUTER M16C FAMILY / R8C/Tiny SERIES	16-BIT SINGLE-CHIP MICROCOMPUTER M16C FAMILY / R8C/Tiny SERIES	16-BIT SINGLE-CHIP MICROCOMPUTER M16C FAMILY / R8C/Tiny SERIES	16-BIT SINGLE-CHIP MICROCOMPUTER M16C FAMILY / R8C/Tiny SERIES	16-BIT SINGLE-CHIP MICROCOMPUTER M16C FAMILY / R8C/Tiny SERIES	16-BIT SINGLE-CHIP MICROCOMPUTER M16C FAMILY / R8C/Tiny SERIES	16-BIT SINGLE-CHIP MICROCOMPUTER M16C FAMILY / R8C/Tiny SERIES	16-BIT SINGLE-CHIP MICROCOMPUTER M16C FAMILY / R8C/Tiny SERIES	16-BIT SINGLE-CHIP MICROCOMPUTER M16C FAMILY / R8C/Tiny SERIES	16-BIT SINGLE-CHIP MICROCOMPUTER M16C FAMILY / R8C/Tiny SERIES
Parts packaging code	-	SSOP	-	-	SSOP	SSOP	SSOP	SSOP	SSOP	-
package instruction	-	4.40 X 6.50 MM, 0.65 MM PITCH, PLASTIC, LSSOP-20	-	-	LSSOP, SSOP20,.25	LSSOP, SSOP20,.25	LSSOP, SSOP20,.25	4.40 X 6.50 MM, 0.65 MM PITCH, PLASTIC, LSSOP-20	4.40 X 6.50 MM, 0.65 MM PITCH, PLASTIC, LSSOP-20	-
Contacts	-	20	-	-	20	20	20	20	20	-
Reach Compliance Code	-	compli	-	-	compli	compli	unknow	compli	compli	-
Has ADC	-	YES	-	-	YES	YES	YES	YES	YES	-
Other features	-	ALSO OPERATES AT 2.7V MINIMUM SUPPLY	-	-	ALSO OPERATES AT 2.7V MINIMUM SUPPLY	ALSO OPERATES AT 2.7V MINIMUM SUPPLY	ALSO OPERATES AT 2.7V MINIMUM SUPPLY	ALSO OPERATES AT 2.7V MINIMUM SUPPLY	ALSO OPERATES AT 2.7V MINIMUM SUPPLY	-
bit size	-	16	-	-	16	16	16	16	16	-
maximum clock frequency	-	20 MHz	-	-	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz	-
DAC channel	-	NO	-	-	NO	NO	NO	NO	NO	-
DMA channel	-	NO	-	-	NO	NO	NO	NO	NO	-
JESD-30 code	-	R-PDSO-G20	-	-	R-PDSO-G20	R-PDSO-G20	R-PDSO-G20	R-PDSO-G20	R-PDSO-G20	-
length	-	6.5 mm	-	-	6.5 mm	6.5 mm	6.5 mm	6.5 mm	6.5 mm	-
Number of I/O lines	-	15	-	-	15	15	15	15	15	-
Number of terminals	-	20	-	-	20	20	20	20	20	-
Maximum operating temperature	-	85 °C	-	-	85 °C	85 °C	85 °C	85 °C	85 °C	-
Minimum operating temperature	-	-40 °C	-	-	-20 °C	-20 °C	-20 °C	-40 °C	-40 °C	-
PWM channel	-	NO	-	-	NO	NO	NO	NO	NO	-
Package body material	-	PLASTIC/EPOXY	-	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-
encapsulated code	-	LSSOP	-	-	LSSOP	LSSOP	LSSOP	LSSOP	LSSOP	-
Encapsulate equivalent code	-	SSOP20,.25	-	-	SSOP20,.25	SSOP20,.25	SSOP20,.25	SSOP20,.25	SSOP20,.25	-
Package shape	-	RECTANGULAR	-	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-
Package form	-	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	-	-	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	-
power supply	-	3/5 V	-	-	3/5 V	3/5 V	3/5 V	3/5 V	3/5 V	-
Certification status	-	Not Qualified	-	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-
RAM (bytes)	-	512	-	-	512	768	1024	1024	768	-
rom(word)	-	8192	-	-	8192	12288	16384	16384	12288	-
ROM programmability	-	FLASH	-	-	FLASH	FLASH	FLASH	FLASH	FLASH	-
Maximum seat height	-	1.45 mm	-	-	1.45 mm	1.45 mm	1.45 mm	1.45 mm	1.45 mm	-
speed	-	20 MHz	-	-	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz	-
Maximum slew rate	-	15 mA	-	-	15 mA	15 mA	15 mA	15 mA	15 mA	-
Maximum supply voltage	-	5.5 V	-	-	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	-
Minimum supply voltage	-	3 V	-	-	3 V	3 V	3 V	3 V	3 V	-
Nominal supply voltage	-	5 V	-	-	5 V	5 V	5 V	5 V	5 V	-
surface mount	-	YES	-	-	YES	YES	YES	YES	YES	-
technology	-	CMOS	-	-	CMOS	CMOS	CMOS	CMOS	CMOS	-
Temperature level	-	INDUSTRIAL	-	-	OTHER	OTHER	OTHER	INDUSTRIAL	INDUSTRIAL	-
Terminal form	-	GULL WING	-	-	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	-
Terminal pitch	-	0.65 mm	-	-	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm	-
Terminal location	-	DUAL	-	-	DUAL	DUAL	DUAL	DUAL	DUAL	-
width	-	4.4 mm	-	-	4.4 mm	4.4 mm	4.4 mm	4.4 mm	4.4 mm	-
uPs/uCs/peripheral integrated circuit type	-	MICROCONTROLLER	-	-	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	-

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