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KM641003AJI-12

Description
Standard SRAM, 256KX4, 12ns, CMOS, PDSO32
Categorystorage    storage   
File Size455KB,9 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
Download Datasheet Parametric Compare View All

KM641003AJI-12 Overview

Standard SRAM, 256KX4, 12ns, CMOS, PDSO32

KM641003AJI-12 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
package instructionSOJ, SOJ32,.44
Reach Compliance Codeunknown
Maximum access time12 ns
I/O typeCOMMON
JESD-30 codeR-PDSO-J32
JESD-609 codee0
memory density1048576 bit
Memory IC TypeSTANDARD SRAM
memory width4
Humidity sensitivity level3
Number of terminals32
word count262144 words
character code256000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize256KX4
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeSOJ
Encapsulate equivalent codeSOJ32,.44
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
power supply5 V
Certification statusNot Qualified
Maximum standby current0.008 A
Minimum standby current4.5 V
Maximum slew rate0.15 mA
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperature40
Base Number Matches1

KM641003AJI-12 Related Products

KM641003AJI-12 KM641003AJI-15 KM641003ATI-15 KM641003ATI-17 KM641003ATI-20 KM641003AJI-20 KM641003ATI-12 KM641003AJI-17
Description Standard SRAM, 256KX4, 12ns, CMOS, PDSO32 Standard SRAM, 256KX4, 15ns, CMOS, PDSO32 Standard SRAM, 256KX4, 15ns, CMOS, PDSO32 Standard SRAM, 256KX4, 17ns, CMOS, PDSO32 Standard SRAM, 256KX4, 20ns, CMOS, PDSO32 Standard SRAM, 256KX4, 20ns, CMOS, PDSO32 Standard SRAM, 256KX4, 12ns, CMOS, PDSO32 Standard SRAM, 256KX4, 17ns, CMOS, PDSO32
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
package instruction SOJ, SOJ32,.44 SOJ, SOJ32,.44 TSOP, TSOP32,.46 TSOP, TSOP32,.46 TSOP, TSOP32,.46 SOJ, SOJ32,.44 TSOP, TSOP32,.46 SOJ, SOJ32,.44
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown
Maximum access time 12 ns 15 ns 15 ns 17 ns 20 ns 20 ns 12 ns 17 ns
I/O type COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-PDSO-J32 R-PDSO-J32 R-PDSO-G32 R-PDSO-G32 R-PDSO-G32 R-PDSO-J32 R-PDSO-G32 R-PDSO-J32
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0
memory density 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width 4 4 4 4 4 4 4 4
Humidity sensitivity level 3 3 3 3 3 3 3 3
Number of terminals 32 32 32 32 32 32 32 32
word count 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words
character code 256000 256000 256000 256000 256000 256000 256000 256000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
organize 256KX4 256KX4 256KX4 256KX4 256KX4 256KX4 256KX4 256KX4
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOJ SOJ TSOP TSOP TSOP SOJ TSOP SOJ
Encapsulate equivalent code SOJ32,.44 SOJ32,.44 TSOP32,.46 TSOP32,.46 TSOP32,.46 SOJ32,.44 TSOP32,.46 SOJ32,.44
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 260 260 260 260 260 260 260 260
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum standby current 0.008 A 0.008 A 0.008 A 0.008 A 0.008 A 0.008 A 0.008 A 0.008 A
Minimum standby current 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Maximum slew rate 0.15 mA 0.145 mA 0.145 mA 0.145 mA 0.14 mA 0.14 mA 0.15 mA 0.145 mA
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form J BEND J BEND GULL WING GULL WING GULL WING J BEND GULL WING J BEND
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature 40 40 40 40 40 40 40 40
Base Number Matches 1 1 1 1 1 - - -
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