STATIC RAM
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Toshiba Semiconductor |
| Parts packaging code | DIP |
| package instruction | 0.600 INCH, PLASTIC, DIP-28 |
| Contacts | 28 |
| Reach Compliance Code | unknow |
| Maximum access time | 120 ns |
| JESD-30 code | R-PDIP-T28 |
| JESD-609 code | e0 |
| length | 37 mm |
| memory density | 262144 bi |
| Memory IC Type | STANDARD SRAM |
| memory width | 8 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 28 |
| word count | 32768 words |
| character code | 32000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 32KX8 |
| Output characteristics | 3-STATE |
| Exportable | YES |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | Not Qualified |
| Maximum seat height | 5.3 mm |
| Minimum standby current | 2 V |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 2.7 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | TIN LEAD |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 15.24 mm |
| TC55257DPI-70V | TC55257DPI-85V | |
|---|---|---|
| Description | STATIC RAM | STATIC RAM |
| Is it Rohs certified? | incompatible | incompatible |
| Maker | Toshiba Semiconductor | Toshiba Semiconductor |
| Parts packaging code | DIP | DIP |
| package instruction | 0.600 INCH, PLASTIC, DIP-28 | DIP, |
| Contacts | 28 | 28 |
| Reach Compliance Code | unknow | unknow |
| Maximum access time | 120 ns | 150 ns |
| JESD-30 code | R-PDIP-T28 | R-PDIP-T28 |
| JESD-609 code | e0 | e0 |
| length | 37 mm | 37 mm |
| memory density | 262144 bi | 262144 bi |
| Memory IC Type | STANDARD SRAM | STANDARD SRAM |
| memory width | 8 | 8 |
| Number of functions | 1 | 1 |
| Number of ports | 1 | 1 |
| Number of terminals | 28 | 28 |
| word count | 32768 words | 32768 words |
| character code | 32000 | 32000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C |
| organize | 32KX8 | 32KX8 |
| Output characteristics | 3-STATE | 3-STATE |
| Exportable | YES | YES |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE |
| Parallel/Serial | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED |
| Certification status | Not Qualified | Not Qualified |
| Maximum seat height | 5.3 mm | 5.3 mm |
| Minimum standby current | 2 V | 2 V |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 2.7 V | 2.7 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V |
| surface mount | NO | NO |
| technology | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | TIN LEAD | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED |
| width | 15.24 mm | 15.24 mm |