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HC6364/4XQHBC

Description
Standard SRAM, 8KX8, 55ns, CMOS, CDFP36, 0.630 X 0.630 INCH, CERAMIC, FP-36
Categorystorage    storage   
File Size690KB,16 Pages
ManufacturerHoneywell
Websitehttp://www.ssec.honeywell.com/
Download Datasheet Parametric View All

HC6364/4XQHBC Overview

Standard SRAM, 8KX8, 55ns, CMOS, CDFP36, 0.630 X 0.630 INCH, CERAMIC, FP-36

HC6364/4XQHBC Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
Parts packaging codeDFP
package instructionDFP, FL36,.6,25
Contacts36
Reach Compliance Codeunknown
ECCN code3A001.A.2.C
Maximum access time55 ns
I/O typeCOMMON
JESD-30 codeS-CDFP-F36
JESD-609 codee0
length16.002 mm
memory density65536 bit
Memory IC TypeSTANDARD SRAM
memory width8
Number of functions1
Number of ports1
Number of terminals36
word count8192 words
character code8000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize8KX8
Output characteristics3-STATE
ExportableYES
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeDFP
Encapsulate equivalent codeFL36,.6,25
Package shapeSQUARE
Package formFLATPACK
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Filter level38535Q/M;38534H;883B
Maximum seat height3.5052 mm
Maximum standby current0.0003 A
Minimum standby current2.5 V
Maximum slew rate0.008 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formFLAT
Terminal pitch0.635 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
total dose1M Rad(Si) V
width16.002 mm
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