
Clock Generator, 50MHz, CMOS, 1.24 X 0.80 MM, DIE-6
| Parameter Name | Attribute value |
| Is it Rohs certified? | conform to |
| Parts packaging code | DIE |
| package instruction | DIE, |
| Contacts | 6 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| JESD-30 code | R-XUUC-N6 |
| JESD-609 code | e6 |
| Number of terminals | 6 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Maximum output clock frequency | 50 MHz |
| Package body material | UNSPECIFIED |
| encapsulated code | DIE |
| Package shape | RECTANGULAR |
| Package form | UNCASED CHIP |
| Peak Reflow Temperature (Celsius) | 260 |
| Master clock/crystal nominal frequency | 50 MHz |
| Certification status | Not Qualified |
| Maximum slew rate | 10 mA |
| Maximum supply voltage | 6 V |
| Minimum supply voltage | 3 V |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | TIN BISMUTH |
| Terminal form | NO LEAD |
| Terminal location | UPPER |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| uPs/uCs/peripheral integrated circuit type | CLOCK GENERATOR, OTHER |
| Base Number Matches | 1 |
| NJU6324LC | NJU6324ME | NJU6324UC | NJU6324UE | NJU6324MC | NJU6324NC | NJU6324NE | NJU6324LE | |
|---|---|---|---|---|---|---|---|---|
| Description | Clock Generator, 50MHz, CMOS, 1.24 X 0.80 MM, DIE-6 | Clock Generator, 25MHz, CMOS, PDSO8, EMP-8 | Clock Generator, 6.25MHz, CMOS, 1.24 X 0.80 MM, DIE-6 | Clock Generator, 6.25MHz, CMOS, PDSO8, EMP-8 | Clock Generator, 25MHz, CMOS, 1.24 X 0.80 MM, DIE-6 | Clock Generator, 12.5MHz, CMOS, 1.24 X 0.80 MM, DIE-6 | Clock Generator, 12.5MHz, CMOS, PDSO8, EMP-8 | Clock Generator, 50MHz, CMOS, PDSO8, EMP-8 |
| Is it Rohs certified? | conform to | conform to | conform to | conform to | conform to | conform to | conform to | conform to |
| Parts packaging code | DIE | SOIC | DIE | SOIC | DIE | DIE | SOIC | SOIC |
| package instruction | DIE, | SOP, | DIE, | SOP, | DIE, | DIE, | SOP, | SOP, |
| Contacts | 6 | 8 | 6 | 8 | 6 | 6 | 8 | 8 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| JESD-30 code | R-XUUC-N6 | R-PDSO-G8 | R-XUUC-N6 | R-PDSO-G8 | R-XUUC-N6 | R-XUUC-N6 | R-PDSO-G8 | R-PDSO-G8 |
| JESD-609 code | e6 | e6 | e6 | e6 | e6 | e6 | e6 | e6 |
| Number of terminals | 6 | 8 | 6 | 8 | 6 | 6 | 8 | 8 |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| Maximum output clock frequency | 50 MHz | 25 MHz | 6.25 MHz | 6.25 MHz | 25 MHz | 12.5 MHz | 12.5 MHz | 50 MHz |
| Package body material | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIE | SOP | DIE | SOP | DIE | DIE | SOP | SOP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | UNCASED CHIP | SMALL OUTLINE | UNCASED CHIP | SMALL OUTLINE | UNCASED CHIP | UNCASED CHIP | SMALL OUTLINE | SMALL OUTLINE |
| Peak Reflow Temperature (Celsius) | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
| Master clock/crystal nominal frequency | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum slew rate | 10 mA | 10 mA | 10 mA | 10 mA | 10 mA | 10 mA | 10 mA | 10 mA |
| Maximum supply voltage | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V |
| Minimum supply voltage | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | TIN BISMUTH | TIN BISMUTH | TIN BISMUTH | TIN BISMUTH | TIN BISMUTH | TIN BISMUTH | TIN BISMUTH | TIN BISMUTH |
| Terminal form | NO LEAD | GULL WING | NO LEAD | GULL WING | NO LEAD | NO LEAD | GULL WING | GULL WING |
| Terminal location | UPPER | DUAL | UPPER | DUAL | UPPER | UPPER | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| uPs/uCs/peripheral integrated circuit type | CLOCK GENERATOR, OTHER | CLOCK GENERATOR, OTHER | CLOCK GENERATOR, OTHER | CLOCK GENERATOR, OTHER | CLOCK GENERATOR, OTHER | CLOCK GENERATOR, OTHER | CLOCK GENERATOR, OTHER | CLOCK GENERATOR, OTHER |
| Is it lead-free? | - | Lead free | Lead free | Lead free | Lead free | Lead free | Lead free | Lead free |
| Maker | - | - | New Japan Radio Co., Ltd.. | New Japan Radio Co., Ltd.. | New Japan Radio Co., Ltd.. | New Japan Radio Co., Ltd.. | New Japan Radio Co., Ltd.. | New Japan Radio Co., Ltd.. |