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SMBJ5925B

Description
Zener Diode, 10V V(Z), 5%, 1.5W, Silicon, Unidirectional, DO-214AA, PLASTIC, SMB, 2 PIN
CategoryDiscrete semiconductor    diode   
File Size120KB,4 Pages
ManufacturerMicro Commercial Components (MCC)
Download Datasheet Parametric View All

SMBJ5925B Overview

Zener Diode, 10V V(Z), 5%, 1.5W, Silicon, Unidirectional, DO-214AA, PLASTIC, SMB, 2 PIN

SMBJ5925B Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Parts packaging codeDO-214AA
package instructionR-PDSO-C2
Contacts2
Reach Compliance Codecompliant
ECCN codeEAR99
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
JEDEC-95 codeDO-214AA
JESD-30 codeR-PDSO-C2
JESD-609 codee0
Number of components1
Number of terminals2
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)240
polarityUNIDIRECTIONAL
Maximum power dissipation1.5 W
Certification statusNot Qualified
Nominal reference voltage10 V
surface mountYES
technologyZENER
Terminal surfaceTIN LEAD
Terminal formC BEND
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
Maximum voltage tolerance5%
Working test current37.5 mA
Base Number Matches1
MCC
TM
Micro Commercial Components
  omponents
20736 Marilla Street Chatsworth

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SMBJ5913B
THRU
SMBJ5942B
1.5 Watt
Surface Mount
Silicon
Zener Diodes
DO-214AA
(SMB) (LEAD FRAME)
Features
Surface M ount Application
3.3
thru
51
Volt Voltage Range
Low Inductance,Low Profile Mounting
Glass Passivated Junction
Available on Tape and Reel
Mechanical Data
CASE: JEDEC DO-214AA molded Surface Mountable
Terminals solderable per MIL-STD-750, Method 2026
Polarity is indicated by cathode band.
Packaging: Standard 12mm Tape (see EIA 481)
Maximum temperature for soldering: 260 C for 10 seconds.
o
A
Case Material: Molded Plastic.
Classification Rating 94V-0
UL Flammability
B
Maximum Ratings @ 25
o
C Unless Otherwise Specified
Output
I
F
200mA
Current
Maximum
V
F
1.5V
(Note: 1)
Forward
Voltage
P
(AV)
Steady State
1.5W
(Note: 2)
Power
Dissipation
Operation And
T
J
, T
STG
-55
o
C to
Storage
+150
o
C
Temperature
C
F
D
H
G
E
DIMENSIONS
INCHES
MIN
.160
.130
.006
.030
.200
.079
.075
.002
MM
MIN
4.06
3.30
0.15
0.76
5.08
2.00
1.91
0.05
DIM
A
B
C
D
E
F
G
H
MAX
.185
.155
.012
.060
.220
.096
.087
.008
MAX
4.70
3.94
0.31
1
..52
5.59
2.44
2.21
0.203
NOTE
NOTES:
1.
2.
Forward Current @ 200mA.
Mounted on 5.0mm (.013mm thick) Iand areas.
Lead temperature at T
L
=75 C
o
2
SUGGESTED SOLDER
PAD LAYOUT
0.106"
0.083”
0.050”
Revision:
7
www.mccsemi.com
1 of 4
2007/02/15

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