ACS147D/SAMPLE-03 datasheet, PDF

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ACS147D/SAMPLE-03: DescriptionAC SERIES, 9-BIT ENCODER, CDIP16, SIDE BRAZED, CERAMIC, DIP-16; Categorylogic logic; File Size38KB，2 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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ACS147D/SAMPLE-03 Overview

AC SERIES, 9-BIT ENCODER, CDIP16, SIDE BRAZED, CERAMIC, DIP-16

ACS147D/SAMPLE-03 Parametric

Parameter Name	Attribute value
Parts packaging code	DIP
package instruction	DIP,
Contacts	16
Reach Compliance Code	unknown
series	AC
JESD-30 code	R-CDIP-T16
Logic integrated circuit type	ENCODER
Number of digits	9
Number of functions	1
Number of terminals	16
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
propagation delay (tpd)	17 ns
Certification status	Not Qualified
Maximum seat height	5.08 mm
surface mount	NO
technology	CMOS
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	7.62 mm
Base Number Matches	1

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ACS147MS

Data Sheet

July 1999

File Number

4761

Radiation Hardened 10-to-4 Line Priority

Encoder

These nine-input priority encoders accept data from nine

active LOW inputs and provide a binary representation on

the four active LOW outputs. A priority is assigned to each

input so that when two or more inputs are simultaneously

active, the input with the highest priority is represented on

the output. Input line I9 has the highest priority.

These devices provide the 10-to-4-line priority encoding

function by use of the implied decimal “zero”. The “zero” is

encoded when all nine data inputs are HIGH, forcing all four

outputs HIGH.

The ACS147MS is fabricated on a CMOS Silicon on

Sapphire (SOS) process, which provides an immunity to

Single Event Latch-up and the capability of highly reliable

performance in any radiation environment.

Speciﬁcations for Rad Hard QML devices are controlled

by the Defense Supply Center in Columbus (DSCC). The

SMD numbers listed below must be used when ordering.

Detailed Electrical Speciﬁcations for the ACS147MS are

contained in SMD 5962-98633. A “hot-link” is provided

on our homepage for downloading.

http://www.intersil.com/spacedefense/spaceselect.htm

Features

• QML Qualiﬁed Per MIL-PRF-38535 Requirements

• 1.25 Micron Radiation Hardened SOS CMOS

• Radiation Environment

- Latch-Up Free Under Any Conditions

- Total Dose (Max.) . . . . . . . . . . . . . . . . . 3 x 10

RAD(Si)

- SEU Immunity . . . . . . . . . . . . . <1 x 10

-10

Errors/Bit/Day

- SEU LET Threshold . . . . . . . . . . . . >100MeV/(mg/cm

)

• Input Logic Levels. . . . V

= (0.3)(V

), V

= (0.7)(V

)

• Output Current

. . . . . . . . . . . . . . . . . . . . . . . . . . ±12mA

(Min)

• Quiescent Supply Current . . . . . . . . . . . . . . . 20µA (Max)

• Propagation Delay . . . . . . . . . . . . . . . . . . . . . . 17ns (Max)

Applications

• High Speed Control Circuits

• Sensor Monitoring

• Low Power Designs

Ordering Information

ORDERING NUMBER

5962F9863301VCC

ACS147D/SAMPLE-03

5962F9863301VXC

ACS147K/SAMPLE-03

5962F9863301V9A

INTERNAL MARKETING

NUMBER

ACS147DMSR-03

ACS147D/SAMPLE-03

ACS147KMSR-03

ACS147K/SAMPLE-03

ACS147HMSR-03

TEMP. RANGE (

-55 to 125

PACKAGE

16 Ld SBDIP

16 Ld Flatpack

Die

DESIGNATOR

CDIP2-T16

CDFP4-F16

Pinouts

ACS147MS

(SBDIP)

TOP VIEW

I4 1

I5 2

I6 3

I7 4

I8 5

Y2 6

Y1 7

GND 8

16 V

15 NC

14 Y3

13 I3

12 I2

11 I1

10 I9

9 Y0

GND

ACS147MS

(FLATPACK)

TOP VIEW

CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.

ACS147D/SAMPLE-03 Related Products

	ACS147D/SAMPLE-03	ACS147K/SAMPLE-03
Description	AC SERIES, 9-BIT ENCODER, CDIP16, SIDE BRAZED, CERAMIC, DIP-16	AC SERIES, 9-BIT ENCODER, CDFP16, CERAMIC, DFP-16
Parts packaging code	DIP	DFP
package instruction	DIP,	DFP,
Contacts	16	16
Reach Compliance Code	unknown	unknown
series	AC	AC
JESD-30 code	R-CDIP-T16	R-CDFP-F16
Logic integrated circuit type	ENCODER	ENCODER
Number of digits	9	9
Number of functions	1	1
Number of terminals	16	16
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP	DFP
Package shape	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	FLATPACK
propagation delay (tpd)	17 ns	17 ns
Certification status	Not Qualified	Not Qualified
Maximum seat height	5.08 mm	2.92 mm
surface mount	NO	YES
technology	CMOS	CMOS
Terminal form	THROUGH-HOLE	FLAT
Terminal pitch	2.54 mm	1.27 mm
Terminal location	DUAL	DUAL
width	7.62 mm	6.73 mm
Base Number Matches	1	1

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